Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30°C60%RH

2019 ◽  
Author(s):  
Akira Saito ◽  
Hiroshi Nishikawa
Keyword(s):  
Growth Mechanism ◽  
Whisker Growth ◽  
Tin Whisker ◽  
Tin Plating

scholarly journals An investigation of tin whisker growth over a 32-year period

Circuit World ◽  
2016 ◽  
Vol 42 (4) ◽  
pp. 183-196 ◽  
Author(s):  
Mark Andrew Ashworth ◽  
Barrie Dunn
Keyword(s):  
Cross Sections ◽  
Whisker Growth ◽  
Tin Whisker ◽  
Content Type ◽  
Intermetallic Formation ◽  
Time Period ◽  
Whisker Length ◽  
Electron Microscopy Analysis ◽  
Long Time ◽  
Tin Plating

Purpose This paper aims to present the results of a 32-year-old laboratory study of whisker growth from tin electrodeposits that was originally undertaken to gain an increased understanding of the phenomenon of tin whisker growth. Design/methodology/approach Whisker growth was evaluated using electroplated C-rings (both stressed and un-stressed) that were stored throughout in a desiccator at room temperature. Analysis has recently been undertaken to evaluate whisker growth and intermetallic growth after 32 years of storage. Scanning electron microscopy analysis has been performed to investigate whisker length and, using polished cross-sections, the morphology, thickness and type of intermetallic formation. Findings Normal tin-plated deposits on brass and steel with a copper barrier layer nucleated whiskers within five months, and in each case, these grew to lengths between 1 and 4.5 mm. For normal tin electroplated onto brass, a one- or two-month nucleation period was needed before whiskers developed. They reached a maximum length of about 1.5 mm after six months, and little or no further growth occurred during the subsequent 32 years. Very few whiskers grew on the tin-plated steel samples and no intermetallic formation was observed. None of the fused tin plating samples nucleated whiskers during the 32-year period. Practical implications Knowledge about vintage whiskers is important to take steps to increase the resiliency of space missions. Similarly, such knowledge is important to engineers engaged in products reaching their nominal end-of-life, but where, for reasons of economy, these products cannot be replaced. Originality/value This study represents a unique insight into whisker growth and intermetallic formation over an extremely long time period.

scholarly journals The Effects of Humidity on Tin Whisker Growth by Immersion Tin Plating and Tin Solder Dipping Surface Finishes

2015 ◽  
Vol 2 ◽  
pp. 275-279 ◽  
Author(s):  
Hooi Peng Lim ◽  
Ali Ourdjini ◽  
Tuty Asma Abu Bakar ◽  
Tuquabo Tesfamichael
Keyword(s):  
Whisker Growth ◽  
Tin Whisker ◽  
Surface Finishes ◽  
Tin Plating ◽  
Immersion Tin

Confining effect of oxide film on tin whisker growth

2019 ◽  
Vol 35 (8) ◽  
pp. 1735-1739 ◽  
Author(s):  
Yushuang Liu ◽  
Peigen Zhang ◽  
Jin Yu ◽  
Jian Chen ◽  
Yamei Zhang ◽  
...  
Keyword(s):  
Oxide Film ◽  
Whisker Growth ◽  
Tin Whisker ◽  
Confining Effect

scholarly journals Identification of Tin Whisker Growth on Tin Plated Copper Substrate

2017 ◽  
Vol 23 (S1) ◽  
pp. 1772-1773
Author(s):  
A. Knight ◽  
H. Aglan ◽  
D. Burdick
Keyword(s):  
Whisker Growth ◽  
Copper Substrate ◽  
Tin Whisker

μ-CT investigation of tin whisker growth mechanisms

2020 ◽  
Vol 15 (02) ◽  
pp. C02043-C02043
Author(s):  
S. Hasn ◽  
D. Vavrik ◽  
K. Dusek ◽  
M. Pichotka
Keyword(s):  
Whisker Growth ◽  
Growth Mechanisms ◽  
Tin Whisker

scholarly journals The effect of different post-electroplating surface modification treatments on tin whisker growth

2019 ◽  
Vol 97 (3) ◽  
pp. 129-139
Author(s):  
D. M. Haspel ◽  
M. A. Ashworth ◽  
G. D. Wilcox ◽  
X. Bao ◽  
R. J. Mortimer
Keyword(s):  
Surface Modification ◽  
Whisker Growth ◽  
Tin Whisker

Tin whisker growth on immiscible Al–Sn alloy

2019 ◽  
Vol 31 (2) ◽  
pp. 1328-1334 ◽  
Author(s):  
Yan Zhang ◽  
Peigen Zhang ◽  
Wei He ◽  
Zhengming Sun
Keyword(s):  
Whisker Growth ◽  
Tin Whisker
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