Investigation of Carbon Nanotube-Based Through-Silicon Vias for PDN Applications

2018 ◽  
Vol 60 (3) ◽  
pp. 738-746 ◽  
Author(s):  
Jing Jin ◽  
Wen-Sheng Zhao ◽  
Da-Wei Wang ◽  
Hong-Sheng Chen ◽  
Er-Ping Li ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Through Silicon Vias ◽  
Silicon Vias

Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs

2020 ◽  
Vol 19 ◽  
pp. 492-499 ◽  
Author(s):  
Wen-Sheng Zhao ◽  
Qing-Hao Hu ◽  
Kai Fu ◽  
Yuan-Yuan Zhang ◽  
Da-Wei Wang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Through Silicon Vias ◽  
Silicon Vias

Development of Carbon Nanotube Based Through-Silicon Vias

2010 ◽  
Vol 1 (2) ◽  
Author(s):  
Bruce C. Kim ◽  
Sukeshwar Kannan ◽  
Anurag Gupta ◽  
Falah Mohammed ◽  
Byoungchul Ahn
Keyword(s):  
Carbon Nanotubes ◽  
Carbon Nanotube ◽  
High Performance ◽  
Integrated Systems ◽  
High Resistivity ◽  
Filler Materials ◽  
Through Silicon Vias ◽  
Single Walled Carbon Nanotube ◽  
Materials Used ◽  
Silicon Vias

The design and development of reliable 3D integrated systems require high performance interconnects, which in turn are largely dependent on the choice of filler materials used in through-silicon vias (TSVs). Copper, tungsten, and poly-silicon have been explored as filler materials; however, issues such as thermal incompatibility, electromigration, and high resistivity are still a bottleneck. In this paper, we investigate single-walled carbon nanotube (CNT) bundles as a prospective filler material for TSVs and have provided an analysis of CNT based TSVs for package and chip interconnects. The interconnects are fundamental bottlenecks to achieving high performance and reliability. We have provided electrical modeling and performed simulations on TSVs with copper and carbon nanotubes. The results from the CNT based TSVs were greatly superior to those from the conventional vias with copper.

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

2012 ◽  
Vol 33 (3) ◽  
pp. 420-422 ◽  
Author(s):  
Teng Wang ◽  
Si Chen ◽  
Di Jiang ◽  
Yifeng Fu ◽  
Kjell Jeppson ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Through Silicon Vias ◽  
Carbon Nanotube Forests ◽  
Silicon Vias

High-Frequency Analysis of Cu-Carbon Nanotube Composite Through-Silicon Vias

2016 ◽  
Vol 15 (3) ◽  
pp. 506-511 ◽  
Author(s):  
Wen-Sheng Zhao ◽  
Jie Zheng ◽  
Yue Hu ◽  
Shilei Sun ◽  
Gaofeng Wang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Frequency Analysis ◽  
High Frequency ◽  
Through Silicon Vias ◽  
Carbon Nanotube Composite ◽  
Silicon Vias
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