2017 International Conference on Electronics Packaging (ICEP)
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Encapsulation processes and materials for advanced package

2017 ◽  
Author(s):  
Joji Yukimaru ◽  
Yuki Ishikawa ◽  
Tomoya Takao ◽  
Kazuhiro Ikeda ◽  
Akira Nakao

Reducing technique of sidelobe in millimeter wave beam multiplexing system

2017 ◽  
Author(s):  
Shohei Ishikawa ◽  
Atsushi Honda ◽  
Toshihiro Shimura ◽  
Yoji Ohashi ◽  
Masahiko Shimizu
Keyword(s):  
Millimeter Wave ◽  
Wave Beam

Trends in Fan-out wafer and panel level packaging

2017 ◽  
Author(s):  
Tanja Braun ◽  
Karl-Friedrich Becker ◽  
Markus Wohrmann ◽  
Michael Topper ◽  
Lars Bottcher ◽  
...  

Study on temperature dependence of viscosity of halogen-free dispensing solder paste

2017 ◽  
Author(s):  
Tetsuya Yamamoto ◽  
Yuchen Hsu ◽  
Toshihide Takahashi ◽  
Akiya Kimura ◽  
Daisuke Hiratsuka ◽  
...  
Keyword(s):  
Temperature Dependence ◽  
Solder Paste ◽  
Halogen Free

Electromigration and failure analysis for copper pillar bump in QFN package

2017 ◽  
Author(s):  
Yi-Shu Hsieh ◽  
Shang-Lin Wu ◽  
Kuan-I Cheng ◽  
Sung-Mao Wu ◽  
Tung-Bao Lu ◽  
...  
Keyword(s):  
Failure Analysis
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