Numerical Investigation of EHD Conduction Pumping of Liquid Film With Phase-Change

2007 ◽  
Author(s):  
Miad Yazdani ◽  
Jamal Seyed-Yagoobi
Keyword(s):  
Heat Transfer ◽  
Liquid Film ◽  
Phase Change ◽  
Flow System ◽  
Thin Liquid Film ◽  
Finite Thickness ◽  
Constant Heat Flux ◽  
Two Dimensional ◽  
Enhanced Heat Transfer ◽  
Constant Heat

Electrohydrodynamic (EHD) conduction pumping is associated with the heterocharge layers of finite thickness in the vicinity of the electrodes, generated by the process of dissociation of the neutral electrolytic species and recombination of the generated ions. This paper numerically investigates the EHD conduction pumping of a thin liquid film in the presence of phase change. The flow system comprises a liquid film flowing over a two-dimensional flat plate while the vapor phase extended far beyond the interface to result in almost motionless vapor. The channel is separated into four different sections: the entrance, electrode, evaporation, and downstream sections. The entrance, electrode and downstream regions are adiabatic while a constant heat flux is applied in the evaporation side. The concept of EHD conduction pumping of liquid film in the presence of phase change is demonstrated in this paper. The enhanced heat transfer due to conduction pumping is evaluated.

Numerical Investigation of Electrohydrodynamic-Conduction Pumping of Liquid Film in the Presence of Evaporation

2008 ◽  
Vol 131 (1) ◽  
Author(s):  
Miad Yazdani ◽  
Jamal Seyed-Yagoobi
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Liquid Film ◽  
Transfer Coefficient ◽  
Flat Plate ◽  
Flow System ◽  
Finite Thickness ◽  
Constant Heat Flux ◽  
Considerable Improvement ◽  
Constant Heat

Electrohydrodynamic (EHD) conduction pumping is associated with the heterocharge layers of finite thickness in the vicinity of the electrodes, generated by the process of dissociation of the neutral electrolytic species and the recombination of the generated ions. This paper numerically investigates the EHD-conduction pumping of a liquid film in the presence of evaporation. The flow system comprises a liquid film flowing over a two-dimensional flat plate. The vapor phase above the flat plate is extended far beyond the interface. The channel is separated into four different sections: the entrance, electrode, evaporation, and downstream sections. The entrance, electrode, and downstream regions are adiabatic while a constant heat flux is applied in the evaporation section. The concept of EHD-conduction pumping of liquid film in the presence of phase change is numerically demonstrated in this paper. The resultant heat transfer due to conduction pumping is evaluated as well. The results for heat transfer coefficient along the channel indicate considerable improvement of heat transfer coefficient compared with the pressure-driven counterpart.

Liquid Film Evaporation in the Presence of Micro Encapsulated Phase Change Materials: A Numerical Study

2013 ◽  
Author(s):  
Yasmin Khakpour ◽  
Jamal Seyed-Yagoobi
Keyword(s):  
Heat Transfer ◽  
Liquid Film ◽  
Phase Change ◽  
Phase Change Materials ◽  
Numerical Study ◽  
Finite Thickness ◽  
Operating Conditions ◽  
Evaporation Process ◽  
Constant Wall Temperature ◽  
Film Evaporation

This paper numerically investigates the flow and heat transfer characteristics of a slurry of micro encapsulated phase change materials (MEPCM) and R134a in the presence of film evaporation. The numerical domain is comprised of a minichannel in contact with a finite thickness solid zone with constant wall temperature. During the evaporation process, the concentration of MEPCM in the slurry increases, resulting in a continuous variation of effective thermal properties of the slurry. The effect of PCM concentration on the evolution of the liquid film thickness under different operating conditions along with the variation of the local heat transfer coefficients has been studied. A user defined function has been developed to incorporate the evaporation process by introducing the mass and energy source terms for the evaporation process as well as the variation of the MEPCM concentration along the channel.

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

2015 ◽  
Author(s):  
Zhenhai Pan ◽  
Justin A. Weibel ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Liquid Film ◽  
Phase Change ◽  
Volume Fraction ◽  
Flow Boiling ◽  
Thin Liquid Film ◽  
Cost Effective ◽  
Source Terms ◽  
Time Step ◽  
Two Phase

High-fidelity simulation of flow boiling in microchannels remains a challenging problem, but the increasing interest in applications of microscale two-phase transport highlight its importance. In this paper, a volume of fluid (VOF)-based flow boiling model is proposed with computational expense-saving features that enable cost-effective simulation of two-phase flow and heat transfer in realistic geometries. The vapor and liquid phases are distinguished using a color function which represents the local volume fraction of the tracked phase. Mass conservation is satisfied by solving the transport equations for both phases with a finite-volume approach. In order to predict phase change at the liquid-vapor interface, evaporative heat and mass source terms are calculated using a novel, saturated-interface-volume phase change model that fixes the interface at the saturation temperature at each time step to achieve stability. Numerical oscillation of the evaporation source terms is thus eliminated and a non-iterative time advancement scheme can be adopted to reduce computational cost. The reference frame is set to move with the vapor slug to artificially increase the local velocity magnitude in the thin liquid film region in the relative frame, which reduces the influence of numerical errors resulting from calculation of the surface tension force, and thus suppresses the development of spurious currents. This allows use of non-uniform meshes that can efficiently resolve high-aspect-ratio geometries and flow features and significantly reduces the overall numerical expense. The proposed model is used to simulate the growth of a vapor bubble in a heated 2D axisymmetric microchannel. The bubble motion, bubble growth rate, liquid film thickness, and local heat transfer coefficient along the wall are compared against previous numerical studies.

Effect of Hydraulic Jump on Hydrodynamics and Heat Transfer in a Thin Liquid Film Flowing Over a Rotating Disk Analyzed by Integral Method

2006 ◽  
Vol 129 (5) ◽  
pp. 657-663 ◽  
Author(s):  
S. Basu ◽  
B. M. Cetegen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Liquid Film ◽  
Hydraulic Jump ◽  
Thin Liquid Film ◽  
Rotating Disk ◽  
Disk Surface ◽  
Constant Heat Flux ◽  
Heat Transfer Analysis ◽  
Scaling Analysis

Flow and heat transfer in a liquid film flowing over the surface of a rotating disk was analyzed by integral technique. The integral analysis includes the prediction of the hydraulic jump and its effects on heat transfer. The results of this analysis are compared to the earlier results that did not include this effect. At low inlet Reynolds numbers and high Rossby numbers, corresponding to low film inertia and low rotation rates, respectively, a hydraulic jump appears on the disk surface. The location of the jump and the liquid film height at this location are predicted. A scaling analysis of the equations governing the film thickness provided a semi-empirical expression for these quantities that was found to be in very good agreement with numerical results. Heat transfer analysis shows that the Nusselt numbers for both constant disk surface temperature and constant disk surface heat flux boundary conditions are lowered in the vicinity of the hydraulic jump due to the thickened liquid film. This effect can be more pronounced for the constant heat flux case depending on the location of the hydraulic jump. The Nusselt number exhibits a turning point at the jump location and can have higher values downstream of the hydraulic jump compared to those obtained from the analysis that does not include the gravitational effects.

Heat transfer in a phase change material under constant heat flux

2019 ◽  
Vol 26 (3) ◽  
pp. 313-324
Author(s):  
M. I. Nizovtsev ◽  
V. Yu. Borodulin ◽  
V. N. Letushko ◽  
V. I. Terekhov ◽  
V. A. Poluboyarov ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Phase Change Material ◽  
Constant Heat Flux ◽  
Constant Heat ◽  
Change Material
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