Evaluation of Soil-Tire Mixtures as a Lightweight Fill Material

2021 ◽  
pp. 503-513
Author(s):  
Chien-Jen Chu ◽  
Abdul Shakoor
Keyword(s):  
Fill Material ◽  
Lightweight Fill

Modified Singh-Mitchell Creep Model for EPS Composite Soil

2011 ◽  
Vol 311-313 ◽  
pp. 339-343 ◽  
Author(s):  
Hong Mei Gao ◽  
Guo Xing Chen
Keyword(s):  
Creep Test ◽  
Creep Behavior ◽  
Engineering Properties ◽  
Creep Model ◽  
Deviator Stress ◽  
Fill Material ◽  
Confining Pressures ◽  
Lightweight Fill ◽  
Eps Composite Soil ◽  
Undrained Creep

EPS composite soil is a new kind of lightweight fill material. Its engineering properties have been widely studied. However, the creep behavior has not been well investigated. In this study, triaxial undrained creep test is conducted on EPS composite soil regarding various confining pressures. Based on the testing results, a modified Singh-Mitchell creep model is established for EPS composite soil considering the influence of the deviator stress on the parameter m. Compared with the original Singh-Mitchell model, the modified creep model can well describe the creep behavior of EPS composite soil. It can provide references for engineers to design the project using EPS composite soil.

Engineering Properties of Tire/Soil Mixtures as a Lightweight Fill Material

1996 ◽  
Vol 19 (3) ◽  
pp. 297 ◽  
Author(s):  
RC Chaney ◽  
KR Demars ◽  
E Masad ◽  
R Taha ◽  
C Ho ◽  
...  
Keyword(s):  
Engineering Properties ◽  
Fill Material ◽  
Lightweight Fill ◽  
Soil Mixtures

scholarly journals THE PROPOSED GEOBEADS ADDITION AS LIGHTWEIGHT FILL MATERIAL

2021 ◽  
Vol 56 (4) ◽  
pp. 793-803
Author(s):  
Nuril Charisma ◽  
Yulvi Zaika ◽  
As’ad Munawir
Keyword(s):  
Permeability Coefficient ◽  
Soft Soil ◽  
Physical And Mechanical Properties ◽  
National Standard ◽  
Test Results ◽  
The Road ◽  
Fill Material ◽  
Cbr Test ◽  
Alternative Material ◽  
Lightweight Fill

The study aimed to develop an alternative material for dam and road embankments, especially in the area with soft soil, using Geobeads. There are many problems constructing embankments on soft soil, such as low bearing capacity, excessive and differential settlement, and slope stability. The subgrade must be stable to resist the weight of the fill construction and upper structure. The lightweight fill material is commonly used as an alternative to reduce the excessive and differential settlements by reducing the weight of landfills on the soft soil subgrade. In this study, the laboratory test was conducted to investigate the influence of Geobeads (GB) additions as lightweight fill material both as the dam embankment and the road embankment. This study aims to find a combination of GB, sand, and cement to fulfill the standard as an embankment material. Investigation of physical and mechanical properties represented that light embankment can be an alternative on soft soil. The Indonesia National Standard, 8062:2015, and the General Specifications for Road and Bridge Construction Work were guidelines for embankment cases. The falling head test executes the permeability coefficient. The CBR test was conducted based on ASTM D1883. The specimen has varied the percentage of EPS addition (20%, 30%, 40%) with 14 days of curing time. Based on the test results, both the permeability coefficient value and the CBR value decreased along with the increase in the percentage of EPS, where the coefficient of permeability (k) of the specimens around 10-5 cm/s and the lowest CBR at 40% GB was 30.02% which is the range still used as embankment material.

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

2002 ◽  
Author(s):  
George F. Gaut
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Solder Bump ◽  
Selective Area ◽  
Fill Material ◽  
Solder Bumps ◽  
Time Required

Abstract Access to the solder bump and under-fill material of flip-chip devices has presented a new problem for failure analysts. The under-fill and solder bumps have also added a new source for failure causes. A new tool has become available that can reduce the time required to analyze this area of a flip-chip package. By using precision selective area milling it is possible to remove material (die or PCB) that will allow other tools to expose the source of the failure.

Microhardness Testing on Via Fill Material for Via In Pad Technology

2003 ◽  
Author(s):  
Norman J. Armendariz ◽  
Carolyn McCormick
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Strong Dependence ◽  
Circuit Board ◽  
Electrical Performance ◽  
Gravimetric Analysis ◽  
Passive Components ◽  
Root Cause ◽  
Fill Material ◽  
Signal Routing

Abstract Via in pad PCB (Printed Circuit board) technology for passive components such as chip capacitors and resistors, provides the potential for improved signal routing density and reduced PCB area. Because of these improvements there is the potential for PCB cost reduction as well as gains in electrical performance through reduced impedance and inductance. However, not long after the implementation, double digit unit failures for solder joint electrical opens due to capacitor “tombstoning” began to occur. Failure modes included via fill material (solder mask) protrusion from the via as well as “out gassing” and related “tombstoning.” This failure analysis involved investigating a strong dependence on PCB supplier and, less obviously, manufacturing site. Other factors evaluated included via fill material, drill size, via fill thermal history and via fill amount or fill percent. The factor most implicated was incomplete cure of the via fill material. Previous thermal gravimetric analysis methods to determine level of polymerization or cure did not provide an ability to measure and demonstrate via fill cure level in small selected areas or its link to the failures. As a result, there was a metrology approach developed to establish this link and root-cause the failures in the field, which was based on microhardness techniques and noncontact via fill measuring metrologies.

scholarly journals Geomechanical Behaviour of Uncemented Expanded Polystyrene (EPS) Beads–Clayey Soil Mixtures as Lightweight Fill

Geotechnics ◽  
2021 ◽  
Vol 1 (1) ◽  
pp. 38-58
Author(s):  
Pouyan Abbasimaedeh ◽  
Ali Ghanbari ◽  
Brendan C. O’Kelly ◽  
Mohsen Tavanafar ◽  
Kourosh Ghaffari Irdmoosa
Keyword(s):  
Clayey Soil ◽  
Expanded Polystyrene ◽  
Environmental Cost ◽  
Dry Density ◽  
Engineering Practice ◽  
Clayey Sand ◽  
Earth Pressures ◽  
Lightweight Fill ◽  
Soil Foundation ◽  
Geotechnical Testing

Lightweight fill can be advantageous in embankment construction for the purposes of reducing the (i) bearing pressures on the underlying soil foundation, (ii) destabilizing moments for constructed earthen slopes, and (iii) earth pressures acting behind retaining walls. This paper investigates the merits/limitations of particulate expanded polystyrene (EPS) beads mixed with clayey sand (CS) soil as lightweight fill, considering both geotechnical and environmental perspectives. The bench-scale geotechnical testing programme included standard Proctor (SP) compaction, California bearing ratio (CBR), direct shear (sheardox), oedometer and permeability testing performed on two different gradation CS soils amended with 0.5, 1.5 and 3.0 wt.% EPS, investigating two nominal bead sizes equivalent to poorly-graded medium and coarse sands. Compared to the unamended soils, the compacted dry density substantially decreased with increasing EPS beads content, from 2.09 t/m3 (0 wt.% EPS) to as low as 0.33 t/m3 for 3 wt.% (73 v.%) of larger-sized EPS beads. However, from analyses of the test results for the investigated 50 to 400 kPa applied stress range, even 0.5 wt.% (21 v.%) EPS beads caused a substantial mechanical failure, with a drastic decay of the CBR and compressibility parameters for the studied CS soils. Given the more detrimental environmental cost of leaving myriads of separate EPS beads mixed forever among the soil, it is concluded that the approach of adding particulate EPS beads to soils for producing uncemented lightened fill should not be employed in geotechnical engineering practice.

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