scholarly journals Fracture Toughness and Fatigue Crack Growth in Si-Ti-C-O Ceramics-Fiber-Reinforced Aluminum Composite under Mixed-Mode Loading.

1994 ◽  
Vol 60 (577) ◽  
pp. 2021-2029
Author(s):  
Kenji Hatanaka ◽  
Yasumasa Kamimura ◽  
Toshihide Umeda
Keyword(s):  
Fracture Toughness ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Mixed Mode ◽  
Mixed Mode Loading ◽  
Fiber Reinforced ◽  
Aluminum Composite

Mixed Mode I/II Fracture and Fatigue Crack Growth Along 63Sn-37Pb Solder/Brass Interface

2000 ◽  
Author(s):  
H. Nayeb-Hashemi ◽  
Pinghu Yang
Keyword(s):  
Fracture Toughness ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Fracture Surface ◽  
Crack Growth ◽  
Mixed Mode ◽  
Mode I ◽  
Mode Ii ◽  
Mixed Mode Loading ◽  
Solder Layer

Abstract Solder joints are extensively used in electronic packaging. They provide critical electrical and mechanical connections. Single edge notched sandwich specimens, which were made of two blocks of brass joined with a 63Sn-37Pb solder layer, were prepared for fatigue and fracture study of the joint under mixed mode loading. Mode I and mixed mode I/II fracture toughness, fatigue crack thresholds, and fatigue crack growth rates (FCGR) were measured at room temperature using a four point bending test setup. It was found that the fracture toughness of the joint increased and FCGR decreased upon the introduction of mode II component. The interface fracture toughness was higher than that of reported for pure solder. The data of FCGR correlated well with the power law relation of da / dN = C* (ΔG)m. It was also observed that both fracture toughness and FCGR were a function of thickness of solder layer. When the solder layer thickness increased from 0.1mm to 1.0mm, the fracture toughness decreased substantially and FCGR increased slightly. For mode I loading, fatigue crack propagated inside the solder layer. However, for mixed mode loading, once a crack initiated, it changed its direction toward the interface and then propagated along the interface. These observations were related to local mode I and mode II stress fields. Fracture surface showed sign of rubbing under mixed mode loading with elongated cavities at the crack tip. However, under mode I loading, fracture surface was covered with equi-ax voids.

Numerical Simulation of Fatigue Crack Growth for Curved Cracks Emanating from Fastener Holes in Sheets by the MVCCI Method

2006 ◽  
Vol 324-325 ◽  
pp. 863-866
Author(s):  
Holger Theilig ◽  
M. Goth ◽  
Michael Wünsche
Keyword(s):  
Numerical Simulation ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Plane Stress ◽  
Mixed Mode ◽  
Mixed Mode Loading ◽  
Multiple Crack ◽  
2D Structure ◽  
Predictor Corrector

The paper presents the results of a continued study of curved fatigue crack growth in a multiple arbitrarily pre-cracked isotropic sheet under plane stress loading. The predictor-corrector method (PCM) was extended in order to analyse the growth of multiple crack systems in a finite 2D structure. Together with the recently proposed improved modified virtual crack closure integral (MVCCI) method we can obtain accurate SIF values also for interacting cracks, and furthermore we can simulate fatigue crack growth of multiple crack systems in plane sheets under proportional mixed mode loading conditions. As a result, the program PCCS-2D is written to run within ANSYS to simulate interacting curved cracks. In order to check the accuracy and efficiency of the proposed method several example problems are solved. Especially curved cracks emanating from loaded fastener holes in sheets are analysed.

scholarly journals History effect in fatigue crack growth under mixed-mode loading conditions

2009 ◽  
Vol 31 (11-12) ◽  
pp. 1733-1741 ◽  
Author(s):  
P.Y. Decreuse ◽  
S. Pommier ◽  
L. Gentot ◽  
S. Pattofatto
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Mixed Mode ◽  
Loading Conditions ◽  
Mixed Mode Loading ◽  
History Effect
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