Dissolution of Copper Precipitates in An Fe−1·3Wt%Cu Alloy Under Fe+ Ion Irradiation

1998 ◽  
Vol 540 ◽  
Author(s):  
A. C. Nicol ◽  
M. L. Jenkins ◽  
N. Wanderka ◽  
C. Abromeit
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Room Temperature ◽  
Ion Irradiation ◽  
High Resolution Electron Microscopy ◽  
Cu Alloy ◽  
Transmission Electron ◽  
Resolution Electron ◽  
The Stability

AbstractThe stability of Cu precipitates in an Fe-1.3wt%Cu alloy under 300 keV Fe+ion irradiation has been investigated using transmission electron microscopy and high-resolution electron microscopy. The irradiations were carried out between room temperature and 550°C at displacement rates of 103 to 10−2 dpa(s)−1 to fluences of up to 30 dpa. Copper precipitates were found to keep their shape but decrease in size under all irradiation conditions. The results are discussed within the framework of a competitive process between irradiation induced ballistic destruction of precipitates by cascades and irradiation-enhanced precipitation.

High Resolution Transmission Electron Microscopy of Partial States of Oxygen Order in YBa2Cu3Oz

1990 ◽  
Vol 183 ◽  
Author(s):  
C. P. Burmester ◽  
S. Quong ◽  
L. T. Wille ◽  
R. Gronsky ◽  
B. T. Ahn ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
High Resolution Electron Microscopy ◽  
Contrast Effects ◽  
Oxygen Loss ◽  
Transmission Electron ◽  
Resolution Electron ◽  
Out Of Plane ◽  
Partial States

AbstractHigh resolution electron microscopy is used to investigate the effect of electron irradiation induced oxygen loss on the states of partial order in YBa2Cu3Oz. Contrast effects visible in the [001] zone image as a result of the degree of the out-of-plane correlation of these ordered states are investigated. Using statistical simulations to aid in the analysis of the HREM images, an interpretation based on a kinetically limited evolution of the variation of long range [001] ordering is proposed.

Transmission electron microscopy study of Co/Pd and Co/Au multilayers

1993 ◽  
Vol 8 (5) ◽  
pp. 1019-1027 ◽  
Author(s):  
F. Hakkens ◽  
A. De Veirman ◽  
W. Coene ◽  
Broeder F.J.A. den
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
High Resolution Electron Microscopy ◽  
Microscopy Study ◽  
Columnar Structure ◽  
Electron Microscopy Study ◽  
Misfit Dislocations ◽  
Transmission Electron ◽  
Resolution Electron

The structure of Co/Pd and Co/Au (111) multilayers is studied using transmission electron microscopy and high resolution electron microscopy. We focused on microstructure, atomic stacking (especially at the interfaces), and coherency, as these are structural properties that have considerable magnetic effects. A columnar structure with a strong curvature of the multilayer influenced by substrate temperature during growth is observed. High resolution imaging shows numerous steps at the interfaces of the multilayer structure and the presence of misfit dislocations. In bright-field images, periodic contrast fringes are observed at these interfaces as the result of moiré interference. These moiré fringes are used to study the misfit relaxation at the interfaces, whereas electron diffraction gives the average relaxation over the whole layer. Both measurements determined that, for Co/Pd as well as Co/Au multilayers, 80–85% of the misfit is relaxed and 20–15% remains in the form of strain, independent of the Co layer thickness in the regime studied.

Grain Boundary Transformations in Bi-Doped Copper

1991 ◽  
Vol 238 ◽  
Author(s):  
Elsie C. Urdaneta ◽  
David E. Luzzi ◽  
Charles J. McMahon
Keyword(s):  
Electron Microscopy ◽  
Heat Treatment ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Treatment Time ◽  
High Resolution Electron Microscopy ◽  
Transmission Electron ◽  
Resolution Electron

ABSTRACTBismuth-induced grain boundary faceting in Cu-12 at ppm Bi polycrystals was studied using transmission electron microscopy (TEM). The population of faceted grain boundaries in samples aged at 600°C was observed to increase with heat treatment time from 15min to 24h; aging for 72h resulted in de-faceting, presumably due to loss of Bi from the specimen. The majority of completely faceted boundaries were found between grains with misorientation Σ=3. About 65% of the facets of these boundaries were found to lie parallel to crystal plane pairs of the type {111}1/{111]2- The significance of these findings in light of recent high resolution electron microscopy experiments is discussed.

Structural Characterisation of Fe-Cu Multilayers of Differing Fe Thicknesses Using Transmission Electron Microscopy

1995 ◽  
Vol 382 ◽  
Author(s):  
S. J. Lloyd ◽  
R. E. Somekh ◽  
W. M. Stobbs
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Elasticity Theory ◽  
Multilayer Structure ◽  
High Resolution Electron Microscopy ◽  
Structural Characterisation ◽  
Transmission Electron ◽  
Resolution Electron ◽  
Out Of Plane

ABSTRACTIn-plane and out-of-plane lattice parameters were measured in a series of coherent Fe-Cu multilayers using non-axial high resolution electron microscopy (HREM). The results indicate that the multilayers are tetragonally distorted with the magnitude of the distortion varying with the thickness of the Fe component. These distortions preclude an understanding of the multilayer structure in terms of conventional elasticity theory. The breakdown of epitaxy for thicker Fe layers was also investigated and it was found that the b.c.c. Fe grew with [110] parallel to [001] of the coherent f.c.c. multilayer.

Structure of the ∑=3 (111) Grain Boundary in Cu-1.5%Sb

1992 ◽  
Vol 295 ◽  
Author(s):  
Richard W. Fonda ◽  
David E. Luzzi
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Auger Electron ◽  
Preliminary Investigation ◽  
High Resolution Electron Microscopy ◽  
Transmission Electron ◽  
Resolution Electron

AbstractGrain boundaries in quenched and aged Cu-i.5%Sb were examined with Auger electron microscopy, transmission electron microscopy, and high resolution electron microscopy. The ∑=3 grain boundaries are strongly faceted, with the facets lying primarily along the coincident (111) planes of the two grains. The grain boundaries are enriched in antimony, as demonstrated by both AES and HREM. HREM images of the ∑=3 (111) ║ (111) grain boundary differ from those of the Cu-Bi ∑ =3 (111) ║ (111) grain boundary in the lack of a significant grain boundary expansion to accommodate the excess solute at the boundary. A preliminary investigation of the atomic structure of the ∑=3 (111) ║ (111) facet by HREM and multislice calculations is presented.

Tem Structure Characterization Of Ti/Al and Ti/Al/Ni/Au Ohmic Contacts For n-GaN

1996 ◽  
Vol 423 ◽  
Author(s):  
S. Ruvimov ◽  
Z. Liliental-Weber ◽  
J. Washburn ◽  
K. J. Duxstad ◽  
E. E. Hailer ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Ohmic Contacts ◽  
High Resolution Electron Microscopy ◽  
Structure Characterization ◽  
Transmission Electron ◽  
Resolution Electron ◽  
Thin Polycrystalline

AbstractTransmission electron microscopy has been applied to characterize the structure of Ti/Al and Ti/Al/Ni/Au ohmic contacts on n-type GaN (˜1017 cm−3 ) epitaxial layers. A thin polycrystalline cubic TiN layer epitaxially matched to the (0001) GaN surface was detected at the interface with the GaN substrate. This layer was studied in detail by electron diffraction and high resolution electron microscopy. The orientation relationship between the cubic TiN and the GaN was found to be: {111}TiN//{00.1}GaN, [110]TiN//[11.0]GaN, [112 ]TiN//[ 10.0]GaN. The formation of this cubic TiN layer results in an excess of N vacancies in the GaN close to the interface which is considered to be the reason for the low resistance of the contact.

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