scholarly journals Enabling Technologies for Effective Deployment of Internet of Things (IoT) Systems

2020 ◽  
Vol 2 (4) ◽  
pp. 21
Author(s):  
Jamil Y. Khan ◽  
Dong Chen ◽  
Oliver Hulin
Keyword(s):  
Internet Of Things ◽  
Network Design ◽  
Network Architecture ◽  
Large Scale ◽  
Ieee 802.15.4 ◽  
Low Cost ◽  
Large Area ◽  
Coverage Area ◽  
Enabling Technologies ◽  
Networking Technologies

The demand for IoT (Internet of Things) systems that encompass cloud computing, the multitude of low power sensing and data collection electronic devices and distributed communications architecture is increasing at an exponential pace. With increasing interests from different industrial, business and social groups, in the near future it will be necessary to support massive deployment of diverse IoT systems in different geographical areas. Large scale deployment of IoT systems will introduce challenging problems for the communication designers, as the networking is one of the key enabling technologies for the IoT systems. Major challenges include cost effective network architecture, support of large area of coverage and diverse QoS (Quality of Service) requirements, reliability, spectrum requirements, energy requirements, and many other related issues. The paper initially reviews different classes of IoT applications and their communication requirements. Following the review, different communications and networking technologies that can potentially support large scale deployment of IoT systems for different industrial, business and social applications are discussed. The paper then concentrates on wireless networking technologies for IoT systems with specific focus on deployment issues. The deployment discussion concentrates on different IoT systems QoS and networking requirements, cost, coverage area and energy supply requirements. We introduce a sustainable low cost heterogeneous network design using short range radio standards such as IEEE 802.15.4/Zigbee, IEEE 802.11/WLAN that can be used to develop a wide area networks to support large number of IoT devices for various applications. Finally the paper makes some general recommendations towards sustainable network design techniques for future IoT systems that can reduce the OPEX and CAPEX requirements.

scholarly journals Analysis and Enhancement of IEEE 802.15.4e DSME Beacon Scheduling Model

2014 ◽  
Vol 2014 ◽  
pp. 1-15 ◽  
Author(s):  
Kwang-il Hwang ◽  
Sung-wook Nam
Keyword(s):  
Internet Of Things ◽  
Large Scale ◽  
Ieee 802.15.4 ◽  
Design Model ◽  
Abstract Model ◽  
Modes Of Operation ◽  
Network Construction ◽  
Scheduling Model ◽  
And Performance ◽  
Ieee 802.15.4E

In order to construct a successful Internet of things (IoT), reliable network construction and maintenance in a sensor domain should be supported. However, IEEE 802.15.4, which is the most representative wireless standard for IoT, still has problems in constructing a large-scale sensor network, such as beacon collision. To overcome some problems in IEEE 802.15.4, the 15.4e task group proposed various different modes of operation. Particularly, the IEEE 802.15.4e deterministic and synchronous multichannel extension (DSME) mode presents a novel scheduling model to solve beacon collision problems. However, the DSME model specified in the 15.4e draft does not present a concrete design model but a conceptual abstract model. Therefore, in this paper we introduce a DSME beacon scheduling model and present a concrete design model. Furthermore, validity and performance of DSME are evaluated through experiments. Based on experiment results, we analyze the problems and limitations of DSME, present solutions step by step, and finally propose an enhanced DSME beacon scheduling model. Through additional experiments, we prove the performance superiority of enhanced DSME.

scholarly journals LoRaWAN Mesh Networks: A Review and Classification of Multihop Communication

Sensors ◽  
2020 ◽  
Vol 20 (15) ◽  
pp. 4273
Author(s):  
Jeferson Rodrigues Cotrim ◽  
João Henrique Kleinschmidt
Keyword(s):  
Large Scale ◽  
Simulation Analysis ◽  
Mesh Networks ◽  
Smart Cities ◽  
Low Cost ◽  
Wide Area ◽  
Area Network ◽  
Full Potential ◽  
Wide Area Network ◽  
Coverage Area

The growth of the Internet of Things (IoT) led to the deployment of many applications that use wireless networks, like smart cities and smart agriculture. Low Power Wide Area Networks (LPWANs) meet many requirements of IoT, such as energy efficiency, low cost, large coverage area, and large-scale deployment. Long Range Wide Area Network (LoRaWAN) networks are one of the most studied and implemented LPWAN technologies, due to the facility to build private networks with an open standard. Typical LoRaWAN networks are single-hop in a star topology, composed of end-devices that transmit data directly to gateways. Recently, several studies proposed multihop LoRaWAN networks, thus forming wireless mesh networks. This article provides a review of the state-of-the-art multihop proposals for LoRaWAN. In addition, we carried out a comparative analysis and classification, considering technical characteristics, intermediate devices function, and network topologies. This paper also discusses open issues and future directions to realize the full potential of multihop networking. We hope to encourage other researchers to work on improving the performance of LoRaWAN mesh networks, with more theoretical and simulation analysis, as well as practical deployments.

scholarly journals An Efficient Superframe Structure with Optimal Bandwidth Utilization and Reduced Delay for Internet of Things Based Wireless Sensor Networks

Sensors ◽  
2020 ◽  
Vol 20 (7) ◽  
pp. 1971 ◽  
Author(s):  
Sangrez Khan ◽  
Ahmad Naseem Alvi ◽  
Muhammad Awais Javed ◽  
Byeong-hee Roh ◽  
Jehad Ali
Keyword(s):  
Wireless Sensor Networks ◽  
Sensor Networks ◽  
Internet Of Things ◽  
Large Scale ◽  
Ieee 802.15.4 ◽  
Fine Tuning ◽  
Wireless Sensor ◽  
Bandwidth Utilization ◽  
Iot Applications ◽  
Ieee 802.15.4 Standard

Internet of Things (IoT) is a promising technology that uses wireless sensor networks to enable data collection, monitoring, and transmission from the physical devices to the Internet. Due to its potential large scale usage, efficient routing and Medium Access Control (MAC) techniques are vital to meet various application requirements. Most of the IoT applications need low data rate and low powered wireless transmissions and IEEE 802.15.4 standard is mostly used in this regard which offers superframe structure at the MAC layer. However, for IoT applications where nodes have adaptive data traffic, the standard has some limitations such as bandwidth wastage and latency. In this paper, a new superframe structure is proposed that is backward compatible with the existing parameters of the standard. The proposed superframe overcomes limitations of the standard by fine-tuning its superframe structure and squeezing the size of its contention-free slots. Thus, the proposed superframe adjusts its duty cycle according to the traffic requirements and accommodates more nodes in a superframe structure. The analytical results show that our proposed superframe structure has almost 50% less delay, accommodate more nodes and has better link utilization in a superframe as compared to the IEEE 802.15.4 standard.

Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits

2014 ◽  
Author(s):  
Yi Zheng ◽  
Zhi-Zhu He ◽  
Jun Yang ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Large Scale ◽  
High Efficiency ◽  
Printed Electronics ◽  
Low Cost ◽  
Treatment Temperature ◽  
Consumer Electronics ◽  
Plastic Substrate ◽  
Electronic Circuits ◽  
Large Area

The advancement of printed electronics technology has significantly facilitated the development of electronic engineering. However, so far there still remain big barriers to impede the currently available printing technologies from being extensively used. Many of the difficulties came from the factors like: complicated ink-configurations, high post-treatment temperature, poor conductivity in room temperature and extremely high cost and time consuming fabrication process. From an alternative strategy, our recently invented desktop liquid metal printer offered a flexible way to better address the above deficiencies. Through modifying the system developed in the authors’ lab, here we demonstrated the feasibility of the method in quickly and reliably printing out various large area electronic circuits. Particularly, the liquid metal ink made of GaIn24.5 alloy, with a high electrical resistivity of 2.98×10−7 Ω·m, can be rapidly printed on polyvinyl chloride (PVC) substrate with maximum sizes spanning from centimeter size to meter large. Most important of all, all these manufactures were achieved at an extremely low cost level which clearly shows the ubiquitous value of the liquid metal printer. To evaluate the working performance of the present electronics fabrication method, the electrical resistance and wire width of the printed circuits were investigated under multiple overprinting cycles. For practical illustration purpose, LED lighting conductive patterns which can serve as a functional electronic decoration art were fabricated on the flexible plastic substrate. The present work sets up an example for directly making large-scale ending consumer electronics via a high-efficiency and low-cost way.

scholarly journals Development of a highly controlled system for large-area, directional printing of quasi-1D nanomaterials

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Adamos Christou ◽  
Fengyuan Liu ◽  
Ravinder Dahiya
Keyword(s):  
High Performance ◽  
Large Scale ◽  
Low Cost ◽  
Large Area ◽  
Sem Images ◽  
Contact Printing ◽  
Controlled System ◽  
Printing System ◽  
Sliding Distance ◽  
Novel Design

AbstractPrinting is a promising method for the large-scale, high-throughput, and low-cost fabrication of electronics. Specifically, the contact printing approach shows great potential for realizing high-performance electronics with aligned quasi-1D materials. Despite being known for more than a decade, reports on a precisely controlled system to carry out contact printing are rare and printed nanowires (NWs) suffer from issues such as location-to-location and batch-to-batch variations. To address this problem, we present here a novel design for a tailor-made contact printing system with highly accurate control of printing parameters (applied force: 0–6 N ± 0.3%, sliding velocity: 0–200 mm/s, sliding distance: 0–100 mm) to enable the uniform printing of nanowires (NWs) aligned along 93% of the large printed area (1 cm2). The system employs self-leveling platforms to achieve optimal alignment between substrates, whereas the fully automated process minimizes human-induced variation. The printing dynamics of the developed system are explored on both rigid and flexible substrates. The uniformity in printing is carefully examined by a series of scanning electron microscopy (SEM) images and by fabricating a 5 × 5 array of NW-based photodetectors. This work will pave the way for the future realization of highly uniform, large-area electronics based on printed NWs.

scholarly journals Compact Extensible Authentication Protocol for the Internet of Things: Enabling Scalable and Efficient Security Commissioning

2015 ◽  
Vol 2015 ◽  
pp. 1-11 ◽  
Author(s):  
Marcin Piotr Pawlowski ◽  
Antonio J. Jara ◽  
Maciej J. Ogorzalek
Keyword(s):  
Internet Of Things ◽  
Large Scale ◽  
Ieee 802.15.4 ◽  
Substantial Reduction ◽  
Authentication Protocol ◽  
Network Resource ◽  
Maintenance Time ◽  
Network Usage ◽  
The Internet Of Things ◽  
Extensible Authentication Protocol

Internet of Things security is one of the most challenging parts of the domain. Combining strong cryptography and lifelong security with highly constrained devices under conditions of limited energy consumption and no maintenance time is extremely difficult task. This paper presents an approach that combines authentication and bootstrapping protocol (TEPANOM) with Extensible Authentication Protocol (EAP) framework optimized for the IEEE 802.15.4 networks. The solution achieves significant reduction of network resource usage. Additionally, by application of EAP header compacting approach, further network usage savings have been reached. The EAP-TEPANOM solution has achieved substantial reduction of 42% in the number of transferred packets and 35% reduction of the transferred data. By application of EAP header compaction, it has been possible to achieve up to 80% smaller EAP header. That comprises further reduction of transferred data for 3.84% for the EAP-TEPANOM method and 10% for the EAP-TLS-ECDSA based methods. The results have placed the EAP-TEPANOM method as one of the most lightweight EAP methods from ones that have been tested throughout this research, making it feasible for large scale deployments scenarios of IoT.

scholarly journals Large Area Graphene Deposition on Hydrophobic Surfaces, Flexible Textiles, Glass Fibers and 3D Structures

Coatings ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 183 ◽  
Author(s):  
Guobin Jia ◽  
Jonathan Plentz ◽  
Jan Dellith ◽  
Andrea Dellith ◽  
Ruri Wahyuono ◽  
...  
Keyword(s):  
Self Assembly ◽  
Glass Substrate ◽  
Large Scale ◽  
Low Cost ◽  
Glass Fibers ◽  
Flat Glass ◽  
Peel Test ◽  
Large Area ◽  
Thin Glass ◽  
Graphene Flakes

Graphene and its derivatives have many superior electrical, thermal, mechanical, chemical, and structural properties, and promise for many applications. One of the issues for scalable applications is the lack of a simple, reliable method that allows the deposit of a well-ordered monolayer using low-cost graphene flakes onto target substrates with different surface properties. Another issue is the adhesion of the deposited graphene thin film, which has not been well investigated yet. Following our former finding of a double self-assembly (DSA) process for efficient deposition of a monolayer of graphene flakes (MGFs), in this work we demonstrate that the DSA process can be applied even on very challenging samples including highly hydrophobic polytetrafluoroethylene (PTFE), flexible textiles, complex 3D objects, and thin glass fibers. Additionally, we tested adhesion of the graphene flakes on the flat glass substrate by scotch tape peel test of the MGFs. The results show that the graphene flakes adhere quite well on the flat glass substrate and most of the graphene flakes stay on the glass. These findings may trigger many large-scale applications of low-cost graphene feedstocks and other 2D materials.

Wireless mesh networks

2008 ◽  
Vol 14 (8) ◽  
pp. 401-403 ◽  
Author(s):  
Xinheng Wang
Keyword(s):  
Wireless Networks ◽  
Large Scale ◽  
Ad Hoc ◽  
Mesh Networks ◽  
Low Cost ◽  
Mesh Network ◽  
Self Healing ◽  
Large Area ◽  
Satellite Systems ◽  
Wireless Mesh

Wireless telemedicine using GSM and GPRS technologies can only provide low bandwidth connections, which makes it difficult to transmit images and video. Satellite or 3G wireless transmission provides greater bandwidth, but the running costs are high. Wireless networks (WLANs) appear promising, since they can supply high bandwidth at low cost. However, the WLAN technology has limitations, such as coverage. A new wireless networking technology named the wireless mesh network (WMN) overcomes some of the limitations of the WLAN. A WMN combines the characteristics of both a WLAN and ad hoc networks, thus forming an intelligent, large scale and broadband wireless network. These features are attractive for telemedicine and telecare because of the ability to provide data, voice and video communications over a large area. One successful wireless telemedicine project which uses wireless mesh technology is the Emergency Room Link (ER-LINK) in Tucson, Arizona, USA. There are three key characteristics of a WMN: self-organization, including self-management and self-healing; dynamic changes in network topology; and scalability. What we may now see is a shift from mobile communication and satellite systems for wireless telemedicine to the use of wireless networks based on mesh technology, since the latter are very attractive in terms of cost, reliability and speed.

CuInSe2 Thin Film Modules for Utility Applications

1994 ◽  
Vol 116 (1) ◽  
pp. 25-27
Author(s):  
C. Fredric ◽  
D. Tarrant ◽  
C. Jensen ◽  
J. Hummel ◽  
J. Ermer
Keyword(s):  
Thin Film ◽  
Large Scale ◽  
Low Cost ◽  
Single Crystal Silicon ◽  
Outdoor Exposure ◽  
Production Costs ◽  
Scale Production ◽  
Large Area ◽  
Crystal Silicon ◽  
Thin Film Fabrication

Recent advances in the efficiency and manufacturing technology of CuInSe2 (CIS) thin films demonstrate the opportunity for low-cost large-scale production of photovoltaics for utility applications. Large area (0.4 m2) submodules with 9.7 percent aperture efficiencies yielding 37.8 watts have been fabricated. Thin film fabrication techniques used in the production of modules enable reduced production costs compared with those for single crystal silicon. The performance of 0.4 m2 modules is projected to exceed 50 watts, based on performance achieved to date on 0.1 m2 modules and small area test devices. Preliminary tests packaged (encapsulated and framed) modules show no significant losses after 15 1/2 months of continuous outdoor exposure. Fabrication of 0.4 m2 modules to demonstrate the feasibility of large-scale commercialization of CIS thin film photovoltaics for utility applications is currently under way.

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