High-Throughput, High-Resolution Echelle Deep-UV Raman Spectrometer

2013 ◽  
Vol 67 (8) ◽  
pp. 873-883 ◽  
Author(s):  
Sergei V. Bykov ◽  
Bhavya Sharma ◽  
Sanford A. Asher
Keyword(s):  
High Resolution ◽  
High Throughput ◽  
Raman Spectrometer ◽  
Uv Raman ◽  
Deep Uv

Development of a Deep Drill System with Integrated Deep UV/Raman Spectrometer for Mars and Europa

2018 ◽  
Author(s):  
Boleslaw L. Mellerowicz ◽  
Kris Zacny ◽  
Evan Eshelman ◽  
Rohit Bhartia ◽  
Madelyne Willis ◽  
...  
Keyword(s):  
Raman Spectrometer ◽  
Uv Raman ◽  
Deep Uv ◽  
Drill System

Deep-UV Raman spectrometer tunable between 193 and 205�nm for structural characterization of proteins

2004 ◽  
Vol 381 (2) ◽  
pp. 431-437 ◽  
Author(s):  
Igor K. Lednev ◽  
Vladimir V. Ermolenkov ◽  
Wei He ◽  
Ming Xu
Keyword(s):  
Structural Characterization ◽  
Raman Spectrometer ◽  
Uv Raman ◽  
Deep Uv

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

High-resolution deep-UV laser mask repair based on near-field optical technology

1996 ◽  
Author(s):  
Klony S. Lieberman ◽  
Hanan Terkel ◽  
Michael Rudman ◽  
A. Ignatov ◽  
Aaron Lewis
Keyword(s):  
High Resolution ◽  
Near Field ◽  
Uv Laser ◽  
Optical Technology ◽  
Deep Uv

scholarly journals Micromechanical Punching: A Versatile Method for Non-Spherical Microparticle Fabrication

Polymers ◽  
2020 ◽  
Vol 13 (1) ◽  
pp. 83
Author(s):  
Ritika Singh Petersen ◽  
Anja Boisen ◽  
Stephan Sylvest Keller
Keyword(s):  
Drug Delivery ◽  
High Resolution ◽  
Physicochemical Properties ◽  
High Throughput ◽  
Liquid State ◽  
Soft Lithography ◽  
Glycolic Acid ◽  
Thermosetting Polymers ◽  
Spherical Microparticle ◽  
Spherical Microparticles

Microparticles are ubiquitous in applications ranging from electronics and drug delivery to cosmetics and food. Conventionally, non-spherical microparticles in various materials with specific shapes, sizes, and physicochemical properties have been fabricated using cleanroom-free lithography techniques such as soft lithography and its high-resolution version particle replication in non-wetting template (PRINT). These methods process the particle material in its liquid/semi-liquid state by deformable molds, limiting the materials from which the particles and the molds can be fabricated. In this study, the microparticle material is exploited as a sheet placed on a deformable substrate, punched by a robust mold. Drawing inspiration from the macro-manufacturing technique of punching metallic sheets, Micromechanical Punching (MMP) is a high-throughput technique for fabrication of non-spherical microparticles. MMP allows production of microparticles from prepatterned, porous, and fibrous films, constituting thermoplastics and thermosetting polymers. As an illustration of application of MMP in drug delivery, flat, microdisk-shaped Furosemide embedded poly(lactic-co-glycolic acid) microparticles are fabricated and Furosemide release is observed. Thus, it is shown in the paper that Micromechanical punching has potential to make micro/nanofabrication more accessible to the research and industrial communities active in applications that require engineered particles.

scholarly journals Development of High-Throughput, High-Resolution 3D Reconstruction of Large-Volume Biological Tissue Using Automated Tape Collection Ultramicrotomy and Scanning Electron Microscopy

2011 ◽  
Vol 17 (S2) ◽  
pp. 966-967 ◽  
Author(s):  
R Schalek ◽  
N Kasthuri ◽  
K Hayworth ◽  
D Berger ◽  
J Tapia ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
High Resolution ◽  
3D Reconstruction ◽  
High Throughput ◽  
Large Volume ◽  
Biological Tissue ◽  
Scanning Electron

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

A high-resolution high-throughput FUV imager for the JMEX mission

2003 ◽  
Author(s):  
Steven N. Osterman ◽  
Nicholas M. Schneider ◽  
David A. Content ◽  
William E. McClintock ◽  
Stephen R. Steg ◽  
...  
Keyword(s):  
High Resolution ◽  
High Throughput
Sign in / Sign up

Export Citation Format

Share Document