MORPHOLOGICAL INSTABILITY OF ALLOY SOLIDIFICATION-ASYMPTOTIC ANALYSIS AND GENERALIZATION OF THE MULLINS-SEKERKA THEORY

1998 ◽  
Author(s):  
Jin-Young Jung ◽  
Michael M. Chen
Keyword(s):  
Asymptotic Analysis ◽  
Morphological Instability ◽  
Alloy Solidification

Finite volume and spectral methods applied to Pb-30%TI alloy solidification

2001 ◽  
Vol 11 (PR6) ◽  
pp. Pr6-151-Pr6-159 ◽  
Author(s):  
R. Guérin ◽  
M. El Ganaoui ◽  
P. Haldenwang ◽  
P. Bontoux
Keyword(s):  
Finite Volume ◽  
Spectral Methods ◽  
Ti Alloy ◽  
Alloy Solidification

Electrodeposition of Strained-Layer Superlattices

1996 ◽  
Vol 451 ◽  
Author(s):  
T. P. Moffat
Keyword(s):  
Charge Transfer ◽  
Mass Transport ◽  
Structural Evolution ◽  
Iron Group ◽  
Morphological Instability ◽  
Group Metal ◽  
Iron Group Metal ◽  
Transport Control ◽  
Strained Layer Superlattices ◽  
Interfacial Charge

ABSTRACTA variety of Cu/(Ni, Co) multilayers have been grown on Cu single crystals by pulse plating from an alloy electroplating bath. Copper is deposited under mass transport control while the iron group metal is deposited under interfacial charge transfer control. The structural evolution of these films is influenced by the morphological instability of the mass transport limited copper deposition reaction and the development of growth twins during iron-group metal deposition. Specular films have been obtained for growth on Cu(100) while rough, defective films were typically obtained for growth on Cu(111) and Cu(110).

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