Growth of Si1−xGex, Strained Layers Using Atmospheric-Pressure CVD

1991 ◽  
Vol 220 ◽  
Author(s):  
F. Namavar ◽  
J. M. Manke ◽  
E. P. Kvam ◽  
M. M. Sanfacon ◽  
C. H. Perry ◽  
...  
Keyword(s):  
Atmospheric Pressure ◽  
Defect Density ◽  
Chemical Vapor ◽  
Good Growth ◽  
X Ray Diffraction ◽  
Strained Layers ◽  
Dislocation Glide ◽  
Transmission Electron ◽  
Pressure Chemical ◽  
Film Defect

ABSTRACTThe objective of this paper is to demonstrate the epitaxial growth of SiGe strained layers using atmospheric-pressure chemical vapor deposition (APCVD). We have grown SiGe layers with various thicknesses and Ge concentrations at temperatures ranging from 800–1000°C. The samples were studied using a variety of methods, including transmission electron microscopy (TEM), high resolution X-ray diffraction (HRXRD) and Raman spectroscopy (RS). Both HRXRD and RS results indicate that samples with about 10% Ge and a thickness of about 1000 Å are almost fully strained. TEM analyses of these samples indicate a film defect density less than 105/cm2. SIMS results indicate that the oxygen concentration in the epitaxial layers is lower than that found in CZ substrates.Our analyses also indicate that as-grown epitaxial Ge layers several microns thick have a defect density less than 107/cm2. The relatively low defect density in both SiGe and Ge layers grown on Si has been attributed to far higher dislocation glide velocity at the relatively elevated growth temperatures employed in CVD and to very good growth cleanliness.

Growth of Silicon-Germanium Alloys by Atmospheric-Pressure Chemical Vapor Deposition at Low Temperatures

1991 ◽  
Vol 220 ◽  
Author(s):  
P. D. Agnello ◽  
T. O. Sedgwick ◽  
M. S. Goorsky ◽  
J. Ott ◽  
T. S. Kuan ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Significant Feature ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Pressure Chemical ◽  
Silicon Growth ◽  
Silicon Germanium Alloys

ABSTRACTDichlorosilanc and germane were used to grow silicon-germanium alloys at temperatures as low as 550°C at atmospheric pressure. Germanium mole fractions as high as 44% were obtained and the layers exhibit smooth surface morphology. Silicon-gcrmanium/silicon multilayers with abrupt hctero-intcrfaccs have been achieved. Cross Section Transmission Electron Microscopy, (XTEM) and High Resolution X-Ray Diffraction, (HRXRD) characterization of the hetero-interface abruptness will be presented. Recent results on two-dimensional (2-D) hole mobility structures grown by this technique will also be reported. Selective growth of silicon-germanium on oxide patterned silicon wafers was also demonstrated. A significant feature of the selective deposition is the lack of faceting at the oxide sidcwall, which has been commonly observed in high temperature silicon growth.

Ge Growth on Nanostructured Silicon Surfaces

2005 ◽  
Vol 862 ◽  
Author(s):  
Ganesh Vanamu ◽  
Abhaya K. Datye ◽  
Saleem H. Zaidi
Keyword(s):  
Electron Microscopy ◽  
Dislocation Density ◽  
Full Width Half Maximum ◽  
Defect Density ◽  
Chemical Vapor ◽  
Silicon Surfaces ◽  
X Ray Diffraction ◽  
Etch Pit ◽  
Transmission Electron

AbstractWe report highest quality Ge epilayers on nanoscale patterned Si structures. 100% Ge films of 10 μm are deposited using chemical vapor deposition. The quality of Ge layers was examined using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and high-resolution x-ray diffraction (HRXRD) measurements. The defect density was evaluated using etch pit density measurements. We have obtained lowest dislocation density (5×105 cm-2) Ge films on the nanopatterned Si structures. The full width half maximum peaks of the reciprocal space maps of Ge epilayers on the nanopatterned Si showed 93 arc sec. We were able to get rid of the crosshatch pattern on the Ge surface grown on the nanopatterned Si. We also showed that there is a significant improvement of the quality of the Ge epilayers in the nanopatterned Si compared to an unpatterned Si. We observed nearly three-order magnitude decrease in the dislocation density in the patterned compared to the unpatterned structures. The Ge epilayer in the patterned Si has a dislocation density of 5×105 cm-2 as compared to 6×108 cm-2 for unpatterned Si.

Assessment of Carbon Contamination in Titanium Nitride Films Deposited from the Reaction of Titanium (IV) Ciiloride and Amines

1993 ◽  
Vol 327 ◽  
Author(s):  
Keith B. Williams ◽  
Ogie Stewart ◽  
Gene P. Reck ◽  
James W. Proscia
Keyword(s):  
Titanium Nitride ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Primary Amines ◽  
Scanning Electron Micrographs ◽  
X Ray Diffraction ◽  
Carbon Contamination ◽  
X Ray ◽  
Infrared Reflectivity ◽  
Pressure Chemical

AbstractThe reaction of titanium (IV) chloride and amines in an atmospheric pressure chemical vapor deposition (APCVD) has been previously shown to produce high quality titanium nitride films. These films were gold in appearance with high infrared reflectivity and resistivities as low as 80 microhm-cm. In the present study, the carbon content of the amines was systematically increased and the carbon levels in the films measured by XPS. For primary amines carbon contamination was not detected. Films deposited from secondary and tertiary amines had measurable carbon contamination. Correlation of carbon contamination with electrical resistivity and infrared reflectivity is discussed. Scanning electron micrographs and x-ray diffraction of the films are presented.

Effect of Ambient Atmosphere on Thin Film Reaction of Si3N4 with Ti

1989 ◽  
Vol 170 ◽  
Author(s):  
Seshu B. Desu ◽  
J. Ashley Taylor
Keyword(s):  
Layer Structure ◽  
Chemical Vapor ◽  
Product Formation ◽  
Ambient Atmosphere ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Pressure Chemical ◽  
Rapid Thermal Annealer ◽  
The Stability ◽  
Increasing Temperature

AbstractThe reaction of sputtered deposited Ti films of 100 nm thick with low pressure chemical vapor deposited Si3N4 films (300 nm thick) was studied in N2 or Ar, in a rapid thermal annealer. Reactions are followed using x-ray diffraction, Auger electron spectroscopy, and transmission electron microscopy. In argon, the Si3N4 and Ti reaction at low temperatures led to the product formation of two layer structure (TiN/Ti5Si3), with some contaminant oxygen and nitrogen released from the reaction uniformly dissolved throughout the remaining unreacted Ti. At higher temperatures, a three layer structure, TiN/TixSiy/TiN, on unreacted Si3N4 was developed. With increasing temperature the value of x and y decreased from 5 to 0 and 3 to 1, respectively. Reactions in N2 ambient, irrespective of temperature, always produced the three layer structure, but the thickness of TixSiy layer was much smaller than that produced in argon ambient for the corresponding temperatures. The reaction mechanism can be explained in terms of relative diffusion coefficients and the stability of the interfaces.

Characterization of polycrystalline silicon carbide films grown by atmospheric pressure chemical vapor deposition on polycrystalline silicon

1998 ◽  
Vol 13 (2) ◽  
pp. 406-412 ◽  
Author(s):  
Christian A. Zorman ◽  
Shuvo Roy ◽  
Chien-Hung Wu ◽  
Aaron J. Fleischman ◽  
Mehran Mehregany
Keyword(s):  
Polycrystalline Silicon ◽  
Chemical Vapor ◽  
Deposition Process ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Polycrystalline Silicon Carbide ◽  
Pressure Chemical ◽  
Temperature Deposition ◽  
Sic Films

X-ray diffraction, transmission electron microscopy, and Rutherford backscattering spectroscopy were used to characterize the microstructure of polycrystalline SiC films grown on as-deposited and annealed polysilicon substrates. For both substrate types, the texture of the SiC films resembles the polysilicon at the onset of SiC growth. During the high temperature deposition process, the as-deposited polysilicon recrystallizes without influencing the crystallinity of the overlying SiC. An investigation of the SiC/polysilicon interface reveals that a heteroepitaxial relationship exists between polysilicon and SiC grains. From this study, a method to control the orientation of highly textured polycrystalline SiC films has been developed.

Low Temperature Lateral Epitaxial Growth of Silicon Carbide on Silicon

2000 ◽  
Vol 622 ◽  
Author(s):  
Chacko Jacob ◽  
Juyong Chung ◽  
Moon-Hi Hong ◽  
Pirouz Pirouz ◽  
Shigehiro Nishino
Keyword(s):  
Epitaxial Growth ◽  
Growth Temperature ◽  
Atmospheric Pressure ◽  
Defect Density ◽  
Chemical Vapor ◽  
High Growth ◽  
Heteroepitaxial Growth ◽  
Oxide Degradation ◽  
Pressure Chemical ◽  
Continued Use

ABSTRACTTo reduce the defect density inherent in conventional heteroepitaxial growth of SiC on Si, selective epitaxy followed by lateral epitaxial growth was performed in a conventional atmospheric pressure chemical vapor deposition (APCVD) system. The source gas was primarily hexamethyldisilane (HMDS). Hydrogen was used as the carrier gas and small amounts of hydrogen chloride (HCl) were added to improve the selectivity. Si(001) wafers, with an oxide layer (∼ 700 nm thick) as a mask, were used as substrates. The grown films were analyzed using optical microscopy and scanning electron microscopy (SEM). In earlier work, we had demonstrated the problems associated with the application of this technique – viz., oxide degradation and high growth temperature. Using HMDS, the growth temperature has been considerably reduced allowing the continued use of an oxide mask. Selective growth was demonstrated in films grown at 1250° and below.

Atmospheric pressure chemical vapor deposition of aluminum nitride thin films at 200–250 °C

1991 ◽  
Vol 6 (1) ◽  
pp. 5-7 ◽  
Author(s):  
Roy G. Gordon ◽  
David M. Hoffman ◽  
Umar Riaz
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Chemical Vapor Deposition ◽  
Aluminum Nitride ◽  
Vapor Deposition ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Rutherford Backscattering ◽  
Transmission Electron ◽  
Pressure Chemical

The atmospheric pressure chemical vapor deposition of aluminum nitride coatings using hexakis(dimethylamido)dialuminum, Al2(NMe2)6, and ammonia precursors is reported. The films were characterized by ellipsometry, transmission electron microscopy, x-ray photoelectron spectroscopy, and Rutherford backscattering spectrometry. The films were deposited at 200–250 °C with growth rates up to 1000 Å/min. They displayed good adhesion to silicon, vitreous carbon, and glass substrates and were chemically inert, except to concentrated hydrofluoric acid. Rutherford backscattering analysis showed that the N/Al ratio ranged from 1.1 to 1.2. Refractive indexes were 1.8–1.9. The films were smooth and amorphous by transmission electron microscopy.

Texture Evolution in Si/SiC Layered Structures Deposited on Si(001) by Chemical Vapor Deposition

1998 ◽  
Vol 13 (9) ◽  
pp. 2632-2642 ◽  
Author(s):  
L-O. Björketun ◽  
L. Hultman ◽  
O. Kordina ◽  
J-E. Sundgren
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Texture Evolution ◽  
Chemical Vapor ◽  
Columnar Structure ◽  
Layer Growth ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Pressure Chemical

Texture evolution in Si/SiC multilayers deposited by atmospheric pressure chemical vapor deposition on carbonized Si(001) substrates was investigated using x-ray diffraction and transmission electron microscopy. SiC layers were epitaxial and (001)-oriented. Si layers deposited on the SiC exhibited a columnar structure with predominantly (110) orientation which could be related to the nucleation. Orientational relationships were Si[111] ║ SiC[110] and Si[112] ║ SiC[110]. Also, a low density of (112)-oriented columns was present. Extensive twinning on the vertical {111} planes within the Si columns led to domains of hexagonal stacking up to 10 nm in size with the presence of 2H-Si and 4H-Si. Subsequent SiC layer growth on the (110)-oriented Si layer resulted in a (110)-oriented SiC layer if the Si layer was carbonized prior to growth.

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