scholarly journals Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

Materials ◽  
2022 ◽  
Vol 15 (1) ◽  
pp. 323
Author(s):  
Wan-Chun Chuang ◽  
Wei-Long Chen
Keyword(s):  
Structural Design ◽  
Flip Chip ◽  
Design Guidelines ◽  
Strip Thickness ◽  
Substrate Thickness ◽  
Factors Affecting ◽  
Development Costs ◽  
Development Cycle ◽  
Experimental Values ◽  
Die Thickness

This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found to be less than 8%. Taguchi analysis was employed to identify the key factors affecting strip warpage, which were discovered to be die thickness and substrate thickness, followed by mold compound thickness and molding temperature. Although a greater die thickness and mold compound thickness reduce the strip warpage, they also substantially increase the overall strip thickness. To overcome this problem, design criteria are proposed, with the neutral axis of the strip structure located on the bump. The results obtained using the criteria revealed that the strip warpage and overall strip thickness are effectively reduced. In summary, the proposed model can be used to evaluate the effect of structural design and process parameters on strip warpage and can provide strip design guidelines for reducing the amount of strip warpage and meeting the requirements for light, thin, and short chips on the production line. In addition, the proposed guidelines can accelerate the product development cycle and improve product quality with reduced development costs.

Investigation of Strip Warpage Behavior in Wire Bonding Process

2020 ◽  
Vol 142 (2) ◽  
Author(s):  
Wan-Chun Chuang ◽  
Wei-Long Chen
Keyword(s):  
Structural Design ◽  
Wire Bonding ◽  
Bonding Process ◽  
Design Criteria ◽  
Distance Ratio ◽  
Factors Affecting ◽  
Molding Temperature ◽  
Development Costs ◽  
Key Factor ◽  
Die Thickness

Abstract This study successfully established a strip warpage simulation model that is applied to the wire bonding process, and explored the effects of structural designs, material types, and processes such as molding, post and mold cure (PMC), pretreatment, and ball mounts on the strip warpage. The error between the experimental values and the simulation values is less than 13.7%. In addition, the Taguchi method is used to determine that the key factors affecting the strip warpage are the die thickness and the mold compound thickness, and that the secondary key factor is the molding temperature. This study concluded that in order to reduce strip warpage, the die thickness must be increased, while the compound thickness and the molding temperature must be decreased. To solve this problem, the structural design criteria proposed in this study use a smaller distance ratio of the neutral axis of the strip (zn) to the dice centroid (zdie). With this modification, it can reduce warpage and overall thickness of the strip. These observations indicate that the proposed model can be used to understand the effects of structural design, material types, and process parameter changes on the strip warpage. Strip design criteria are also provided in order to reduce the strip warpage, and thus, meet the requirement of thin and compact production lines, accelerate product development cycles, improve product quality, and reduce development costs.

Flip-Chip BGA Design to Avert Die Cracking

1999 ◽  
Vol 123 (1) ◽  
pp. 58-63 ◽  
Author(s):  
J.-B. Han
Keyword(s):  
Fracture Mechanics ◽  
Crack Length ◽  
Material Properties ◽  
Flip Chip ◽  
Design Guidelines ◽  
Design Parameters ◽  
Substrate Thickness ◽  
Element Analysis ◽  
Critical Crack Length ◽  
Fracture Parameters

Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack, and the effects of some key material properties and package dimensions on die cracking of flip-chip BGA. The stress intensity factor (SIF) and the strain energy release rate (ERR) are taken as the design indices. The FEA is used to calculate the fracture parameters, and the virtual DOE is employed to determine contributions of each design parameter to die cracking and their acceptable design windows. The investigation consists of two parts. The first is relations of length and location of a die crack with the fracture parameters. The relations are established through sweeping along crack length for a crack located at the center of the die backside, and along the die backside surface. The critical crack length is determined for a specific design. The second is the virtual DOE based on fracture mechanics. Several key material properties and package dimensions are used as the design inputs. The main effects and interactions of these design parameters to die cracking are calculated. Based on it, some generic design guidelines are made. It is concluded that substrate and die thicknesses are the two most significant factors to die cracking of flip-chip BGA. Increasing substrate thickness and reducing die thickness are the most effective measures to design a package with high resistance to die cracking.

Research and Application of Intelligent CAD Technology in R and D and Management of the Electric Equipment

2011 ◽  
Vol 201-203 ◽  
pp. 1521-1525
Author(s):  
Hong Gen Zhou ◽  
Wen Cheng Tang ◽  
Xu Wen Jing ◽  
Shuai Han
Keyword(s):  
Design Knowledge ◽  
Extraction Technology ◽  
Intelligent Cad ◽  
R And D ◽  
Cad System ◽  
Development Costs ◽  
Development Cycle ◽  
Design Resources ◽  
Electric Equipment ◽  
Developing Platform

The paper chooses SolidWorks as the developing platform and Electric Equipment as object, researches into the principle of redevelopment by parameter-driving based on 3D feature modeling system of SolidWorks is introduced. Intelligent-CAD system is developed oriented to Electric Equipment by the parametrization structural design actuation technology, the manufacture characteristic automatic diagnosis and the extraction technology, the manufacture characteristic and the design resources, the design knowledge intelligence matching technique and so on. Through applies this system, we should develop the parametrization model of vise crucial element quickly, should extraction and memory components characteristic information and completion of the design features and design resources, design knowledge matching, and so on. The system should achieve to quickly finish product design, to shorten the development cycle and reduce product development costs.

Structural design and performance improvement of flip-chip AlGaInP mini light-emitting diodes

2021 ◽  
Author(s):  
Kai-Ping Chang ◽  
Yu-Tin Tsai ◽  
Chao-Chun Yen ◽  
Ray-Hua Horng ◽  
Dong-Sing Wuu
Keyword(s):  
Performance Improvement ◽  
Structural Design ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
And Performance

Aerodynamics of Highway Sign Structures: From Laboratory Tests and Field Monitoring to Structural Design Guidelines

2020 ◽  
Vol 146 (11) ◽  
pp. 04020233
Author(s):  
Michael Heisel ◽  
Carly Daugherty ◽  
Nicole Finley ◽  
Lauren Linderman ◽  
Dominik Schillinger ◽  
...  
Keyword(s):  
Structural Design ◽  
Laboratory Tests ◽  
Design Guidelines ◽  
Field Monitoring

The Simulation Model Establishment of Single Trailing Arm Suspension Vehicle Based on ADAMS

2014 ◽  
Vol 716-717 ◽  
pp. 837-840
Author(s):  
Hui Wang ◽  
Xiao Zhi Wang
Keyword(s):  
Simulation Model ◽  
Simulation Software ◽  
Development Costs ◽  
Development Cycle ◽  
Proposed Model ◽  
Adams Software ◽  
Solid Foundation

Using SGA170 mine car as prototype, this paper establishes simulation model of single trailing arm suspension vehicle steering to trapezoidal mechanism using the ADAMS software, and validates the correctness of the proposed model. It can not only effectively shorten the development cycle, reduce development costs and improve the design precision of products, but also lay a solid foundation for other the simulation software.

Development of Structural Design Guidelines for Porous Asphalt Pavement

2018 ◽  
Vol 2672 (40) ◽  
pp. 197-206 ◽  
Author(s):  
Kevin D. Hall ◽  
Charles W. Schwartz
Keyword(s):  
Structural Design ◽  
Design Procedure ◽  
Field Performance ◽  
Design Guidelines ◽  
Empirical Approach ◽  
Asphalt Pavements ◽  
Design Parameters ◽  
Extensive Literature ◽  
Porous Asphalt ◽  
Design Procedures

Porous asphalt pavements allow designers to introduce more sustainability into projects and lessen their environmental impact. Current design procedures are based primarily on hydrologic considerations; comparatively little attention has been paid to their structural design aspects. As their use grows, a design procedure and representative material structural properties are needed to ensure that porous pavements do not deteriorate excessively under traffic loads. The objective of this project was to develop a simple, easy to apply design procedure for the structural design of porous asphalt pavements. Two methodologies were considered for such a structural design procedure: ( a) the 1993 AASHTO Pavement Design Guide empirical approach, and ( b) the mechanistic–empirical approach employed by the AASHTOWare Pavement ME Design software. A multifactor evaluation indicated the empirical 1993 AASHTO design procedure to be the most appropriate platform at this time. It is noted, however, that both design procedures lack validation of porous asphalt pavements against field performance. AASHTO design parameters and associated material characteristics are recommended, based on an extensive literature review. For “thin” open-graded base structures (12 in. or less), the AASHTO procedure is performed as published in the 1993 Guide. For “thick” base structures (>12 in.), the base/subgrade combination is considered a composite system which supports the porous asphalt layer; an equivalent deflection-based approach is described to estimate the composite resilient modulus of the foundation system, prior to applying the 1993 AASHTO design procedure.

Control and Optimization of Development Risk of the High-Tech Manufacturing and Measuring Product

2014 ◽  
Vol 709 ◽  
pp. 503-508
Author(s):  
Yang Peng Liu ◽  
Jian Jun Ding ◽  
Xing Yuan Long ◽  
Zhuang De Jiang ◽  
Yue Rong Jiang
Keyword(s):  
Risk Management ◽  
Product Development ◽  
Development Process ◽  
Risk Identification ◽  
Product Development Process ◽  
High Tech ◽  
Control Mechanisms ◽  
Development Costs ◽  
Development Cycle ◽  
The Competitiveness Of Enterprises

This paper proposes the risk management strategy of the product design and development process. The process control mechanisms based on the risk management. Risk identification, assessment, migration, monitoring and reporting are applied in the product development process. Under the supervision and guidance of risk management, the risk point of product development cycle of measuring instrument is shortened about 30%, and the development costs are reduced too. The risk management improves the economic efficiency of enterprises and enhances the competitiveness of enterprises.

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