Misfit Stresses in Epitaxial Germanium Nanofilms on Substrates of Si(111) with Low-Density Surface Phases

2020 ◽  
Vol 84 (9) ◽  
pp. 1137-1140
Author(s):  
S. A. Teys ◽  
E. M. Trukhanov ◽  
A. V. Kolesnikov
Keyword(s):  
Low Density ◽  
Surface Phases ◽  
Density Surface

scholarly journals Indium-doped ZnO nanowires with infrequent growth orientation, rough surfaces and low-density surface traps

2013 ◽  
Vol 8 (1) ◽  
pp. 493 ◽  
Author(s):  
Hongfeng Duan ◽  
Haiping He ◽  
Luwei Sun ◽  
Shiyan Song ◽  
Zhizhen Ye
Keyword(s):  
Rough Surfaces ◽  
Zno Nanowires ◽  
Low Density ◽  
Growth Orientation ◽  
Density Surface ◽  
Doped Zno

Preparation of Low-Density Aerogels at Ambient Pressure

1992 ◽  
Vol 271 ◽  
Author(s):  
Douglas M. Smith ◽  
Ravindra Deshpande ◽  
C. Jeffrey Brinke
Keyword(s):  
Capillary Pressure ◽  
High Pressures ◽  
High Efficiency ◽  
Ambient Pressure ◽  
Silica Gels ◽  
Low Density ◽  
Additional Advantage ◽  
Commercial Viability ◽  
Critical Point Drying ◽  
Density Surface

ABSTRACTLow density aerogels have numerous unique properties which suggest a number of applications such as ultra high efficiency thermal insulation. However, the commercial viability of these materials has been limited by the high costs associated with drying at high pressures (supercritical), low stability to water vapor, and low mechanical strength. Normally, critical point drying is employed to eliminate the surface tension and hence, the capillary pressure, of the pore fluid to essentially zero. However, we show that by employing a series of aging and surface derivatization steps, the capillary pressure and gel matrix strength may be controlled such that gel shrinkage is minimal during rapid drying at ambient pressure. The properties (density, surface area, pore size, SAXS) of aerogel monoliths prepared from base catalyzed silica gels using this technique, supercritical CO2 drying, and supercritical ethanol drying are compared. An additional advantage of this approach is that the final gels are hydrophobic.

Low-density surface electromyographic patterns under electrode shift: Characterization and NMF-based classification

2020 ◽  
Vol 59 ◽  
pp. 101890
Author(s):  
Gan Huang ◽  
Zhien Xian ◽  
Fei Tang ◽  
Linling Li ◽  
Li Zhang ◽  
...  
Keyword(s):  
Low Density ◽  
Density Surface

A Study on Applicability of Low-Density Surface Film Copper Mesh for Aircraft

2021 ◽  
Vol 49 (10) ◽  
pp. 841-847
Author(s):  
Se-Young Hyun ◽  
Yong-Tae Kim ◽  
Sang-Yong Kim ◽  
Bong-Gyu Kim
Keyword(s):  
Surface Film ◽  
Low Density ◽  
Density Surface ◽  
Copper Mesh

Application of Improved Voltage Compensation in the SEM to Imaging of Organic Materials

1973 ◽  
Vol 31 ◽  
pp. 444-445
Author(s):  
P.J. Killingworth ◽  
M. Warren
Keyword(s):  
Electron Beam ◽  
Organic Materials ◽  
Operating Parameters ◽  
Low Density ◽  
Beam Diameter ◽  
Incident Electron Beam ◽  
Specimen Material ◽  
Voltage Compensation ◽  
Selection Of ◽  
Scanning Electron

Ultimate resolution in the scanning electron microscope is determined not only by the diameter of the incident electron beam, but by interaction of that beam with the specimen material. Generally, while minimum beam diameter diminishes with increasing voltage, due to the reduced effect of aberration component and magnetic interference, the excited volume within the sample increases with electron energy. Thus, for any given material and imaging signal, there is an optimum volt age to achieve best resolution.In the case of organic materials, which are in general of low density and electric ally non-conducting; and may in addition be susceptible to radiation and heat damage, the selection of correct operating parameters is extremely critical and is achiev ed by interative adjustment.

Quantitative defect studies in semiconductor TEM samples prepared by low angle ion milling

1995 ◽  
Vol 53 ◽  
pp. 512-513
Author(s):  
L. Mulestagno ◽  
J.C. Holzer ◽  
P. Fraundorf
Keyword(s):  
Sample Preparation ◽  
Milling Time ◽  
High Density ◽  
Low Density ◽  
Ion Milling ◽  
High Quality ◽  
Variable Angle ◽  
Major Disadvantage ◽  
Induced Defects

Due to the wealth of information, both analytical and structural that can be obtained from it TEM always has been a favorite tool for the analysis of process-induced defects in semiconductor wafers. The only major disadvantage has always been, that the volume under study in the TEM is relatively small, making it difficult to locate low density defects, and sample preparation is a somewhat lengthy procedure. This problem has been somewhat alleviated by the availability of efficient low angle milling.Using a PIPS® variable angle ion -mill, manufactured by Gatan, we have been consistently obtaining planar specimens with a high quality thin area in excess of 5 × 104 μm2 in about half an hour (milling time), which has made it possible to locate defects at lower densities, or, for defects of relatively high density, obtain information which is statistically more significant (table 1).

Sign in / Sign up

Export Citation Format

Share Document