A High-Order Finite-Difference Scheme with a Linearization Technique for Numerical Solution of Two Dimensional Burgers Equation

Author(s):  
Marco Donisete de Campos ◽  
◽  
Estaner Claro Romão
2013 ◽  
Vol 5 (06) ◽  
pp. 809-824 ◽  
Author(s):  
Qin Li ◽  
Qilong Guo ◽  
Hanxin Zhang

AbstractAnalyses were performed on the dispersion overshoot and inverse dissipation of the high-order finite difference scheme using Fourier and precision analysis. Schemes under discussion included the pointwise- and staggered-grid type, and were presented in weighted form using candidate schemes with third-order accuracy and three-point stencil. All of these were commonly used in the construction of difference schemes. Criteria for the dispersion overshoot were presented and their critical states were discussed. Two kinds of instabilities were studied due to inverse dissipation, especially those that occur at lower wave numbers. Criteria for the occurrence were presented and the relationship of the two instabilities was discussed. Comparisons were made between the analytical results and the dispersion/dissipation relations by Fourier transformation of typical schemes. As an example, an application of the criteria was given for the remedy of inverse dissipation in Weirs & Martín’s third-order scheme.


VLSI Design ◽  
2001 ◽  
Vol 13 (1-4) ◽  
pp. 287-293 ◽  
Author(s):  
Eric A. B. Cole ◽  
Christopher M. Snowden ◽  
Shahzad Hussain

The hot-electron two-dimensional HEMT with recessed gate is modelled by solving the Poisson, current continuity and energy transport equations consistently with the Schrödinger equation using a finite difference scheme. New expressions are used for the energy densities inside and outside the quantum wells. A method is described for pinning the conduction band at the contact edge to produce an extremely stable numerical solution. Results are presented for an eight layer GaAs-ALGaAs-InGaAs device.


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