Study on temperature dependence of viscosity of halogen-free dispensing solder paste

2017 ◽  
Author(s):  
Tetsuya Yamamoto ◽  
Yuchen Hsu ◽  
Toshihide Takahashi ◽  
Akiya Kimura ◽  
Daisuke Hiratsuka ◽  
...  
Keyword(s):  
Temperature Dependence ◽  
Solder Paste ◽  
Halogen Free

High Reliability No-Clean Solder Paste for Designs where Flux Cannot be Dried

2015 ◽  
Vol 2015 (1) ◽  
pp. 000434-000442
Author(s):  
Fen Chen ◽  
Ning-Cheng Lee
Keyword(s):  
Cost Reduction ◽  
High Reliability ◽  
Solder Paste ◽  
Reflow Process ◽  
Snagcu Solder ◽  
Wetting Ability ◽  
Electromagnetic Shield ◽  
Halogen Free ◽  
The Cost ◽  
Assembly Performance

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. Paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosion with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

2011 ◽  
Vol 133 (2) ◽  
Author(s):  
Hung-Jen Chang ◽  
Jung-Hua Chou ◽  
Tao-Chih Chang ◽  
Chau-Jie Zhan ◽  
Min-Hsiung Hon ◽  
...  
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Solder Paste ◽  
Sac305 Solder ◽  
Printed Circuit ◽  
Pull Strength ◽  
Free Solder ◽  
Halogen Free ◽  
Electroless Ni

Five halogen-free (HF) dummy plastic ball grid array (PBGA) components with daisy-chains and Sn4.0Ag0.5Cu (SAC405) Pb-free solder balls were assembled on a HF high density interconnection (HDI) printed circuit board (PCB) using Sn1.0Ag0.5Cu (SAC105) and Sn3.0Ag0.5Cu (SAC305) Pb-free solder pastes, respectively. The above compositions were in weight percent. The assemblies were then experienced to moisture sensitive level testing with three times reflow at a peak temperature of 260 °C; no delamination was found present in both the component and PCB laminates. The microstructure showed that the utilization of SAC105 solder paste was beneficial in refining the Ag3Sn intermetallic compound (IMC) within the solder joint and the intermetallic layers formed at various interfaces with different Ni contents and thicknesses due to different metal finishes. The IMC spalling was found at the BGA-side interface within the solder joints formed with SAC105 solder paste but not discovered within the ones made of SAC305 solder paste. The pull strength of the solder joint formed with SAC305 solder paste was always higher than that made from SAC105 no matter on Cu or electroless Ni. Moreover, the fracture was found at the interface between the Cu foil and epoxy in the halogen-free test device. Numerical analysis showed that the thickness of IMC layer dominated the pull strength of the solder joint because the Z-axial normal stress applied to the solder joints formed with Cu and electroless Ni were 752.0 and 816.6 MPa, respectively, and a thicker IMC layer was beneficial to provide a higher pull strength of solder joint.

Temperature Dependence of the Critical Electron Dose for Fatty Acid Monolayers

1982 ◽  
Vol 40 ◽  
pp. 78-79
Author(s):  
Kenneth H. Downing ◽  
Robert M. Glaeser
Keyword(s):  
Electron Beam ◽  
Fatty Acid ◽  
Inelastic Scattering ◽  
Temperature Dependence ◽  
Structural Damage ◽  
Direct Result ◽  
Second Step ◽  
Strong Temperature Dependence ◽  
Electron Dose ◽  
Covalent Bonds

The structural damage of molecules irradiated by electrons is generally considered to occur in two steps. The direct result of inelastic scattering events is the disruption of covalent bonds. Following changes in bond structure, movement of the constituent atoms produces permanent distortions of the molecules. Since at least the second step should show a strong temperature dependence, it was to be expected that cooling a specimen should extend its lifetime in the electron beam. This result has been found in a large number of experiments, but the degree to which cooling the specimen enhances its resistance to radiation damage has been found to vary widely with specimen types.

Temperature Dependence of Magnetic Domains and Wall Structures

1972 ◽  
Vol 30 ◽  
pp. 496-497
Author(s):  
Sonoko Tsukahara ◽  
Tadami Taoka ◽  
Hisao Nishizawa
Keyword(s):  
Temperature Dependence ◽  
Domain Walls ◽  
Magnetic Domain ◽  
Iron Film ◽  
Objective Lens ◽  
Lorentz Microscopy ◽  
Domain Structures ◽  
Wall Structures ◽  
Crystal Films ◽  
Metallurgical Structure

The high voltage Lorentz microscopy was successfully used to observe changes with temperature; of domain structures and metallurgical structures in an iron film set on the hot stage combined with a goniometer. The microscope used was the JEM-1000 EM which was operated with the objective lens current cut off to eliminate the magnetic field in the specimen position. Single crystal films with an (001) plane were prepared by the epitaxial growth of evaporated iron on a cleaved (001) plane of a rocksalt substrate. They had a uniform thickness from 1000 to 7000 Å.The figure shows the temperature dependence of magnetic domain structure with its corresponding deflection pattern and metallurgical structure observed in a 4500 Å iron film. In general, with increase of temperature, the straight domain walls decrease in their width (at 400°C), curve in an iregular shape (600°C) and then vanish (790°C). The ripple structures with cross-tie walls are observed below the Curie temperature.

Temperature dependence of generation-recombination noise in p-n junctions

2002 ◽  
Vol 12 (3) ◽  
pp. 71-74
Author(s):  
J. A. Jiménez Tejada ◽  
A. Godoy ◽  
A. Palma ◽  
P. Cartujo
Keyword(s):  
Temperature Dependence

Temperature Dependence of Single Chain Properties in a Binary Polymer Blend

1996 ◽  
Vol 6 (2) ◽  
pp. 187-194 ◽  
Author(s):  
M. Müller ◽  
K. Binder
Keyword(s):  
Temperature Dependence ◽  
Polymer Blend ◽  
Single Chain ◽  
Binary Polymer

Temperature dependence of spin fluctuation scattering of neutrons on pyrrhotite

1964 ◽  
Vol 25 (5) ◽  
pp. 634-641 ◽  
Author(s):  
Sz. Kraśnicki ◽  
A. Wanic ◽  
Ž. Dimitrijević ◽  
R. Maglić ◽  
V. Marković ◽  
...  
Keyword(s):  
Temperature Dependence ◽  
Spin Fluctuation
Sign in / Sign up

Export Citation Format

Share Document