The Experimental Study on Magnetic Fluid Flat Plate Heat Pipe as Thermal Spreaders

Author(s):  
Ming Zhang ◽  
Zhongliang Liu ◽  
Chen Wang

An effective thermal spreader can achieve uniform heat flux distribution and thus enhance heat dissipation of heat sinks. Flat plate heat pipe is one of the highly effective thermal spreaders. Magnetic fluid is a special fluid that can be made flow by traveling force of magnetic field. Therefore, the magnetic fluid is suitable for using as the working fluid of flat plate heat pipes that have a very small gap between evaporation and condensation surfaces. In this paper, we prepared a disk-shaped wickless flat plate heat pipe, and the distance between evaporation and condensation surfaces is 1 mm. From experimental study, the effects of heat flux and working fluid ratio on the performance of the flat plate heat pipe are obtained and the working performance of the magnetic fluid is compared with that of the water flat pate heat pipe of the same geometry structure.

2009 ◽  
Vol 33 (7) ◽  
pp. 1100-1105 ◽  
Author(s):  
Zhang Ming ◽  
Liu Zhongliang ◽  
Ma Guoyuan ◽  
Cheng Shuiyuan

2018 ◽  
Vol 15 (6) ◽  
pp. 1948-1953
Author(s):  
Bin Liu ◽  
Qianqian Meng ◽  
Yong Yang ◽  
Kuining Li ◽  
Hao Li ◽  
...  

2011 ◽  
Vol 121-126 ◽  
pp. 142-146
Author(s):  
Dong Yao Liu ◽  
Xian Hu Ding

The surface temperature and equivalent heat conductivity of Flat Plate Heat Pipe (FPHP) under different heat flux, liquid filling and tilt angles are investigated experimentally. Electrical discharge machining (EDM) micro-channels wick are select as the wick inside FPHP. A set of experimental facility to measure the temperatures of FPHP is build up. The surface temperature along channels under different tilt angles, liquid filling and heat flux are measured by thermal couples. The results indicate that the temperatures are independent to the tilt angles and liquid filling. The equivalent thermal conductivity increases with the increasing of heat flux, and is 1.36 to 1.44 times to that of brass.


2013 ◽  
Vol 772 ◽  
pp. 480-486 ◽  
Author(s):  
Chen Wang ◽  
Zhong Liang Liu ◽  
Guang Meng Zhang

A copper-water flat plate heat pipe with intersected micro-grooves was developed for cooling electronic devices in this paper. The effects of heat flux, working fluid filling ratio and inclination angles on thermal performance of the flat plate heat pipe was tested and investigated. The laboratory tests show the optimal filling ratio of the heat pipe is about 65%. Excellent thermal performance is also observed in unfavorable titled positions including vertical and anti-gravity orientation at 65%. The smallest overall thermal resistance is obtained in horizontal position and the maximal thermal resistance is observed in vertical position. The influence of inclination angles on thermal performance of the heat pipe in both axial direction and radial direction is also investigated. As the heat pipe is tilted, the ability of temperature leveling in radial direction is enhanced, nevertheless, the capacity of heat transfer in radial direction decreased at the same time.


Author(s):  
Gerardo Carbajal ◽  
C. B. Sobhan ◽  
G. P. Peterson

A numerical analysis of the evaporation process in a flat plate heat pipe (FPHP) is presented. Three different heat flux configurations were applied at the evaporator section: parabolic, linear and constant; and three different wick thicknesses were evaluated. A two-dimensional explicit Finite Difference Model was used to conduct the transient computational analysis of the heat pipe. The results indicate that the vaporization rate was more intense at the evaporator for the parabolic heat flux distribution, than for either the linear or constant heat flux distributions. The velocity field is nearly identical to the shape of the input heat flux distribution. The maximum Mach number for all the cases analyzed was low, indicating that the incompressible flow assumption in the vapor was valid. The modeling results also indicated that the thickness of the heat pipe wick was a significant factor in the determination of the overall thermal resistance, with the resulting temperature drop proportional to the thickness of the wick. Typical distributions of the field variables, particularly the temperature in the wall, and the temperature, velocity and pressure in the wick and the vapor core of the flat plate heat pipe are also presented and discussed.


2014 ◽  
Vol 960-961 ◽  
pp. 389-393
Author(s):  
Ya Ping Zhang ◽  
J.G. Wang

A trend towards increasingly dense and compact architectures has led to unmanageably high heat fluxes in electronic components. A novel heat pipe will be developed. Heat pipe designed is based on the flat plate heat pipe and pulsation heat pipe effective combination. Channel quantity is greatly increased ,as well as compact and homogeneous red copper pulsation plank is severed as the wick,dense and connected channels are served as the passage of the working fluid.


Author(s):  
Wan Yu ◽  
Dan Gao ◽  
Gang Wang ◽  
Tao Hu ◽  
Qichao Gong ◽  
...  

With the aim to analyze the flow pattern and heat transfer characteristics of the working fluid in a flat plate heat pipe (FPHP) which was sealed by a transparent tempered glass plate, ethanol, acetone, and R141b were taken as the working medium, and visual experiments were performed at different heat flux when the inclination angle was 90°. The vapor-liquid distribution and the heat transfer characteristics of the FPHP were investigated at different liquid filling ratios. According to the experimental results and the recording of high-speed cameras, some important conclusions had been drawn as follows: (i) As the power increases, the vapor-liquid interface in the FPHP declines and the effects of dryout is significantly intnsified, leading to a sharp increase in temperature. The FPHP with a filling ratios of 25.7% owns better thermal performance than that with the filling ratios of 11.8% and 66% at different heating power; (ii) the bubble generation inside the FPHP became more intense with increasing heat flux, and various bubble movement patterns were found at different the liquid filling ratios; (iii) As the liquid film flowed downward, the thickness of the liquid film increased at first and then decreases. The condensation of steam was reduced due to the thickening of the liquid film on the wall. The liquid film became thinner when it was entrapped and evaporated in the downward flow.


Author(s):  
Atsushi Okamoto ◽  
Makiko Ando ◽  
Hiroyuki Sugita

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