Heat Transfer in Thermal Lattice Boltzmann Equation Method

2012 ◽  
Author(s):  
Like Li ◽  
Renwei Mei ◽  
James F. Klausner
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boltzmann Equation ◽  
Lattice Boltzmann ◽  
Heat Fluxes ◽  
Total Heat ◽  
Lattice Boltzmann Equation ◽  
Thermal Flow ◽  
Total Heat Transfer ◽  
Curved Boundaries

The evaluation of the boundary heat flux and total heat transfer in the lattice Boltzmann equation (LBE) simulations is investigated. The boundary heat fluxes in the discrete velocity directions of the thermal LBE (TLBE) model are obtained directly from the temperature distribution functions at the lattice nodes. With the rectangular lattice uniformly spaced the effective surface area for the discrete heat flux is the unit spacing distance, thus the heat flux integration becomes simply a summation of all the discrete heat fluxes with constant surface areas. The present method for the evaluation of total heat transfer is very efficient and robust for curved boundaries because it does not require the determination of the normal heat flux on the boundary and the surface area. To validate its applicability and accuracy, several numerical tests with analytical solutions are conducted, including 2-dimensional (2D) steady thermal flow in a channel, 1-D transient heat conduction in an inclined semi-infinite solid, 2-D transient conduction inside a circle, and 3-D steady thermal flow in a circular pipe. For straight boundaries perpendicular to one of the discrete velocity vectors, the total heat transfer is second-order accurate. For curved boundaries only first-order accuracy is obtained for the total heat transfer due to the irregularly distributed lattice fractions cut by the curved boundary.

scholarly journals Thermal analysis in thin-film fluid regions of rectangular microgroove

2018 ◽  
Vol 22 (2) ◽  
pp. 899-897
Author(s):  
Xiaohong Gui ◽  
Xiange Song ◽  
Baisheng Nie
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Contact Angle ◽  
Film Thickness ◽  
Flux Distribution ◽  
Total Heat ◽  
Heat Flux Distribution ◽  
Total Heat Transfer ◽  
Thin Film Thickness

The effects of contact angle and superheat on thin-film thickness and heat flux distribution occurring in a rectangle microgroove are numerically simulated. Accordingly, physical, and mathematical models are built in detail. Numerical results indicate that meniscus radius and thin-film thickness increase with the improvement of contact angle. The heat flux distribution in the thin-film region increases non-linearly as the contact angle decreases. The total heat transfer through the thin-film region increases with the improvement of superheat, and decreases as the contact angle increases. When the contact angle is equal to zero, the heat transfer in the thin-film region accounts for more than 80% of the total heat transfer. Intensive evaporation in the thin-film region plays a key role in heat transfer for the rectangle capillary microgroove. The liquid with higher wetting performance is more capable of playing the advantages of higher intensity heat transfer in thin- film region. The current investigation will result in a better understanding of thin- -film evaporation and its effect on the effective thermal conductivity in the rectangle microgroove.

The RC Analogy Provides a Versatile Computational Tool for Unsteady, Unidirectional Heat Conduction in Regular Solid Bodies Cooled by Adjoining Fluids

2003 ◽  
Vol 31 (3) ◽  
pp. 233-244
Author(s):  
Antonio Campo ◽  
Francisco Alhama
Keyword(s):  
Heat Transfer ◽  
Initial Conditions ◽  
Simulation Method ◽  
Heat Fluxes ◽  
Total Heat ◽  
Time Dependent ◽  
Total Heat Transfer ◽  
Transfer Rates ◽  
Electric Circuits ◽  
Spatio Temporal

Evaluation of spatio-temporal temperatures and total heat transfer rates in simple bodies (large plate, long cylinder and sphere) has been traditionally explained in undergraduate courses of heat transfer by the Heisler/Gröber or by the Boelter/Gröber charts. These three charts pose some restrictions with respect to the applicable times. Additionally, the charts do not provide information about the time-dependent heat fluxes at the surface. Conversely, evaluation of spatio-temporal temperatures, time-dependent heat fluxes at the surface and total heat transfer rates can be easily done for the entire time domain with the network simulation method (NSM) in conjunction with the commercial code PSPICE. NSM relies on the existing physical analogy between the unsteady transport of electric current and the unsteady transport of unidirectional heat by conduction. This analogy has been named the RC analogy in the specialized literature. The code PSPICE simulates the electric circuits for a specific body together with the imposed boundary and initial conditions, and produces numerical results for the quantities of interest, such as: the spatio-temporal temperature distributions; the time-dependent heat flux distributions at the surface; and the total heat transfer.

Analytical Solutions of Heat Transfer and Film Thickness in Thin-Film Evaporation

2013 ◽  
Vol 135 (3) ◽  
Author(s):  
Chunji Yan ◽  
H. B. Ma
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Film Thickness ◽  
Thermal Resistance ◽  
Heat Transfer Rate ◽  
Analytical Solutions ◽  
Transfer Rate ◽  
Total Heat ◽  
Total Heat Transfer

A mathematical model predicting heat transfer and film thickness in thin-film region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.

Wave-Coherent Air–Sea Heat Flux

2008 ◽  
Vol 38 (4) ◽  
pp. 788-802 ◽  
Author(s):  
Fabrice Veron ◽  
W. Kendall Melville ◽  
Luc Lenain
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Wave ◽  
Momentum Transfer ◽  
Latent Heat ◽  
Heat Fluxes ◽  
Total Heat ◽  
Research Progress ◽  
Total Heat Flux ◽  
Wave Conditions

Abstract Air–sea fluxes of heat and momentum play a crucial role in weather, climate, and the coupled general circulation of the oceans and atmosphere. Much progress has been made to quantify momentum transfer from the atmosphere to the ocean for a wide range of wind and wave conditions. Yet, despite the fact that global heat budgets are now at the forefront of current research in atmospheric, oceanographic, and climate problems and despite the good research progress in recent years, much remains to be done to better understand and quantify air–sea heat transfer. It is well known that ocean-surface waves may support momentum transfer from the atmosphere to the ocean, but the role of the waves in heat transfer has been ambiguous and poorly understood. Here, evidence is presented that there are surface wave–coherent components of both the sensible and the latent heat fluxes. Presented here are data from three field experiments that show modulations of temperature and humidity at the surface and at 10–14 m above the surface, which are coherent with the surface wave field. The authors show that the phase relationship between temperature and surface displacement is a function of wind speed. At a 10–12-m elevation, a wave-coherent heat transfer of O(1) W m−2 is found, dominated by the latent heat transfer, as well as wave-coherent fractional contributions to the total heat flux (the sum of latent and sensible heat fluxes) of up to 7%. For the wind speeds and wave conditions of these experiments, which encompass the range of global averages, this wave contribution to total heat flux is comparable in magnitude to the atmospheric heat fluxes commonly attributed to the effects of greenhouse gases or aerosols. By analogy with momentum transfer, the authors expect the wave-coherent heat transfer to decay with height over scales on the order of k−1, where k is the characteristic surface wavenumber; therefore, it is also expected that measurements at elevations of O(10) m may underestimate the contribution of the wave-induced heat flux to the atmosphere.

scholarly journals Heat transfer in laminar Couette flow laden with rigid spherical particles

2017 ◽  
Vol 834 ◽  
pp. 308-334 ◽  
Author(s):  
M. Niazi Ardekani ◽  
O. Abouali ◽  
F. Picano ◽  
L. Brandt
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Reynolds Number ◽  
Thermal Diffusivity ◽  
Couette Flow ◽  
Total Heat ◽  
Spherical Particles ◽  
Total Heat Transfer ◽  
Particle Reynolds Number ◽  
Finite Particle

We study heat transfer in plane Couette flow laden with rigid spherical particles by means of direct numerical simulations. In the simulations we use a direct-forcing immersed boundary method to account for the dispersed phase together with a volume-of-fluid approach to solve the temperature field inside and outside the particles. We focus on the variation of the heat transfer with the particle Reynolds number, total volume fraction (number of particles) and the ratio between the particle and fluid thermal diffusivity, quantified in terms of an effective suspension diffusivity. We show that, when inertia at the particle scale is negligible, the heat transfer increases with respect to the unladen case following an empirical correlation recently proposed in the literature. In addition, an average composite diffusivity can be used to approximate the effective diffusivity of the suspension in the inertialess regime when varying the molecular diffusion in the two phases. At finite particle inertia, however, the heat transfer increase is significantly larger, smoothly saturating at higher volume fractions. By phase-ensemble-averaging we identify the different mechanisms contributing to the total heat transfer and show that the increase of the effective conductivity observed at finite inertia is due to the increase of the transport associated with fluid and particle velocity. We also show that the contribution of the heat conduction in the solid phase to the total wall-normal heat flux reduces when increasing the particle Reynolds number, so that particles of low thermal diffusivity weakly alter the total heat flux in the suspension at finite particle Reynolds numbers. On the other hand, a higher particle thermal diffusivity significantly increases the total heat transfer.

scholarly journals An experimental study of the temperature evolution of a single fin submerged in a phase changing material during melting at different heat fluxes

2021 ◽  
Vol 2116 (1) ◽  
pp. 012047
Author(s):  
R Tassenoy ◽  
W Beyne ◽  
W Plas ◽  
S Lecompte ◽  
M De Paepe
Keyword(s):  
Heat Transfer ◽  
Steady State ◽  
Temperature Drop ◽  
Melting Process ◽  
Heat Fluxes ◽  
Total Heat ◽  
Temperature Evolution ◽  
Total Heat Transfer ◽  
Steady State Temperature ◽  
State Behaviour

Abstract An experimental setup has been designed to study a single cylindrical fin placed in a cylindrical enclosure filled with phase changing material (PCM). The heat flux to the fin is measured at the top of the fin. The temperature evolution at different fin heights is measured by thermocouples placed internally in the fin. The evolution of these temperatures has been studied for different heat fluxes. This provides insight in the contribution of the different fin heights to the total heat transfer to the PCM during the different stages of the melting process. As such they can be used to assess the effectiveness of the fin over its length. After approximately 6h, the fin temperature stabilizes during melting. Due to the temperature drop over the fin, the bottom temperature reached is significantly lower than the temperature at the top and the contribution of this lower part to the total heat transfer is lower as well. For heat fluxes higher than 3805±75 W/m2, the steady-state temperatures at fin locations in contact with the melting PCM are similar. For low heat fluxes, this steady-state temperature is not reached during a 12h experiment. Longer experiments are thus needed to study the steady-state behaviour at these lower heat fluxes.

The Analytical Solutions for Heat Transfer in Thin Film Evaporation With Disjoining Pressure

2011 ◽  
Author(s):  
Chunji Yan ◽  
Hongbin Ma
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Film Thickness ◽  
Thermal Resistance ◽  
Heat Transfer Rate ◽  
Analytical Solutions ◽  
Transfer Rate ◽  
Total Heat ◽  
Total Heat Transfer

A mathematical model predicting heat transfer and film thickness in thin film region is developed. Utilizing the dimensionless analysis, analytical solutions of the heat flux distribution, the total heat transfer rate per unit width, the location of the maximum heat flux and the ratio of the conduction thermal resistance to the convection thermal resistance in evaporating film region have been obtained. The analytical solutions obtained herein indicate that the maximum dimensionless heat flux is constant which is independent on the superheat. For a given thin film region, its maximum total heat transfer rate is determined. The ratio of the conduction thermal resistance to the convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.

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