Effects of gate electrodes and barrier heights on the breakdown characteristics and Weibull slopes of HfO/sub 2/ MOS devices

Author(s):  
Y.H. Kim ◽  
R. Choi ◽  
R. Jha ◽  
J.H. Lee ◽  
V. Misra ◽  
...  
2001 ◽  
Vol 670 ◽  
Author(s):  
Igor Polishchuk ◽  
Pushkar Ranade ◽  
Tsu-Jae King ◽  
Chenming Hu

ABSTRACTIn this paper we propose a new metal-gate CMOS technology that uses a combination of two metals to achieve a low threshold voltage for both n- and p-MOSFET's. One of the gate electrodes is formed by metal interdiffusion so that no metal has to be etched away from the gate dielectric surface. Consequently, this process does not compromise the integrity and electrical reliability of the gate dielectric. This new technology is demonstrated for the Ti-Ni metal combination that produces gate electrodes with 3.9 eV and 5.3 eV work functions for n-MOS and p-MOS devices respectively.


2006 ◽  
Vol 16 (01) ◽  
pp. 105-114
Author(s):  
NICOLA BARIN ◽  
CLAUDIO FIEGNA ◽  
ENRICO SANGIORGI

Ultra-thin body Double Gate MOS structures with strained silicon are investigated by solving the 1-D Schrödinger and Poisson equations, with open boundaries conditions on the wave functions in the gate electrodes. The electrostatics of this device architecture and its dependence on the amount of strain and on the thickness of the silicon layer is analyzed in terms of subband structure, subband population, carrier distribution within the strained-silicon layer, charge-voltage characteristics and gate tunneling current.


2006 ◽  
Vol 27 (3) ◽  
pp. 148-150 ◽  
Author(s):  
Chin-Lung Cheng ◽  
Kuei-Shu Chang-Liao ◽  
Tzu-Chen Wang ◽  
Tien-Ko Wang ◽  
Howard Chih-Hao Wang

2009 ◽  
Vol 30 (9) ◽  
pp. 925-927 ◽  
Author(s):  
M.E. Grubbs ◽  
M. Deal ◽  
Y. Nishi ◽  
B.M. Clemens

1991 ◽  
Vol 219 ◽  
Author(s):  
D. R. Lee ◽  
C. H. Bjorkman ◽  
C. Wang ◽  
G. Lucovsky

ABSTRACTCurrent-voltage voltage characteristics of heterojunctions formed by remote plasma enhanced chemical vapor deposition (PECVD) of heavily doped μc-Si onto doped c-Si have been studied, as well as capacitance-voltage characteristics of MOS capacitor structures using heavily doped remote PECVD μc-Si and a-Si films as gate electrodes on thermally oxidized crystalline Si. Shifts in the flat-band voltages of MOS devices using the μc-Si and a-Si as gate electrodes relative to that of a reference Al/SiO2/c-Si structure are measured and explained in terms of a band structure model for the μc-Si and a-Si. Rectification and a photovoltaic effect observed in the pn heterojunctions are also explained in context of the same model.


MRS Advances ◽  
2017 ◽  
Vol 2 (02) ◽  
pp. 103-108 ◽  
Author(s):  
Yanbin An ◽  
Aniruddh Shekhawat ◽  
Ashkan Behnam ◽  
Eric Pop ◽  
Ant Ural

ABSTRACT We fabricate and characterize metal-oxide-semiconductor (MOS) devices with graphene as the gate electrode, 5 or 10 nm thick silicon dioxide as the insulator, and silicon as the semiconductor substrate. We find that Fowler-Nordheim tunneling dominates the gate current for the 10 nm oxide device. We also study the temperature dependence of the tunneling current in these devices in the range 77 to 300 K and extract the effective tunneling barrier height as a function of temperature for the 10 nm oxide device. Furthermore, by performing high frequency capacitance-voltage measurements, we observe a local capacitance minimum under accumulation, particularly for the 5 nm oxide device. By fitting the data using numerical simulations based on the modified density of states of graphene in the presence of charged impurities, we show that this local minimum results from the quantum capacitance of graphene. These results provide important insights for the heterogeneous integration of graphene into conventional silicon technology.


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