scholarly journals Hexagonal Boron Nitride/Microfibril Cellulose/Poly(vinyl alcohol) Ternary Composite Film with Thermal Conductivity and Flexibility

Materials ◽  
2018 ◽  
Vol 12 (1) ◽  
pp. 104 ◽  
Author(s):  
Xin Ge ◽  
Wei-Jie Liang ◽  
Jian-Fang Ge ◽  
Xun-Jun Chen ◽  
Jian-Ye Ji ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Photoelectron Spectroscopy ◽  
Vinyl Alcohol ◽  
Hexagonal Boron Nitride ◽  
Poly Vinyl Alcohol ◽  
Thermal Interface Materials ◽  
Binding Effect ◽  
Ft Ir

Microfibril cellulose (MFC), which is detrimental to soil cultivation and environmental protection, is derived from waste pineapple leaves. Hexagonal boron nitride (h-BN) was modified with polydopamine (PDA)—PDA@h-BN named pBN, and then combined with MFC to prepare a novel hybrid powder. The effect of PDA on h-BN and the binding effect between pBN and MFC were characterized by X-ray photoelectron spectroscopy (XPS), Thermogravimetric (TG), scanning electron microscopy (SEM), and Fourier Transform-Infrared (FT-IR). Poly (vinyl alcohol) (PVA) was used as an eco-friendly polymeric matrix to prepare a pBN-MFC-PVA composite film. The mechanical strength, hydrophobicity, and thermal conductivity of the film were studied and the results confirmed that h-BN was chemically modified with PDA and was uniformly distributed along the MFC. The thermal conductivity of the pBN-MFC-PVA composite film increased with the addition of a pBN-MFC novel powder. MFC acted as “guides” to mitigate the h-BN agglomerate. In addition to the possible usage in the pBN-MFC-PVA composite film itself, the pBN-MFC hybrid powder may be a potential filler candidate for manufacturing thermal interface materials and wearable devices or protective materials.

Anisotropy-Driven High Thermal Conductivity in Stretchable Poly(vinyl alcohol)/Hexagonal Boron Nitride Nanohybrid Films

2018 ◽  
Vol 10 (40) ◽  
pp. 34625-34633 ◽  
Author(s):  
O. Hwan Kwon ◽  
Taeyong Ha ◽  
Dong-Gyun Kim ◽  
Byoung Gak Kim ◽  
Yong Seok Kim ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Vinyl Alcohol ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Poly Vinyl Alcohol

scholarly journals Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 379
Author(s):  
Seonmin Lee ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Vinyl Alcohol ◽  
Composite Films ◽  
Poly Vinyl Alcohol ◽  
Thermal And Mechanical Properties ◽  
Conduction Path ◽  
Thermally Conductive

Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

Sonochemical Functionalization of Boron Nitride Nanomaterials

MRS Advances ◽  
2019 ◽  
Vol 5 (14-15) ◽  
pp. 709-716
Author(s):  
Haley B. Harrison ◽  
Jeffrey R. Alston
Keyword(s):  
Thermal Stability ◽  
Boron Nitride ◽  
Photoelectron Spectroscopy ◽  
Colloidal Stability ◽  
Hexagonal Boron Nitride ◽  
Boron Nitride Nanotubes ◽  
Covalent Attachment ◽  
Covalent Functionalization ◽  
X Ray ◽  
Ft Ir

AbstractBoron nitride nanotubes (BNNTs) and hexagonal boron nitride platelets (h-BNs) have received considerable attention for aerospace insulation applications due to their exceptional chemical and thermal stability. Presently, making BN nanomaterials compatible with polymer and composite matrices is challenging. Due to their inert and highly stable structure, h-BN and BNNTs are difficult to covalently functionalize. In this work, we present a novel sonochemical technique that enables covalent attachment of fluoroalkoxy substituents to the surface of BN nanomaterials in a controlled and metered process. Covalent functionalization is confirmed via colloidal stability analysis, FT-IR, and x-ray photoelectron spectroscopy (XPS).

scholarly journals Fabrication and Enhanced Thermal Conductivity of Boron Nitride and Polyarylene Ether Nitrile Hybrids

Polymers ◽  
2019 ◽  
Vol 11 (8) ◽  
pp. 1340 ◽  
Author(s):  
Ling Tu ◽  
Qian Xiao ◽  
Renbo Wei ◽  
Xiaobo Liu
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Resistance ◽  
Photoelectron Spectroscopy ◽  
Elevated Temperatures ◽  
Crosslinking Reaction ◽  
X Ray ◽  
Polyarylene Ether Nitrile ◽  
Ft Ir ◽  
Cyano Groups

Excellent thermal resistance and thermal conductivity are preconditions of materials to be used at elevated temperatures. Herein, boron nitride and polyarylene ether nitrile hybrids (PEN-g-BN) with excellent thermal resistance and thermal conductivity are fabricated. Phthalonitrile-modified BN (BN-CN) is prepared by reacting hydroxylated BN with isophorone diisocyanate (IPDI) and 3-aminophxylphthalonitrile (3-APN), and then characterized by FT-IR, UV-Vis, and X-ray photoelectron spectroscopy (XPS). The obtained BN-CN is introduced to a phthalonitrile end-capped PEN (PEN-Ph) matrix to prepare BN-CN/PEN composites. After curing at 340 °C for 4 h, PEN-g-BN hybrids are fabricated by a self-crosslinking reaction of cyano groups (-CN) from BN-CN and PEN-Ph. The fabricated PEN-g-BN hybrids are confirmed through FT-IR, UV-Vis, SEM and gel content measurements. The PEN-g-BN hybrids demonstrate excellent thermal resistance with their glass transition temperature (Tg) and decomposition temperatures (Td) being higher than 235 °C and 530 °C, respectively. Additionally, the thermal conductivity of the prepared PEN-g-BN hybrids is up to 0.74 W/(m·k), intensifying competitiveness of PEN-g-BN hybrids for applications at elevated temperatures.

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

2021 ◽  
pp. 095400832110003
Author(s):  
Ruiyi Li ◽  
Chengcheng Ding ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Reference Value ◽  
Residual Rate ◽  
Practical Applications ◽  
Hybrid Fillers ◽  
The Matrix

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

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