ENHANCED FORMATION OF Si NANOCRYSTALS IN SiO2 BY LIGHT-FILTERING RAPID THERMAL ANNEALING

2015 ◽  
Vol 22 (04) ◽  
pp. 1550049
Author(s):  
XIAOBO CHEN ◽  
GUANGPING CHEN

In this work, silicon-rich oxide (SRO) films with designed thickness of ~100 nm were deposited by a bipolar pulse and radio frequency magnetron co-sputtering. For comparison, the samples were then treated in a nitrogen atmosphere by conventional rapid thermal annealing (CRTA) or light-filtering rapid thermal annealing (LRTA) at 900–1100°C for 2 min. Raman spectra, grazing incident X-ray diffraction (XRD), transmission electron microscopy (TEM), Hall measurements, and current density–voltage measurements were carried out to analyze the microstructural and electrical properties of samples. Compared with the control sample using CRTA method, the crystalline volume fraction and number density of Si nanocrystals ( Si NCs ) in silicon oxide prepared by LRTA were greatly increased. The quantum effects of the short wave-length light (less than 800 nm) of these tungsten halogen lamps during the rapid thermal annealing process have negative effects on the formation of Si NCs in SiO 2 films. Si NCs with crystal volume fraction of 73%, average size of 2.53 nm, and number density of ~1.1 × 1012 cm-2 embedded in the amorphous SiO 2 matrix can be formed by LRTA at 1100°C. Enhancement of more than one order of magnitude in conductivity and higher current density were obtained from the LRTA annealed sample compared to the CRTA annealed sample. The improvements in conductivity and current density were attributed to the high density Si NCs . Our results show that the LRTA method is a suitable annealing tool for the formation of Si NC in thin SiO x films.

Crystals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 776
Author(s):  
Matthew J. Sparks ◽  
Oscar W. Kennedy ◽  
Paul A. Warburton

Two-dimensional electron gases (2DEGs) at the ZnO/ZnMgO interface are promising for applications in spintronics and quantum computing due to the combination of low spin-orbit coupling and high electron mobility. Growing high mobility 2DEGs requires high quality substrates with low impurity densities. In this work we demonstrate a ZnO substrate sample treatment combining high temperature rapid thermal annealing and chemical etching to improve the surface quality for the subsequent growth of 2DEGs. This process enables the growth of a 2DEG with low-temperature mobility of 4.8×104 cm2V−1s−1. An unannealed control sample shows a scattering rate at least three times greater than the annealed sample.


2010 ◽  
Vol 98 (4) ◽  
pp. 867-871 ◽  
Author(s):  
Samson T. H. Silalahi ◽  
Q. V. Vu ◽  
H. Y. Yang ◽  
K. Pita ◽  
Yu Mingbin

1983 ◽  
Vol 23 ◽  
Author(s):  
D.L. Kwong ◽  
R. Kwor ◽  
B.Y. Tsaur ◽  
K. Daneshvar

ABSTRACTThe formation of composite TaSi2/n+ Poly-Si silicide films through the use of rapid thermal annealing (RTA) is investigated by x-ray diffraction, four point probe, scanning Auger microprobes (SAM) with ion sputter etching, transmission electron microscopy (TEM), scanning electron microscopy (SEM), and capacitance-voltage (C-V) measurements. 0.2 μm polysilicon is deposited on oxidized Si wafer by LPCVD and doped with phosphorus. A layer of 2200 A TaSix is then co-sputtered on polysilicon samples from separate targets. These as-deposited films are then annealed by RTA in an argon ambient for 1 sec. and 10 sec. at various temperatures. X-ray diffraction and SAM results show the rapid formation of a uniform stoichiometric tantalum disilicide via Si migration from polysilicon. TEM micrographs show simlilar results for samples annealed at 1000°C in furnace for 30 min. or by RTA for 1 sec., exhibiting average grain size greater than 1000 A. Sheet resistance of samples annealed by furnace annealing and RTA are comparable. SEM micrographs indicate that the surface morphology of the RTA-annealed sample is superior to that obtained by furnace annealing. These results show that RTA may offer a practical solution to low-resistivity silicide formation in VLSI circuits.


2008 ◽  
Vol 94 (2) ◽  
pp. 357-363 ◽  
Author(s):  
Yi-Sheng Lai ◽  
Jyh-Liang Wang ◽  
Sz-Chian Liou ◽  
Chia-Hsun Tu

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