Investigations of Fe-Cr Ferritic Steels as Sofc Interconnect Material

1999 ◽  
Vol 575 ◽  
Author(s):  
S. Linderoth ◽  
P. H. Larsen
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
Contact Resistance ◽  
Room Temperature ◽  
Electrical Contact ◽  
Ferritic Steels ◽  
Scale Growth ◽  
Electrical Contact Resistance ◽  
Cr Content ◽  
Interconnect Material

ABSTRACTPure Fe-Cr alloys with a Cr-content between zero and 60 wt% have been investigated with respect to their thermal expansion from room temperature to 1100°C and their corrosion resistance in air and humidified hydrogen up to 1300'C. The thermal expansion coefficient of the ferritic Fe-Cr steels is close to that of the supports used in the manufacture of thin-electrolyte cells. The corrosion resistance in air and humidified hydrogen appears to be best for a Cr content around 20 wt%. In addition, a ceria coating is found to reduce significantly the scale growth. Preliminary results for a Fe78Cr22 foil indicates that an electrical contact resistance less than 3 mQcm2 can be obtained between the alloy and a Ni/YSZ anode.

Effect of Se Content in High-Cyanide Silver Plating Solution on {200} Crystal Plane Orientation Ratio of Electrodeposited Silver Layer

2014 ◽  
Vol 783-786 ◽  
pp. 1458-1463 ◽  
Author(s):  
Hiroshi Miyazawa ◽  
Masafumi Ogata ◽  
Keisuke Shinohara ◽  
Akira Sugawara ◽  
Ikuo Shohji
Keyword(s):  
Crystal Structure ◽  
Contact Resistance ◽  
Room Temperature ◽  
Electrical Contact ◽  
Xrd Analysis ◽  
Silver Layer ◽  
Electrical Contact Resistance ◽  
Plating Solution ◽  
Heating Test ◽  
The Relationship

Electrodeposited silver layers obtained from high-cyanide silver plating solution are widely applied for connectors and switches of automobiles. However, few groups have discussed the relationship between the crystal structure of silver layers and their properties. In this study, the effect of the concentration of Se, added as a brightener to high-cyanide silver plating solution, was investigated by XRD and EBSD analysis for electrodeposited silver layers with {200} orientation. By optimizing the concentration of Se in the silver plating solution, the {200} orientation ratio of the silver layer was increased to as high as 94%. Since the diffusion of Cu from the Cu substrate used in this study into the silver layer was inhibited, the silver layer with the high {200} orientation ratio exhibited good electrical contact resistance of the surface of 1.3mΩ after a heating test performed at 200°C for 74h. In addition, the silver layer had good bend formability. The results of XRD analysis confirmed that the recrystallization of the electrodeposited silver layer occurred at room temperature within several hours, thus increasing the {200} orientation ratio of the silver layer.

Discrete drops in the electrical contact resistance during nanoindentation of a bulk metallic glass

2016 ◽  
Vol 108 (18) ◽  
pp. 181903 ◽  
Author(s):  
Gaurav Singh ◽  
R. L. Narayan ◽  
A. M. Asiri ◽  
U. Ramamurty
Keyword(s):  
Metallic Glass ◽  
Contact Resistance ◽  
Bulk Metallic Glass ◽  
Electrical Contact ◽  
Electrical Contact Resistance
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