Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices

2014 ◽  
Vol 607 ◽  
pp. 133-138
Author(s):  
Zong Bo Zhang ◽  
Qing Qiang He ◽  
Cao Qing Yan
Keyword(s):  
Bonding Strength ◽  
Theoretical Study ◽  
Mechanical Systems ◽  
Micro Channel ◽  
Microfluidic Chips ◽  
Mems Devices ◽  
Ultrasonic Bonding ◽  
Low Dimension ◽  
Bonding Method ◽  
Polymer Mems

Based on the theoretical study in our previous work, a novel thermal assisted ultrasonic bonding method for polymer Micro/nanoElectro-Mechanical Systems (M/NEMS) has been demonstrated. Bonding experiments of PMMA microfluidic chips with micro-channel of 80 μm in depth and width were conducted. The result shows numerous superiorities of this method including high bonding strength (0.95 MPa), low dimension loss (0.8% in depth and 0.3% in width, respectively) and short bonding duration.

A Microfluidic Chip Microwave Bonding Method Based on the PMMA

2013 ◽  
Vol 562-565 ◽  
pp. 561-565
Author(s):  
Xiao Wei Liu ◽  
Xiao Wei Han ◽  
He Zhang ◽  
Xi Yun Jiang ◽  
Lin Zhao
Keyword(s):  
Microwave Radiation ◽  
Microfluidic Chip ◽  
Mass Production ◽  
Bonding Strength ◽  
Microfluidic Chips ◽  
Ultrasonic Bonding ◽  
Microwave Absorbing ◽  
Bonding Method ◽  
Bonding Technique

A new bonding technique mainly for PMMA microfluidic chips is presented in this paper. In this technique, polymer microfluidic microchannels were bonded by microwave radiation. Its strength and time can be controlled accurately in watt and second level. There are so many techniques for mass-production of polymer microfluidic chip, such as heat bonding, ultrasonic bonding. However, we may find different kinds of shortages when we use these techniques. In this paper, the experiment result shows that microwave radiation’s strength and time have effects on microfluidic chip`s bonding strength. The microwave absorbing coating can also have a certain degree influence on microfluidic chip`s bonding strength.

A Novel Room-Temperature Bonding Method Based on Electrohydrodynamic Printing

2021 ◽  
Vol 21 (3) ◽  
pp. 1672-1677
Author(s):  
Wenzheng Wu ◽  
Xue Yang ◽  
Rui Liu ◽  
Zhifu Yin ◽  
D. F. Wang ◽  
...  
Keyword(s):  
Microfluidic Chip ◽  
Silicon Substrate ◽  
Bonding Strength ◽  
Room Temperature ◽  
Production Efficiency ◽  
Microfluidic Chips ◽  
Electrohydrodynamic Printing ◽  
Inner Diameter ◽  
Bonding Method

Microfluidic chips made by traditional materials (glass and silicon) are still important for fluorescence tests, biocompatible experiments, and high temperature applications. However, the majority of the present bonding methods suffer from ultra-clean requirement, complicated fabrication process, and low production efficiency. In the present work, an Electrohydrodynamic printing assist bonding method was proposed. By this method, the ultraviolet-cured-glue dots were printed onto the silicon substrate, and then the patterned glass and silicon substrate can be bonded together at room temperature. The influence of printing condition (nozzle inner-diameter, applied voltage, printing height, and flow rate) on the diameter of printed dot was analyzed by experiments. By the optimized printing condition, the glass-silicon microfluidic chip can be well bonded. The bonding strength and leakage test demonstrated the high bonding quality of the microfluidic chip (bonding strength of 28 MPa and leakage pressure of 3.5 MPa).

A low temperature ultrasonic bonding method for PMMA microfluidic chips

2010 ◽  
Vol 16 (4) ◽  
pp. 533-541 ◽  
Author(s):  
Zongbo Zhang ◽  
Yi Luo ◽  
Xiaodong Wang ◽  
Yingsong Zheng ◽  
Yanguo Zhang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Microfluidic Chips ◽  
Ultrasonic Bonding ◽  
Bonding Method

scholarly journals Micro-electro-mechanical systems (MEMS): Technology for the 21st century

2014 ◽  
Vol 68 (5) ◽  
pp. 629-641 ◽  
Author(s):  
Tatjana Djakov ◽  
Ivanka Popovic ◽  
Ljubinka Rajakovic
Keyword(s):  
21St Century ◽  
Low Cost ◽  
Mechanical Systems ◽  
Modern Society ◽  
Global Scale ◽  
Thermal Constant ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Industrial Sectors ◽  
Mems Technology

Micro-electro-mechanical systems (MEMS) are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

Effect of Temperature on the Interfacial Bonding Strength between PVB and Glass from RT to -50 °C

2011 ◽  
Vol 492 ◽  
pp. 61-65 ◽  
Author(s):  
Yuan Tian ◽  
Yi Wang Bao ◽  
De Tian Wan ◽  
Xiu Fang Wang ◽  
Zhi Ming Han
Keyword(s):  
Bonding Strength ◽  
Room Temperature ◽  
Testing Temperature ◽  
Interfacial Bonding ◽  
Effect Of Temperature ◽  
Laminated Glass ◽  
Interfacial Bonding Strength ◽  
Cooling Speed ◽  
Bonding Method ◽  
Shear Bonding Strength

Laminated glass and photovoltaic laminated glass are widely used in architecture. The interfacial bonding strengths between poly(vinyl butyral) (PVB) and glass were investigated by the cross-bonding method from room temperature to -50 °C. The loading speed was 5 mm/min, and the cooling speed was about 0.5 °C/min. The testing sample was hold at each temperature for half an hour. It was revealed that the testing temperature had great effect on the bonding strength. At room temperature, the tensile bonding strength was 11.49 MPa and the shear bonding strength was 6.61 MPa. With the temperature decreased from RT to -50 °C, the tensile bonding strength was decreased by 66.81%, but the shear bonding strength was increased by 212.16%. From RT to -30 °C, the change rates of the tensile and shear bonding strength bonding strength were 65.57% and 172.68% respectively, only 3.61% and 14.48% from -30 °C to -50 °C. The mechanism for the bonding strength depended on testing temperatures from RT to -50 °C was also discussed.

Geometrical conditions for wedging in mechanical systems with Coulomb friction

2009 ◽  
Vol 223 (5) ◽  
pp. 1171-1179 ◽  
Author(s):  
M M Zhechev ◽  
M V Khramova
Keyword(s):  
Mechanical System ◽  
Coulomb Friction ◽  
Theoretical Study ◽  
Mechanical Systems ◽  
Process Automation ◽  
Frictional Contacts ◽  
Rigorous Definition ◽  
Automation Systems ◽  
The Cost

It is known that a phenomenon referred to as wedging can occur in mechanical systems with friction. This phenomenon occurs in certain system positions, and an actual mechanical system can be started from a wedged position only at the cost of irreversible deformations. Although the results of the theoretical study of wedging are of great importance in the development and operation of process automation systems, the theory of this phenomenon is still in the making. In this work, the notion of a wedgeable system is introduced and its rigorous definition is given. Within the framework of the traditional formulation, this definition reflects the properties of wedging in actual mechanical systems in the most adequate manner. Based on this notion, a number of statements on wedging conditions in mechanical systems with two and three frictional contacts are proved. Simple, convenient in use rules are given for identifying the possibility of wedging in peg-in-hole systems with two and three frictional contacts.

A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips

2015 ◽  
Vol 35 (3) ◽  
pp. 267-275 ◽  
Author(s):  
Chunpeng Chu ◽  
Bingyan Jiang ◽  
Laiyu Zhu ◽  
Fengze Jiang
Keyword(s):  
Bonding Strength ◽  
Process Analysis ◽  
Bonding Temperature ◽  
Bonding Time ◽  
Production Cycle ◽  
Microfluidic Chips ◽  
Bonding Pressure ◽  
Bonding Parameters ◽  
Bonding Technology ◽  
Assembly Technology

Abstract A novel combination of thermal bonding and in-mold assembly technology was created to produce microfluidic chips out of polymethylmethacrylate (PMMA), which is named “in-mold bonding technology”. In-mold bonding experiments of microfluidic chips were carried out to investigate the influences of bonding process parameters on the deformation and bonding strength of microchannels. The results show that bonding temperature has the greatest impact on the deformation of microchannels, while bonding pressure and bonding time have more influence on deformation in height than in top width. Considering the bonding strength, the bonding temperature and the bonding pressure have more impact than the bonding time. The time is crucial for the sealing of the chips. By setting the bonding parameters reasonably, the microchannel deformation is <10%, while the bonding strength of the chips is 350 kPa. The production cycle of the chip is reduced to <5 min.

Quality Defects and Analysis of the Microfluidic Chip Injection Molding

2009 ◽  
Vol 628-629 ◽  
pp. 417-422 ◽  
Author(s):  
Ying Liu ◽  
M.C. Song ◽  
Min Jie Wang ◽  
C.Z. Zhang
Keyword(s):  
Quality Control ◽  
Injection Molding ◽  
Mass Production ◽  
Control Process ◽  
Parameter Design ◽  
Micro Channel ◽  
Microfluidic Chips ◽  
New Methods ◽  
Sink Mark ◽  
Stagnant Flow

Compared with hot embossing, microfluidic chips injection molding is higher efficiency process and more suitable for mass production, but the quality control for injection molding is much more complex. Experiments indicate that the incomplete replication of the micro-channel and the sink mark for microfluidic chips are the chief defects to the molding. Simulation and theoretical analysis show that the stagnant flow of the melt in micro-channel and the shrinkage difference of the chips in different directions are the main reasons for molding defect. A set of new methods that how to control process parameter, design mold, and select polymer material is proposed to reduce or avoid the defects.

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