A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions

2009 ◽  
Vol 32 (2) ◽  
pp. 283-292 ◽  
Author(s):  
Haiyu Qi ◽  
Michael Osterman ◽  
Michael Pecht
Keyword(s):  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints ◽  
Loading Conditions ◽  
Vibration Loading ◽  
Prediction Approach

Comparison of fatigue life prediction methods for solder joints under random vibration loading

2019 ◽  
Vol 95 ◽  
pp. 58-64 ◽  
Author(s):  
Jiang Xia ◽  
Lin Yang ◽  
Qunxing Liu ◽  
Qi Peng ◽  
LanXian Cheng ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Random Vibration ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Prediction Methods ◽  
Vibration Loading

Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

2020 ◽  
Vol 37 (4) ◽  
pp. 165-171
Author(s):  
Dongbo Li ◽  
Jianpei Wang ◽  
Bing Yang ◽  
Yongle Hu ◽  
Ping Yang
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Load Spectrum ◽  
Thermal Reliability ◽  
Joint Stress ◽  
Content Type ◽  
Fatigue Characteristics

Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided. Design/methodology/approach The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions. Findings The solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring. Originality/value This paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.

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