Microstructural Considerations on the Reliability of 3D Packaging

ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2012p0044 ◽

2012 ◽

Author(s):

Zhiheng Huang ◽

Zhiyong Wu ◽

Hua Xiong ◽

Yucheng Ma

Keyword(s):

Mechanical Behavior ◽

Grain Growth ◽

Spinodal Decomposition ◽

Elastic Energy ◽

Modeling Approach ◽

3D Packaging ◽

Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

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Complex interactions between precipitation, grain growth and recrystallization in a severely deformed Al-Zn-Mg-Cu alloy and consequences on the mechanical behavior

Materialia ◽

10.1016/j.mtla.2021.101028 ◽

2021 ◽

Vol 15 ◽

pp. 101028

Author(s):

Amandine Duchaussoy ◽

Xavier Sauvage ◽

Alexis Deschamps ◽

Frederic De Geuser ◽

Gilles Renou ◽

...

Keyword(s):

Mechanical Behavior ◽

Grain Growth ◽

Complex Interactions ◽

Cu Alloy

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A combined experimental atomic force microscopy-based nanoindentation and computational modeling approach to unravel the key contributors to the time-dependent mechanical behavior of single cells

Biomechanics and Modeling in Mechanobiology ◽

10.1007/s10237-016-0817-y ◽

2016 ◽

Vol 16 (1) ◽

pp. 297-311 ◽

Cited By ~ 3

Author(s):

Cristina Florea ◽

Petri Tanska ◽

Mika E. Mononen ◽

Chengjuan Qu ◽

Mikko J. Lammi ◽

...

Keyword(s):

Atomic Force Microscopy ◽

Computational Modeling ◽

Mechanical Behavior ◽

Single Cells ◽

Time Dependent ◽

Force Microscopy ◽

Modeling Approach ◽

Atomic Force

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Simulation and Data-Analytics of Sub-Grain Growth with Consideration of Stored Elastic Energy and Anisotropic Grain Boundary Properties

Proceedings of the 6th International Conference on Recrystallization and Grain Growth (ReX&GG 2016) ◽

10.1002/9781119328827.ch6 ◽

2016 ◽

pp. 35-42

Author(s):

Markus Kühbach ◽

Christian Mießen ◽

Luis A. Barrales-Mora ◽

Günter Gottstein

Keyword(s):

Grain Boundary ◽

Grain Growth ◽

Elastic Energy ◽

Data Analytics ◽

Boundary Properties ◽

Stored Elastic Energy

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Spinodal Decomposition in Fe-Cr Alloys

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.172-174.443 ◽

2011 ◽

Vol 172-174 ◽

pp. 443-448

Author(s):

Orlando Soriano Vargas ◽

Erika O. Avila Davila ◽

Victor M. Lopez-Hirata ◽

Maribel L. Saucedo-Muñoz

Keyword(s):

Solid Solution ◽

Mechanical Behavior ◽

Spinodal Decomposition ◽

Growth Kinetics ◽

Supersaturated Solid Solution ◽

Rich Phase ◽

Hardening Behavior ◽

Plate Shape ◽

Kinetics Of ◽

Preferential Alignment

The hardening behavior of precipitation was studied during aging of Fe-Cr alloys. This mechanical behavior is associated with the nanometric modulation structure of the coherent decomposed Fe-rich and Cr-rich phases formed by the spinodal decomposition of the supersaturated solid solution. The growth kinetics of spinodal decomposition was very slow and it increased during coarsening stage. The morphology of decomposed phases consisted of an interconnected irregular shape with no preferential alignment for short aging times and a further aging caused the change to a plate shape of the decomposed Cr-rich phase aligned in the <110> directions of the Fe-rich matrix. The rapid increase in hardness and embrittlement seem to be associated with the coherency and nanometer size of the spinodally-decomposed phases in the aged alloys.

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Numerical Simulation of Spinodal Deposition in Cu–6at.%Ni–3at.%Si Ternary Alloy Using of Phase Field Method

Materials Science Forum ◽

10.4028/www.scientific.net/msf.704-705.1410 ◽

2011 ◽

Vol 704-705 ◽

pp. 1410-1415 ◽

Cited By ~ 1

Author(s):

Yong Qiang Long ◽

Ping Liu ◽

Yong Liu ◽

Shu Guo Jiao ◽

Bao Hong Tian

Keyword(s):

Spinodal Decomposition ◽

Ternary Alloy ◽

Phase Field ◽

Elastic Energy ◽

Early Stage ◽

Phase Field Model ◽

Field Method ◽

Phase Field Method ◽

Growth Exponent ◽

Dynamics Calculation

Based on Cahn-Hilliard nonlinear diffusion equation, the phase field model has been established for ternary alloy spinodal decomposition, which directly couples with Calphad thermodynamics and dynamics calculation and takes into account the effect of the coherent elastic energy. The simulated microstructures of spinodal decomposition were carried out in the isothermally-aged of Cu-6at.%Ni-3at.%Si alloy. The results indicate that the spinodal decomposition takes place at the early stage of Cu-6at.%Ni-3at.%Si alloy aging at temperatures of 723K, forming two-phases mixture of Cu-rich and Ni/Si-rich, and the decomposition microstructures are distributed in a semi-interconnected labyrinth-like form. Under the effect of the coherent elastic energy, the decomposition microstructures demonstrate the obvious anisotropic characteristics, and present interconnected rectangular stripes aligned along [10] and [01] directions. The growth of the decomposition microstructures is in accordance with the growth law of growth exponentn≈0.29, slightly less than the LSW’s prediction.

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Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898498 ◽

2011 ◽

Author(s):

B. S. S. Chandra Rao ◽

V. Kripesh ◽

K. Y. Zeng

Keyword(s):

Mechanical Behavior ◽

Solder Joints ◽

Lead Free ◽

Diffusion Kinetics ◽

3D Packaging

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Effect of Solution Treatment on Microstructure Evolution and Mechanical Behavior of Cu-20Ni-20Mn Alloy

Materials Science Forum ◽

10.4028/www.scientific.net/msf.850.773 ◽

2016 ◽

Vol 850 ◽

pp. 773-777

Author(s):

Wei Bin Xie ◽

Qiang Song Wang ◽

Guo Liang Xie ◽

Xu Jun Mi ◽

Dong Mei Liu ◽

...

Keyword(s):

Grain Size ◽

Mechanical Behavior ◽

Grain Growth ◽

Microstructure Evolution ◽

Hot Forging ◽

Solution Treatment ◽

Hardness Test ◽

Solution Temperature ◽

Second Phase ◽

Solution Treated

The influence of solution treatment on microstructure evolution and mechanical behavior of Cu-20Ni-20Mn alloy was investigated by optical microscopy (OM), X-ray diffraction (XRD) and hardness test. The results revealed that both solution temperature and holding time had effect on the grain growth behavior. The grain growth activation energy was determined by grain size of Cu-20Ni-20Mn alloy for different heat treatment temperatures and periods. With increasing temperature of solution treatment, the second phase is gradually dissolved into the Cu-rich matrix, and the lattice parameter of the matrix solution treated at 1173K for 0.5 h was about 3.668 Å. The hardness of the solution-treated alloy was lower than that of hot forging, and the hardness value decreased with the increase of solution temperature, which may be attributed to grain size. The hardening ability, corresponding to the Hall-Petch relationship, decreased linearly with D-1/2.

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