Solder joint reliability analysis for large size WLCSP

2017 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2017.7939325 ◽

2017 ◽

Cited By ~ 8

Author(s):

Meng-Kai Shih ◽

Hsin-Chih Shih ◽

Ying-Chih Lee ◽

David Tamg ◽

C P Hung

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Large Size

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Solder joint reliability analysis of wafer level CSP

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ◽

10.1109/nordpac.2017.7993179 ◽

2017 ◽

Cited By ~ 1

Author(s):

Yin Wen ◽

Liu Hai Yan ◽

Lin Tingyu ◽

Aaron Zhang Feng ◽

Li Ming Yu

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Wafer Level ◽

Solder Joint Reliability ◽

Joint Reliability

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Application of artificial neural network in thermal and solder joint reliability analysis for stacked dies LBGA

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507805 ◽

2008 ◽

Cited By ~ 1

Author(s):

R.C Law ◽

I.A Azid

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Solder Joint ◽

Reliability Analysis ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Artificial Neural

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Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages

Microelectronics Reliability ◽

10.1016/j.microrel.2004.04.019 ◽

2004 ◽

Vol 44 (12) ◽

pp. 1957-1965 ◽

Cited By ~ 37

Author(s):

Tong Yan Tee ◽

Zhaowei Zhong

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Bga Packages ◽

Board Level

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Lead-free 96.5Sn-3.5Ag flip chip solder joint reliability analysis

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ◽

10.1109/itherm.2004.1318275 ◽

2004 ◽

Cited By ~ 7

Author(s):

J.H.L. Pang ◽

A. Yeo ◽

T.H. Low ◽

F.X. Che

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Flip Chip ◽

Lead Free ◽

Solder Joint Reliability ◽

Joint Reliability

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Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Microelectronics Reliability ◽

10.1016/j.microrel.2007.05.009 ◽

2008 ◽

Vol 48 (4) ◽

pp. 602-610 ◽

Cited By ~ 14

Author(s):

Xiaowu Zhang ◽

Vaidyanathan Kripesh ◽

T.C. Chai ◽

Teck Chun Tan ◽

D. Pinjala

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Wafer Level ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Fine Pitch ◽

Board Level ◽

Wafer Level Package

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Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2006.875893 ◽

2006 ◽

Vol 29 (2) ◽

pp. 355-363 ◽

Cited By ~ 33

Author(s):

A. Yeo ◽

C. Lee ◽

J.H.L. Pang

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Flip Chip ◽

Constitutive Models ◽

Solder Joint Reliability ◽

Elastic Plastic ◽

Joint Reliability ◽

Plastic Creep

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Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

IEEE Transactions on Advanced Packaging ◽

10.1109/6040.982836 ◽

2001 ◽

Vol 24 (2) ◽

pp. 499-506 ◽

Cited By ~ 64

Author(s):

J.H.L. Pang ◽

D.Y.R. Chong

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Flip Chip ◽

Solder Joint Reliability ◽

Joint Reliability

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Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assembly

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ◽

10.1109/itherm.2004.1318270 ◽

2004 ◽

Cited By ~ 10

Author(s):

J.H.L. Pang ◽

P.T.H. Low ◽

B.S. Xiong

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Lead Free ◽

Solder Joint Reliability ◽

Joint Reliability

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Board-Level Solder Joint Reliability Analysis of Thermally Enhanced BGAs and LGAs

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2006.874699 ◽

2006 ◽

Vol 29 (2) ◽

pp. 284-290 ◽

Cited By ~ 12

Author(s):

T.Y. Tee ◽

H.S. Ng ◽

Z. Zhong ◽

J. Zhou

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Board Level

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Parametric Design and Solder Joint Reliability Analysis of A Fine Pitch Cu Post Type Wafer Level Package (WLP)

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614386 ◽

2006 ◽

Cited By ~ 2

Author(s):

Xiaowu Zhang ◽

V. Kripesh ◽

T.C. Chai ◽

Teck Chun Tan ◽

D. Pinjala ◽

...

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Parametric Design ◽

Wafer Level ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Fine Pitch ◽

Wafer Level Package

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