2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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115
(FIVE YEARS 115)

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Published By IEEE

9780956808660
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Metalization impact on heat transfer through sintered nanosilver based thermal joints

2019 ◽  
Author(s):  
Krzvsztof Stojek ◽  
Jan Felba ◽  
Przemyslaw Matkowski ◽  
Damian Nowak ◽  
Mateusz Kanus ◽  
...  
Keyword(s):  
Heat Transfer

An approach for failure prediction in H3 TRB-tests

2019 ◽  
Author(s):  
Elisabeth Kolbinger ◽  
Felix Wuest ◽  
Marius van Dijk ◽  
Stefan Trampert ◽  
Klaus-Dieter Lang
Keyword(s):  
Failure Prediction
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