Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

2000 ◽  
Vol 123 (3) ◽  
pp. 189-195 ◽  
Author(s):  
Koichiro Take ◽  
Ralph L. Webb
Keyword(s):  
Heat Pipe ◽  
Thermal Contact ◽  
Heat Pipes ◽  
Passive Cooling ◽  
Test Results ◽  
Air Flow Rate ◽  
Heat Spreader ◽  
Plate Heat ◽  
Cooling Method ◽  
Notebook Computers

The air flow rate available for cooling of notebook computers is very limited. Thus, notebook computer manufacturers desire a “passive” cooling method. Heat pipes are typically used to transport the heat from the CPU to a forced convection, air-cooled condenser. This paper describes a passive, keyboard sized aluminum Integrated Plate Heat Pipe (IP-HP) that has been developed for notebook computers. Analysis was performed to estimate the several thermal resistances in the heat pipe, including the effect of the vapor pressure drop. The modified design using a heat spreader at the evaporator significantly reduces the heat pipe resistance. Further work was done to evaluate the thermal contact resistance at the IP-HP/CPU interface. Test results show that the IP-HP can reject 18 W while maintaining the CPU 65°C above ambient temperature.

Innovative Configurations of Large Scale Heat Pipes

2005 ◽  
Author(s):  
Jessica Sheehan ◽  
Donald Jordan ◽  
Douglas T. Queheillalt ◽  
Pamela M. Norris
Keyword(s):  
Heat Pipe ◽  
Large Scale ◽  
Heat Pipes ◽  
Heat Spreader ◽  
Pipe System ◽  
Pipe Systems

A large-scale heat pipe is one of many possible solutions to the modern day problem of quickly dissipating high amounts of concentrated heat. While heat pipes are a proven technology, little research has been directed at large-scale heat pipe systems. Two configurations of large-scale heat pipes are investigated in this study. The two configurations examined were a 2’ × 2’ heat spreader plate (a type of heat pipe) and an innovative heat pipe system that combines traditional heat pipes and heat spreader plates. The heat spreader plate, when tested, quickly becomes isothermal and works as a traditional heat pipe. This demonstrates the ability of this large-scale heat pipe configuration to work effectively to spread out high amounts of deposited heat. The experimentation on the innovative heat pipe system gave similar results, showing that the configuration works as a traditional heat pipe.

Thermal Performance of a Thin Flat Plate Heat Pipe

2009 ◽  
Author(s):  
Wei Qu ◽  
Shijuan Li ◽  
Hongwu Yang
Keyword(s):  
Thermal Conductivity ◽  
Flat Plate ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Tilt Angle ◽  
Test Results ◽  
Test Setup ◽  
Plate Heat ◽  
Flat Plate Heat Pipe ◽  
Performance Results

A thin flat plate heat pipe (TFPHP) with a new structure of wick is fabricated and tested. The wick is formed by the narrow foils folded, the liquid passage and capillary force is provided by the folded clearance of the foils, the vapor passage is shaped by the periodic holes of the foils. One aluminum TFPHP of 260×60×4 mm3 size is made and the test setup is established. The test results show that the spreader has good performance as, at the horizontal state, the power transferred can reach 18.5W, the corresponding thermal conductivity is 838W/(m·°C). For different tilt angle, we have the performance results. The effects of parameters to the performance are discussed. The spreader is significant for the spreading of point power.

scholarly journals Numerical Investigation on Heat Pipe Spanwise Spacing to Determine Optimum Configuration for Passive Cooling of Photovoltaic Panels

Energies ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4635
Author(s):  
Samiya Aamir Al-Mabsali ◽  
Hassam Nasarullah Chaudhry ◽  
Mehreen Saleem Gul
Keyword(s):  
Heat Pipe ◽  
Heat Pipes ◽  
Passive Cooling ◽  
Photovoltaic Panel ◽  
Photovoltaic Panels ◽  
Optimum Configuration ◽  
Renewable Power ◽  
Cooling Mechanism ◽  
Computational Fluid Dynamics Cfd ◽  
Set Up

The uncertainty regarding the capacity of photovoltaics to generate adequate renewable power remains problematic due to very high temperatures in countries experiencing extreme climates. This study analyses the potential of heat pipes as a passive cooling mechanism for solar photovoltaic panels in the Ecohouse of the Higher Colleges of Technology, Oman, using computational fluid dynamics (CFD). A baseline model has been set-up comprised of 20 units, 20 mm diameter water-filled heat pipes, with a length of 992 mm attached to a photovoltaic panel measuring 1956 mm × 992 mm. Using the source temperature of 64.5 °C (337.65 K), the findings of this work have established that a temperature reduction in the range of up to 9 °C is achievable when integrating heat pipes into photovoltaic panels. An optimum spacing of 50 mm (2.5 times the diameter of the heat pipe) was determined through this work, which is also a proof-of-concept towards the use of heat pipe technology for passive cooling of photovoltaic panels in hot climates.

Hot Spot Elimination by Thin and Smart Heat Spreader

2015 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Masataka Mochizuki ◽  
Koichi Mashiko
Keyword(s):  
Heat Pipe ◽  
Hot Spot ◽  
Electronic Devices ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Metal Plate ◽  
Confined Space ◽  
Heat Spreader ◽  
Clock Speed ◽  
Wick Structure

Heat pipes are recognized as an excellent heat transport devices and extensively investigated for applications in electronic cooling. Different types of heat pipes have been developed such as micro/miniature heat pipes, loop heat pipes and so on, and these heat pipes have been widely applied in the field of electronics cooling such as notebook, desktop, data center; as well as aerospace, industrial cooling field. However, in recent years the application of heat pipe is widening to the filed of hand held mobile electronic devices such as smart phone, tablet pc, digital camera etc. With the development in technology these devices have different user friendly functions and capabilities, which requires the highest processor clock speed. In general, high clock speed of processor generates lot of heat which need to be spread or removed to eliminate the hot spot. It becomes a challenging task to cool such electronic devices as mentioned above with a very confined space and concentrated heat sources. Regarding to this challenge, ultra thin flat heat pipe is developed; this newly developed heat pipe consists of a special fiber wick structure which can ensure vapor spaces on the two sides of the wick structure. In this paper a novel thin spreader is proposed to eliminate the hot spot; generally the proposed heat spreader consists of 0.20mm thick metal plate and ultra thin heat pipe of 0.40mm thickness soldered in its body. Maximum thickness of this spreader is 0.63mm. Metal plate is 60mm × 110mm in size; and the ultra thin heat pipe can be fabricated from different original diameter ranges from 2.0mm to 3.0mm Cu tube. Theoretical and experimental analysis have been done to evaluate this thin spreader. In addition, some real application of this spreader will be introduced in this paper.

scholarly journals Heat Pipe as a Passive Cooling System Driving New Generation of Nuclear Power Plants

2021 ◽  
pp. 30-38
Author(s):  
Ziba Zibandeh Nezam ◽  
Bahman Zohuri
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Nuclear Power ◽  
Power Plants ◽  
Cooling System ◽  
Heat Pipes ◽  
Passive Cooling ◽  
Nuclear Power Reactor ◽  
Pipe System ◽  
New Generation

The technology of the Heat Pipe (HP) system is very well known for scientists and engineers working in the field of thermal-hydraulic since its invention at Las Alamos Nation Laboratory around the 1960s time frame. It is a passive heat transfer/heat exchanger system that comes in the form of either a constant or variable system without any mechanical built-in moving part. This passive heat transfer system and its augmentation within the core of nuclear power reactors have been proposed in the past few decades. The sodium, potassium, or mercury type heat pipe system using any of these three elements for the cooling system has been considered by many manufacturers of fission reactors and recently fusion reactors particularly Magnetic Confinement Fusion (MCF). Integration of the heat pipes as passive cooling can be seen in a new generation of a nuclear power reactor system that is designed for unconventional application field such as a space-based vehicle for deep space or galaxy exploration, planetary surface-based power plants as well as operation in remote areas on Earth. With the new generation of Small Modular Reactor (SMR) in form of Nuclear Micro Reactors (NMR), this type of fission reactor has integrated Alkali metal heat pipes to a series of Stirling convertors or thermoelectric converters for power generation that would generate anywhere from 13kwt to 3Mwt thermal of power for the energy conversion system.

scholarly journals Passive Cooling Solutions for High Power Server CPUs with Pulsating Heat Pipe Technology: Review

2021 ◽  
Vol 9 ◽  
Author(s):  
Chenxi Li ◽  
Ji Li
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Data Centers ◽  
Heat Dissipation ◽  
Waste Heat ◽  
Smart Cities ◽  
Heat Pipes ◽  
Passive Cooling ◽  
Pulsating Heat Pipe ◽  
Compact Structure

Data centers are becoming more powerful and more integrated with the continuous development of smart cities, which brings us more technological convenience, but also generates a large amount of waste heat. At present, the efficient and green cooling scheme is one of the key researches and development points to ensure the stable and safe operation of power electronic devices and achieve energy saving and consumption reduction. As a branch of the heat pipe, the pulsating heat pipe is one of most promising passive cooling techniques among many candidates for its unique advantages such as small size, simple and compact structure, and high heat dissipation efficiency, but its application in data centers just begins, and there are few reports on research and implementation. Based on the introduction of the basic structure, working mechanism and outstanding advantages of pulsating heat pipes, this paper reviews in detail the researches on the factors affecting its performance, so as to evaluate the possibility of using pulsating heat pipes in data centers. Finally, the latest application and development of pulsating heat pipes applied to heat dissipation of high-power CPUs are summarized, which can provide a guidance for subsequent research and engineering application.

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

2011 ◽  
Author(s):  
Ahmad Jalilvand ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yoji Kawahara ◽  
Vijit Wuttijumnong ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Performance Test ◽  
Acoustic Noise ◽  
Test Results ◽  
Cooling Device ◽  
Heat Spreader ◽  
Cooling Fan ◽  
Thermal Solution ◽  
New Type ◽  
Cooling Module

A high-density and slim-type packaging technology in a notebook PC or a handheld PC has been developed as the importance of portability is increased more and more recently. The heat generated in small-sized electronic units should be dissipated effectively for operational stability during system lifetime. Considering the technical trend for miniaturized packaging of components, which requires very limited space, installed in the system; it is inevitable to develop and apply a micro-cooling device. In the present study, a very thin cooling device which operates on the basis of piezoelectricity has been introduced. First, the operation principal of Piezo fan is explained and then this new type of Piezo fan is introduced. Performance test results on thin laptop thermal solution module combined with this new Piezo fan is investigated. The original thermal solution module was composed of thin heat spreader (1 mm thick) and thin heat pipe (less than 2 mm) with finned heat sink at the condenser cooled by mini cooling fan (brushless mini fan). The mini fan is replaced by this new type of much thinner Piezo fan and then performance is studied and the results are compared with thin cooling module when cooled by mini cooling fan. In addition, this work consists of various developments that have been conducted to improve the performance of this Piezo fan that includes enhancement of cooling performance and reduction of acoustic noise.

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