Phase Stability and Interface Reactions in the Al-SiC System

AbstractThe Al-SiC system has been used as a model system in an examination of phase stability in the presence of a liquid phase and microstructure development in metal-matrix composites. The Al-Si-C phase diagram has been calculated for temperatures between 500°C and 1500°C. The phases formed between Al(liquid) and SiC at 920°C have been determined experimentally, using analytical electron microscopy, in both fiber and particulate composites and compared with what is predicted from the equilibrium phase diagram. The morphologies and the spatial distributions of phases have also been examined in addition to the phase analysis. The only phases found were Al, Al4C3, SiC, and Si. Although Al4SiC4 is calculated to be stable at 920°C, it was not found. The SiC grain structure was found to influence strongly the morphology of the Al4C3-SiC and Al-SiC interfaces.

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Effect of Concentration Gradient on Phase Stability

MRS Proceedings ◽

10.1557/proc-19-375 ◽

1982 ◽

Vol 19 ◽

Cited By ~ 2

Author(s):

K.N. Tu ◽

U. GöSele

Keyword(s):

Thin Film ◽

Phase Diagram ◽

Intermetallic Compound ◽

Phase Stability ◽

Equilibrium Phase ◽

Equilibrium Phase Diagram ◽

Metal Films ◽

Silicide Formation ◽

Intermetallic Compound Growth ◽

Form Alone

ABSTRACTA feature of thin film reaction that is different from the reaction in bulk samples is the tendency to form a single intermetallic compound rather than all of them which are allowed according to the equilibrium phase diagram. For example, in thin film silicide formation, Pd2Si has been found to form alone and to grow as a layer between Pd and Si. The silicide is stable over a wide temperature range of 100 to 700°C. The phenomenon of single intermetallic compound growth is not unique to silicide formation between transition metal films and silicon, but is also commonly observed in reactions between bimetallic thin films. The phenomenon indicates phase stability.

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Intermetallic Formation in the Aluminum–Copper System

Surface Review and Letters ◽

10.1142/s0218625x03005396 ◽

2003 ◽

Vol 10 (04) ◽

pp. 677-683 ◽

Cited By ~ 20

Author(s):

E. B. Hannech ◽

N. Lamoudi ◽

N. Benslim ◽

B. Makhloufi

Keyword(s):

Electron Microscopy ◽

Phase Diagram ◽

Solid Solution ◽

Intermetallic Layer ◽

Equilibrium Phase ◽

Equilibrium Phase Diagram ◽

Diffusion Couples ◽

Intermetallic Formation ◽

Parabolic Law ◽

Scanning Electron

Intermetallic formation at 425°C in the aluminum–copper system has been studied by scanning electron microscopy using welded diffusion couples. Several Al–Cu phases predicted by the equilibrium phase diagram of the elements and voids taking place in the diffusion zone have been detected in the couples. The predominant phases were found to be Al 2 Cu 3 and the solid solution of Al in Cu, α. The growth of the intermetallic layer obeyed the parabolic law.

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Equilibrium phase diagram of polystyrene and 8CB

Journal of Polymer Science Part B Polymer Physics ◽

10.1002/(sici)1099-0488(19990801)37:15<1841::aid-polb8>3.0.co;2-3 ◽

1999 ◽

Vol 37 (15) ◽

pp. 1841-1848 ◽

Cited By ~ 18

Author(s):

Farida Benmouna ◽

Abdelylah Daoudi ◽

Fr�d�rick Roussel ◽

Jean-Marc Buisine ◽

Xavier Coqueret ◽

...

Keyword(s):

Phase Diagram ◽

Equilibrium Phase ◽

Equilibrium Phase Diagram

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On the recently published Mo-Si equilibrium phase diagram

Journal of Phase Equilibria ◽

10.1007/bf02667799 ◽

1993 ◽

Vol 14 (2) ◽

pp. 136-136

Keyword(s):

Phase Diagram ◽

Equilibrium Phase ◽

Equilibrium Phase Diagram

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Formation of Intermediate Phases and Supersaturated Solid Solution in Al-Cu System during Diffusion

Defect and Diffusion Forum ◽

10.4028/www.scientific.net/ddf.383.31 ◽

2018 ◽

Vol 383 ◽

pp. 31-35 ◽

Cited By ~ 2

Author(s):

Alexey Rodin ◽

Nataliya Goreslavets

Keyword(s):

Phase Diagram ◽

Solid Solution ◽

High Temperature ◽

Chemical Composition ◽

Low Temperature ◽

Supersaturated Solid Solution ◽

Diffusion Processes ◽

Equilibrium Phase ◽

Equilibrium Phase Diagram ◽

Intermediate Phases

The study of diffusion processes in the aluminum - copper system was carried out at the temperature 350 and 520 °C. Special attention was paid on the chemical composition of the system near Al/Cu interface. It was determined that the intermediate phases in the system, corresponding to the equilibrium phase diagram, were not formed at low temperature. At high temperature the intermediate phases forms starting with Cu - rich phases. In both cases supersaturated solid solution of copper in aluminum could be observed near the interface.

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