Elasto-Plastic Analysis of the Peel Test for Thin Film Adhesion

1988 ◽  
Vol 110 (3) ◽  
pp. 266-273 ◽  
Author(s):  
Kyung-Suk Kim ◽  
Junglhl Kim
Keyword(s):  
Fracture Toughness ◽  
Interfacial Crack ◽  
Peel Test ◽  
Interfacial Fracture ◽  
Peel Strength ◽  
Interfacial Fracture Toughness ◽  
Cu Films ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Elastoplastic Bending

Analyses have been made to extract the objective interfacial fracture toughness from the peel strength of very thin metallic films. An elastoplastic bending model of the adherend film has been employed in the analyses applying the fracture mechanics concept of steady-state interfacial crack growth. The analytic result finally shown is a universal peel diagram where the objective interfacial fracture toughness is readily readable when the peel strength is known. Experimental results for Cu films on Si and polyimide substrate systems with a Cr interface are also presented.

Mechanics of the Peel Test for Thin Film Adhesion

1988 ◽  
Vol 119 ◽  
Author(s):  
K-S. Kim
Keyword(s):  
Thin Film ◽  
Integral Equation ◽  
Peel Test ◽  
Peel Strength ◽  
Metallic Films ◽  
Interface Toughness ◽  
Film Adhesion ◽  
Expenditure Rate ◽  
Thin Film Adhesion ◽  
Peel Tests

AbstractThe mechanics aspects of the peel test are analyzed. In this analysis, the limitation and applicability of the peel test for thin film adhesion have been investigated. Firstly, the effect of plasticity in the peel test of thin metallic films is analyzed. The analysis has given a closed form solution for the partitioning of peel strength between the energy expenditure rate for the decohesion process and the internal work expenditure rate caused by plastic deformation (bending) of the film. The results predicted the variation of peel strength as a function of the film thickness, the film yield stress and the compliance of the substrate. This analysis shows that the peel strength is very sensitive to the thickness of the film and the yield stress of the film. As observed in the experiment, the peel strength has a peak value at a certain thickness of the film. This is explained for both L and T peel tests. Unlike the L peel test, the peak phenomenon in the T peel test (of metallic films) is due to the hardening of the adhered film. Secondly, the effect of plasticity and viscoelasticity in the peel test of thin polymer films is analyzed. Unlike the peel test of metallic films, tension and shear effect of the film deformation is very important in the analysis of the polymer peel test. An integral equation is formulated for the viscoelastic models of the adhered film. The solution of the integral equation reveals the important parameters in polymer peeling and their contribution to the peel force as well as to the viscoelastic dissipation. In addition, the meaning of the interface toughness is reexamined and the interface toughness is evaluated by the peel test. Based on these analyses, a Universal Peel Diagram has been constructed, which accounts for the hardening behavior of the film. On this diagram, objective interfacial decohesion toughness can be readily obtained using very simple peel tests. The analysis includes not only the 900° peel test but also the general angle peel test. Comparison between the theory and experiment has been made with the experimental data provided by J. Kim of IBM. The comparison shows good agreement.

scholarly journals Solutions and Discussions of thin film Undergoing the Nonlinear Peeling

2003 ◽  
Vol 795 ◽  
Author(s):  
Yueguang Wei ◽  
Siqi Shu ◽  
Ying Du LNM
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Effective Strain ◽  
Slope Angle ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Element Analysis ◽  
Von Mises

ABSTRACTBased on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

2005 ◽  
Author(s):  
Jiantao Zheng ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Critical Energy ◽  
Test Method ◽  
Interfacial Fracture Toughness ◽  
Critical Energy Release Rate ◽  
Nano Scale ◽  
Thin Film Adhesion ◽  
Single Strip

A new test method, Single-Strip Decohesion Test (SSDT), has been developed and used to measure the interfacial fracture toughness of nano-scale thin film on substrate. This fixtureless test employs a stress-engineered superlayer deposited on patterned titanium (Ti) film strips to supply the energy for the delamination from a thick silicon (Si) substrate. The amount of energy available for delamination propagation is varied by fabricating an etchable thin release layer of varying width between the film strips and the substrate. By designing a decreasing area of the release layer, it is possible to arrest the delamination at a given location, and the interfacial fracture toughness or critical energy release rate can be found at the location where the delamination ceases to propagate. Common IC fabrication techniques are used to prepare the sample and execute the test, thereby making the test compatible with current microelectronic or MEMS facilities and suitable for in process measurement of thin film adhesion strength. The methodology presented in this paper is generic in nature, and can be used to measure the process-dependent interfacial fracture toughness of various micro-scale and nano-scale thin film interfaces. Ti thin film with thickness ranging from 5nm to 100nm can be studied using this method.

Numerical Analysis of Three-Dimensional Semi-Elliptical Interfacial Cracks Subjected to Indentation Load

2014 ◽  
Vol 627 ◽  
pp. 289-292 ◽  
Author(s):  
N. Kurihara ◽  
Masayuki Arai
Keyword(s):  
Fracture Toughness ◽  
Three Dimensional ◽  
Analytical Formula ◽  
Interfacial Crack ◽  
Indentation Test ◽  
Interfacial Fracture ◽  
Indentation Load ◽  
J Integral ◽  
Interfacial Fracture Toughness ◽  
Interfacial Cracks

The aim of this study is to show elastic J-integral needed to evaluate the interfacial fracture toughness of bi-material in indentation test. Three dimensional J-integrals along the crack front tip in semi-elliptical crack lying on the interface were analyzed using domain integral technique installed in commercialized finite element code MARC. The J-integral was calculated under several kind of aspect ratio of semi-elliptical cracks. In order to have to evaluate the interfacial fracture toughness from interfacial crack length and indentation load obtained in indentation tests, the analytical formula for two dimensional interfacial crack J-integral under plane stress, which had been introduced by J. R. Rice and G. C. Sih, was modified in reflecting upon the three dimensional effect. Finally, the indentation test was conducted for Aluminum alloy/ PMMA combination sample, and the associated fracture toughness was evaluated.Fig.1 Schematic illustration of indentation testFig.2 Schematic illustration of analysis mode

scholarly journals Evaluation of the Interfacial Fracture Toughness of Anodic Bonds

2007 ◽  
Vol 73 (735) ◽  
pp. 1266-1272 ◽  
Author(s):  
Yoshiaki NOMURA ◽  
Masaki NAGAI ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness

scholarly journals Evaluation of Interfacial Fracture Toughness and Interfacial Shear Strength of Typha Spp. Fiber/Polymer Composite by Double Shear Test Method

Materials ◽  
2019 ◽  
Vol 12 (14) ◽  
pp. 2225 ◽  
Author(s):  
Ikramullah ◽  
Samsul Rizal ◽  
Yoshikazu Nakai ◽  
Daiki Shiozawa ◽  
H.P.S. Abdul Khalil ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Shear Strength ◽  
Interfacial Shear Strength ◽  
Epoxy Composite ◽  
Interfacial Fracture ◽  
Interfacial Shear ◽  
Composite Model ◽  
Interfacial Fracture Toughness ◽  
Double Shear ◽  
The Matrix

The aim of this paper is to evaluate the Mode II interfacial fracture toughness and interfacial shear strength of Typha spp. fiber/PLLA and Typha spp. fiber/epoxy composite by using a double shear stress method with 3 fibers model composite. The surface condition of the fiber and crack propagation at the interface between the fiber and the matrix are observed by scanning electron microscope (SEM). Alkali treatment on Typha spp. fiber can make the fiber surface coarser, thus increasing the value of interfacial fracture toughness and interfacial shear strength. Typha spp. fiber/epoxy has a higher interfacial fracture value than that of Typha spp. fiber/PLLA. Interfacial fracture toughness on Typha spp. fiber/PLLA and Typha spp. fiber/epoxy composite model specimens were influenced by the matrix length, fiber spacing, fiber diameter and bonding area. Furthermore, the interfacial fracture toughness and the interfacial fracture shear stress of the composite model increased with the increasing duration of the surface treatment.

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