Copper deposition on textiles via an automated dispensing process for flexible microstrip antennas

2014 ◽  
Vol 84 (19) ◽  
pp. 2026-2035 ◽  
Author(s):  
Bing Li ◽  
Dapeng Li ◽  
Jiping Wang
Keyword(s):  
Copper Sulfate ◽  
Copper Deposit ◽  
Sulfate Solution ◽  
Microstrip Antennas ◽  
Driving Pressure ◽  
Copper Deposition ◽  
Electrical Performance ◽  
Complexing Agent ◽  
Patch Antennas ◽  
Copper Sulfate Solution

A three-axis automatic robot was coupled with a precision liquid dispenser to deposit copper on fabrics to be used as the conductive layer for assembly of textile-based flexible microstrip patch antennas. Two reactive solutions, copper sulfate and sodium borohydride, were sequentially dispensed on fabrics and a conductive copper was produced in situ and in real time, through a simple redox mechanism. Driving pressure, the number of dispensing cycles, concentration and composition (i.e. the addition of a complexing agent sodium citrate to the copper sulfate solution) of the reactive solutions were studied to optimize the dispensing process in favor of rapid copper deposition. The electrical performance of the resulting copper deposit and its adhesion to the textile substrates were characterized. A copper coating of about 0.2 ohm/□ sheet resistance could be prepared in less than 1 hour under a 45 kPa driving pressure, at a 200 mm·s−1 moving speed, and within 60 dispensing cycles.

scholarly journals Visualization of Latent Fingerprints on Aluminum

2019 ◽  
Vol 73 (11) ◽  
pp. 945-946
Author(s):  
Rachel Fischer ◽  
Marco Oetken
Keyword(s):  
Corrosion Inhibitor ◽  
Copper Sulfate ◽  
Direct Contact ◽  
Sulfate Solution ◽  
Copper Deposition ◽  
Decisive Factor ◽  
Visualization Method ◽  
Latent Fingerprints ◽  
Copper Sulfate Solution ◽  
Negative Image

For aluminum, a new visualization method is presented in which copper is deposited electrochemically. The fingerprint on the aluminum (trace carrier) serves as an insulator as it prevents direct contact between electrolyte and aluminum. The decisive factor is the choice of an ammoniacal copper sulfate solution, which acts as a corrosion inhibitor due to the ammonia molecules. This enables uniform copper deposition on aluminum and thus the development of a clearly defined negative image.

Computed tomography assessment of soil and sediment porosity modifications from exposure to an acid copper sulfate solution

2021 ◽  
Vol 108 ◽  
pp. 103194
Author(s):  
Francisco R.A. Ziegler-Rivera ◽  
Blanca Prado ◽  
Alfonso Gastelum-strozzi ◽  
Jorge Márquez ◽  
Lucy Mora ◽  
...  
Keyword(s):  
Computed Tomography ◽  
Copper Sulfate ◽  
Sulfate Solution ◽  
Copper Sulfate Solution ◽  
Soil And Sediment

Coordination of copper(II) in aqueous copper sulfate solution

1983 ◽  
Vol 22 (8) ◽  
pp. 1184-1187 ◽  
Author(s):  
A. Musinu ◽  
G. Paschina ◽  
G. Piccaluga ◽  
M. Magini
Keyword(s):  
Copper Sulfate ◽  
Sulfate Solution ◽  
Copper Sulfate Solution

Open Circuit Repair Using Thermal Exchange Deposition of Copper

1990 ◽  
Vol 204 ◽  
Author(s):  
R. J. Von Gutfeld ◽  
D. R. Vigliotti
Keyword(s):  
Copper Sulfate ◽  
Local Heating ◽  
Sulfate Solution ◽  
Open Circuit ◽  
Step Method ◽  
Copper Sulfate Solution ◽  
Thermal Exchange ◽  
Thermally Driven

ABSTRACTWe describe a two step method that uses thermally driven exchange plating to repair open copper circuits with local heating produced by ac Joule losses. The first step utilizes a non-acid copper sulfate solution to grow copper dendrites across the open circuit. This electrical “bridge” is then strengthened using additional plate-up in acid copper sulfate.

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