The Dynamic Current Distribution of a Multi-Fingered GGNMOS Under High Current Stress and HBMESD Events

2006 ◽  
Author(s):  
Jian-hsing Lee ◽  
Kuo-ming Wu ◽  
Shao-chang Huang ◽  
Chin-hsin Tang
Keyword(s):  
Current Distribution ◽  
High Current ◽  
Current Stress

The Study on LED Accelerated Life Testes and Failure Mechanism

2013 ◽  
Vol 462-463 ◽  
pp. 678-682
Author(s):  
Yue Zong Zhang ◽  
Chun Xia Li ◽  
Wen Bin Zhang
Keyword(s):  
Active Region ◽  
Failure Mechanism ◽  
High Power ◽  
Light Emitting Diode ◽  
Characteristic Curve ◽  
Optical Parameter ◽  
Thermal Parameter ◽  
High Current ◽  
Current Stress ◽  
High Power Led

The paper is studied on the performances of low power light-emitting diode and high power LED under high-current. After observing and measuring the degeneration of them, the Analysis of the failure mechanism is given. The degenerations of the optical parameter, electronic parameter and thermal parameter of high power LED under 600mA current stress are measured and the failure mechanism is analyzed. The I-V characteristic curve proves that the degeneration is happened in active region. Under high-current stress, the active region of high power LED is ageing which leads to much more defects. The degenerations of pins on the resin package, metal wire and surface layer metal pads are found with scanning electron microscope.

Thermal and Electrical Transport in Carbon Nanofiber Interconnects

2008 ◽  
Author(s):  
Tsutomu Saito ◽  
Hirohiko Kitsuki ◽  
Makoto Suzuki ◽  
Toshishige Yamada ◽  
Drazen Fabris ◽  
...  
Keyword(s):  
Heat Transport ◽  
Carbon Nanofibers ◽  
Joule Heating ◽  
Current Density ◽  
Electrical Transport ◽  
Heat Dissipation ◽  
Carbon Nanofiber ◽  
Transport Model ◽  
High Current ◽  
Current Stress

We study reliability of carbon nanofibers (CNFs) under high-current stress by examining CNF breakdown on four different configurations, suspended or supported, with/without tungsten deposition. The suspended results are consistently explained with a heat transport model taking into account Joule heating and heat dissipation along the CNF, while supported cases show a consistently larger current density just before breakdown, reflecting effective heat dissipation to the substrate.

Percolative approach for failure time prediction of thin film interconnects under high current stress

2005 ◽  
Vol 45 (2) ◽  
pp. 391-395 ◽  
Author(s):  
E. Misra ◽  
Md M. Islam ◽  
Mahbub Hasan ◽  
H.C. Kim ◽  
T.L. Alford
Keyword(s):  
Thin Film ◽  
Failure Time ◽  
High Current ◽  
Current Stress ◽  
Time Prediction

Reducing disturbance of crack location on crack depth-sensing tag

Sensor Review ◽  
2019 ◽  
Vol 39 (4) ◽  
pp. 449-455
Author(s):  
Yawei Xu ◽  
Lihong Dong ◽  
Haidou Wang ◽  
Yuelan Di ◽  
Xiaozhu Xie ◽  
...  
Keyword(s):  
Current Distribution ◽  
Current Density ◽  
High Current Density ◽  
Crack Depth ◽  
High Current ◽  
Depth Sensing ◽  
Coverage Area ◽  
Content Type ◽  
Crack Location ◽  
Density Area

Purpose Crack sensor based on RFID tag has become a research hotspot in the field of metal structural health monitoring for its significant benefit of passive wireless transmission. While in practice, crack location will impact the performance of crack depth-sensing tag. The purpose of this paper is to provide a method for reducing disturbance of crack location on crack depth-sensing tag. Design/methodology/approach The effect analysis of crack location on crack depth-sensing tag is presented first to find disturbance reason and disturbance law. On the basis of that, a miniaturized tag is proposed to improve the current distribution and reduce the disturbance introduced by crack location. Findings The degree of crack location disturbance is closely related to the current distribution in the coverage area of tag. Because sensing tag performs better when crack locates in the high current density area, miniaturization of sensing tag is exploited to expand the high current density area and make the area more symmetrical. The simulated and experimental results demonstrate that tag miniaturization can enhance the performance of crack depth-sensing tag. Originality/value This paper provides a method to enhance the performance of crack depth-sensing tag.

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