Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

2004 ◽  
Author(s):  
Y. Pang ◽  
E. Scott ◽  
J. D. van Wyk ◽  
Z. Liang
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Three Dimensional ◽  
The Other ◽  
Other Hand ◽  
3D Packaging ◽  
3D Package

With the growing demands on the performance, cost, and advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging. On the other hand, thermal management of the 3D package becomes a very important issue. This paper assesses the various possibilities of integrated thermal management for integrated power electronics modules (IPEMs).

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

2015 ◽  
Author(s):  
Ah-Young Park ◽  
S. B. Park
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Thermal Loading ◽  
Three Dimensional ◽  
Design Guidelines ◽  
Element Analysis ◽  
Design Guideline ◽  
Management Perspective ◽  
3D Packaging ◽  
3D Package

Three-dimensional (3D) packaging technology is directly related to the increasing I/O number as stacking chips. This technology has the potential to produce integrated circuits with a much better combination of cost, functionality, performance and power consumption. However, stacked chips raise several thermal issues that need to be addressed and eliminated. In this study, a quantitative study of the conventional solder-based interconnection is conducted based on many different cases of thermal loading, using finite element analysis (FEA). This preliminary study clearly shows limitation of the solder-based interconnection in the thermal management perspective. Underfill for microbμmp acts as a barrier of heat transfer in the conventional 3D stacked chip packages. Therefore, as an alternative, Cu-to-Cu direct bonding (CuDB), which has a better thermal conductivity, is proposed. Its parametric study is performed under the same/different loading conditions and dimensions. This study helps to highlight the thermal behavior of 3D packages consisting of various interconnections. Finally, based on the results, we can propose qualitative design guidelines of 3D packaging depending on various environment and conditions.

A Liberating Experience. On Becoming a Work of Art

2020 ◽  
Vol 7 (2) ◽  
pp. 411-430
Author(s):  
Maja Tabea Jerrentrup
Keyword(s):  
Three Dimensional ◽  
The Body ◽  
The Other ◽  
Work Of Art ◽  
Other Hand ◽  
Film Clips ◽  
Long Time ◽  
The One ◽  
Body Painting ◽  
Dimensional Surface

Abstract The art of bodypainting that is fairly unknown to a wider public turns the body into a canvas - it is a frequently used phrase in the field of bodypainting that illustrates the challenge it faces: it uses a three-dimensional surface and has to cope with its irregularities, but also with the model’s abilities and characteristics. This paper looks at individuals who are turned into art by bodypainting. Although body painting can be very challenging for them - they have to expose their bodies and to stand still for a long time while getting transformed - models report that they enjoy both the process and the result, even if they are not confident about their own bodies. Among the reasons there are physical aspects like the sensual enjoyment, but also the feeling of being part of something artistic. This is enhanced and preserved through double staging - becoming a threedimentional work of art and then being staged for photography or film clips. This process gives the model the chance to experience their own body in a detached way. On the one hand, bodypainting closely relates to the body and on the other hand, it can help to over-come the body.

Heat Conduction in Three Dimensional Stacked Packages

2005 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Heat Conduction ◽  
Thermal Management ◽  
Heat Generation ◽  
Analytical Study ◽  
Three Dimensional ◽  
The Other ◽  
Heat Generation Rate ◽  
Potential Applications ◽  
Steady State Heat ◽  
Spatially Varying

This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of such domains may be considered in the current study. The thermal conductivity and thickness of these domains may be different. The entire geometry composed of these connected domains is considered as adiabatic on the lateral surfaces and can be subjected to uniform convective cooling at one end. The other end of the geometry may be adiabatic and a specified, spatially varying heat generation rate can be applied in each of the domains. The solutions are found to be in agreement with known solutions for simpler geometries. The analytical solution presented here is very general in that it takes into account the interface resistances between the layers. One application of this analytical study relates to the thermal management of a 3-D stack of devices and interconnect layers. Another possible application is to the study of hotspots in a chip stack with non uniform heat generation. Many other potential applications may also be simulated.

On the infinite cluster of Bernoulli bond percolation in Scherk's graph

2001 ◽  
Vol 38 (04) ◽  
pp. 828-840
Author(s):  
Dayue Chen
Keyword(s):  
Three Dimensional ◽  
The Other ◽  
Bond Percolation ◽  
Infinite Cluster ◽  
Dimensional Lattice ◽  
Supercritical Region ◽  
Other Hand

Scherk's graph is a subgraph of the three-dimensional lattice. It was shown by Markvorsen, McGuinness and Thomassen (1992) that Scherk's graph is transient. Consider the Bernoulli bond percolation in Scherk's graph. We prove that the infinite cluster is transient for p > ½ and is recurrent for p < ½. This implies the well-known result of Grimmett, Kesten and Zhang (1993) on the transience of the infinite cluster of the Bernoulli bond percolation in the three-dimensional lattice for p > ½. On the other hand, Scherk's graph exhibits a new dichotomy in the supercritical region.

Development of Haptic-Enabled Virtual Reality Applications for Engineering, Medicine and Art

2015 ◽  
Author(s):  
Hugo I. Medellín-Castillo ◽  
Germánico González-Badillo ◽  
Eder Govea ◽  
Raquel Espinosa-Castañeda ◽  
Enrique Gallegos
Keyword(s):  
Virtual Reality ◽  
Virtual Environment ◽  
Force Feedback ◽  
Research Work ◽  
Three Dimensional ◽  
Haptic Device ◽  
The Other ◽  
Virtual Objects ◽  
Other Hand ◽  
And Training

The technological growth in the last years have conducted to the development of virtual reality (VR) systems able to immerse the user into a three-dimensional (3D) virtual environment where the user can interact in real time with virtual objects. This interaction is mainly based on visualizing the virtual environment and objects. However, with the recent beginning of haptic systems, the interaction with the virtual world has been extended to also feel, touch and manipulate virtual objects. Virtual reality has been successfully used in the development of applications in different scientific areas ranging from basic sciences, social science, education and entertainment. On the other hand, the use of haptics has increased in the last decade in domains from sciences and engineering to art and entertainment. Despite many developments, there is still relatively little knowledge about the confluence of software, enabling hardware, visual and haptic representations, to enable the conditions that best provide for an immersive sensory environment to convey information about a particular subject domain. In this paper, the state of the art of the research work regarding virtual reality and haptic technologies carried out by the authors in the last years is presented. The aim is to evidence the potential use of these technologies to develop usable systems for analysis and simulation in different areas of knowledge. The development of three different systems in the areas of engineering, medicine and art is presented. In the area of engineering, a system for the planning, evaluation and training of assembly and manufacturing tasks has been developed. The system, named as HAMS (Haptic Assembly and Manufacturing System), is able to simulate assembly tasks of complex components with force feedback provided by the haptic device. On the other hand, in the area of medicine, a surgical simulator for planning and training orthognathic surgeries has been developed. The system, named as VOSS (Virtual Osteotomy Simulator System), allows the realization of virtual osteotomies with force feedback. Finally, in the area of art, an interactive cinema system for blind people has been developed. The system is able to play a 3D virtual movie for the blind user to listen to and touch by means of the haptic device. The development of these applications and the results obtained from these developments are presented and discussed in this paper.

Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

2005 ◽  
Author(s):  
Ying Feng Pang ◽  
Elaine P. Scott ◽  
Zhenxian Liang ◽  
J. D. van Wyk
Keyword(s):  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Three Dimensional ◽  
Management Approach ◽  
Air Cooling ◽  
Thermal Tests ◽  
Heat Spreaders ◽  
Embedded Power

The objective of this work is to quantify the advantages of using double-sided cooling as the thermal management approach for the integrated power electronics modules. To study the potential advantage of the Embedded Power packaging method for the double-sided cooling, experiments were conducted. Three different cases were studied. To eliminate the effect of the heat sink on either side of the module, no heat sink was used in all three cases. The thermal tests were conducted such that the integrated power electronics modules were placed in the middle of flowing air in an insulated wind tunnel. Modules without additional top DBC, with additional top DBC, and with additional top DBC as well as heat spreaders on both sides were tested under the same condition. A common parameter, junction-to-ambient thermal resistance, was used to compare the thermal performance of these three cases. Despite the shortcoming of this parameter in describing the three-dimensional heat flow within the integrated power electronics modules, the concept of the thermal resistance is still worthwhile for evaluating various cooling methods for the module. The results show that increasing the top surface area can help in transferring the heat from the heat source to the ambient through the top side of the module. Consequently, the ability to handle higher power loss can also be increased. In summary, the Embedded Power technology provides an opportunity for implementing double-sided cooling as thermal management approach compared to modules with wire-bonded interconnects for the multichips.

scholarly journals The Third Dimention in a Landscape

Secreta Artis ◽  
2021 ◽  
pp. 74-82
Author(s):  
Daria Vladimirovna Fomicheva
Keyword(s):  
Land Surface ◽  
Dimensional Space ◽  
Three Dimensional ◽  
The Other ◽  
Landscape Painting ◽  
The Third ◽  
Soviet Art ◽  
Other Hand ◽  
Third Dimension ◽  
Three Dimensional Space

The present study examines the principles of conveying the third dimension in landscape painting. The author analyzes the recommendations provided in J. Littlejohns’ manual entitled “The Composition of a Landscape” [London, 1931]. J. Littlejohns describes four methods of showing depth in a landscape painting, each illustrated with pictorial composition schemes: 1) portrayal of long roads, which allows one to unveil the plasticity of the land surface; 2) creation of a “route” for the viewer by means of a well-thought-out arrangement of natural landforms; 3) introduction of vertically and horizontally flowing streams of water on different picture planes; 4) depiction of cloud shadows on a distinctly hilly landscape. The author of the article compares the schemes contained in the manual of J. Littlejohns with the works of G. G. Nissky, which enables readers to comprehend and reflect on the compositions of the masterpieces created by a prominent figure in Soviet art; on the other hand, Nissky’s landscape paintings open for a deeper understanding of the meaning and effectiveness of the methods proposed by J. Littlejohns. The outlined composition techniques are certainly relevant for contemporary artists (painters, graphic artists, animators, designers, etc.) as they make it possible to achieve the plastic expressiveness of a three-dimensional space in a twodimensional image.

scholarly journals Recycling Pictures as Attract Point to Youngster in Campus Program Promotion

2018 ◽  
pp. 78-85
Author(s):  
Kartika Kusuma Wardani ◽  
Hertina Susandari ◽  
Anggra Ayu Rucitra ◽  
Arya Weny Anggraita
Keyword(s):  
Three Dimensional ◽  
The Other ◽  
Educational Institutions ◽  
Visual Effect ◽  
Moving Image ◽  
Other Hand ◽  
Complex Process ◽  
Photo Documentation ◽  
Short Time

Educational institutions need promotion tools to attract their segmentation. Promotion medium is used to increase awareness so that the youngster know about information and are interested to register themselves. A medium that has ability to show campus program in short time both attract them is using video. Video is a combination of moving image, sound, visual effect and has complex process to reach best visualization. On the other hand, sometimes the institution only has collection of documentation in photography format. The problem is how to use photo documentation to become short attractive video that shows whole institution programs. Final execution to recycle collection of pictures is using parallax style. This creation of style changes the photos to be more lifelike, which move with three dimensional cinematic effect.

Valenciennes and Banqueting Hall: Theatre Research in Three and Four Dimensions

1981 ◽  
Vol 22 (2) ◽  
pp. 161-170
Author(s):  
Robert K. Sarlós
Keyword(s):  
Three Dimensional ◽  
The Other ◽  
Four Dimensions ◽  
Personal Involvement ◽  
Other Hand ◽  
Hand Performance ◽  
Dimensional Models ◽  
Three Dimensional Models ◽  
And Performance

In a recent essay I argued for broader acceptance of two methods for understanding “past styles of performance”—the building of three dimensional models and the staging of four dimensional performance reconstructions. These alternatives to the traditional narrative essay make greater use of theatrical imagination, and aim at raising new kinds of questions rather than answering the old kind. However, lack of appropriate apparatus has prevented widespread use of these forms. Since performances are by nature “short-lived phenomena” and can be recorded but fragmentarily, unique methods are required for their study. Theoretical reconstructions cannot approximate the physical and psychological ambience of a respectable performance essay. On the other hand, performance reconstructions do not allow for scholarly caveat during presentation, or for lacunae where knowledge is lacking. Therefore I see the promise of a rich harvest in two-way stimulation between theoretical and performance essays. A pair of reports, based on personal involvement in the types of projects I advocate, follows.

A Primer on Tables and Figures

1983 ◽  
Vol 13 (1) ◽  
pp. 33-55 ◽  
Author(s):  
Alan G. Gross
Keyword(s):  
Science And Technology ◽  
Three Dimensional ◽  
The Other ◽  
Semantic Gap ◽  
Complex Data ◽  
Mutual Dependence ◽  
Other Hand ◽  
Communication Of Science ◽  
The One ◽  
Point Line

Tables and figures arc an integral part of the medium of communication of science and technology. An analysis of tables and figures, relying heavily on Euclidean terms (point, line and plane) explains something of their power–their ability to display with clarity large amounts of data, complex data relationships, and intricate three-dimensional configurations. Analysis also clarifies the mutual dependence of tables and figures and their accompanying texts. Additionally, analysis makes clear the semantic gap between tables and graphs, on the one hand, and illustrations, on the other. All are equally vital strategies in scientific and technical discourse. However, tables and graphs are paralinguistic extensions of scientific and technical dialects; illustrations, on the other hand, are a nonlinguistic supplement to these dialects. Finally, analysis provides clues for the teaching of proper graphic choice, good graphic ‘grammar,’ and the appropriate contextualization of graphs.

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