Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material

2014 ◽  
Vol 1021 ◽  
pp. 3-6
Author(s):  
Hao Ran Zhou ◽  
Hong Xia Li ◽  
Wei Miao Yu
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Agent ◽  
Reaction Conditions ◽  
The Poor ◽  
Fatigue Durability ◽  
Ft Ir ◽  
Shock Resistance ◽  
Modified Epoxy ◽  
Toughening Agent

In order to solve the poor toughness, fatigue durability and shock resistance defects of the cured epoxy resin, in this paper, the epoxy resin was modified via dichlorodiphenyl silane as a modifier. Then the electronic packaging materials were prepared using the modified EP as matrix, a nitrile rubber (CTBN) as a toughening agent, methyl nadic anhydride (MNA) as a curing agent, and 2, 4, 6 - tris (dimethyl amino methyl) phenol as a curing accelerator. The effects of raw materials ratio on the cured products’ properties was investigated. FT-IR, TG-DTG and DMA were used to test and characterize the product. And we determined the best raw materials ratio and reaction conditions. Finally epoxy encapsulating materials which have excellent mechanical properties, electrical properties were prepared.

Mechanical and Thermal Properties of Liquefied Corn Bran-Based Epoxy Resins

2014 ◽  
Vol 587-589 ◽  
pp. 212-215
Author(s):  
Wen Ming Zhang ◽  
Wen Shuo Wu ◽  
Zhi Qiang Liu ◽  
Xiao Wei Li ◽  
Yu Cang Zhang
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Mechanical And Thermal Properties ◽  
Reaction Conditions ◽  
Oh Groups ◽  
Good Thermal Stability ◽  
Molecular Weights ◽  
Corn Bran ◽  
Ft Ir ◽  
Biomass Materials

Corn bran was liquefied in phenol catalyzed by sulfuric acid at 120-180 °C. The liquefaction product (LCB) had groups of bound phenol and was considered as a precursor for synthesizing corn bran-based epoxy resin (LCBER). Namely, the phenolic OH groups of LCB reacted with epichlorohydrin under alkali condition. The structure and average molecular weights of LCB and LCBER in various reaction conditions were examined by FT-IR and GPC. Epoxy functionality was introduced to LCB and the extreme high molecular weight portion of LCBER-30 was obtained using LCB at 30 min as raw materials. LCBER was cured with polyamide-650 (PA-650) and the thermal and mechanical properties were evaluated. Comparing to the petroleum-based bisphenol-A type epoxy resin (DGEBA), LCBER presented higher adhesive shear strength and good thermal stability. These suggested that LCBER would be more suitable to glue biomass materials.

Studies on Mechanical and Thermal Properties of Epoxy Resin Modified by Fluorine-Containing Silicone

2013 ◽  
Vol 401-403 ◽  
pp. 713-716
Author(s):  
Cheng Fang ◽  
Dong Bo Guan ◽  
Wei Guo Yao ◽  
Shou Jun Wang ◽  
Hui An
Keyword(s):  
Glass Transition ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Bending Strength ◽  
Mechanical And Thermal Properties ◽  
Curing Agent ◽  
Epoxy System ◽  
Resin Curing ◽  
The Impact ◽  
Modified Epoxy

The epoxy resin was modified with the mixture of α,ω-dihydroxy poly-(3,3,3-trifluoropropyl) siloxane (PTFPMS), KH560 and stannous octoate. KH560 can react with PTFPMS and also epoxy resin curing agent. The two reactions were characterized by FI-IR. The modified epoxy resin was characterized by FI-IR. The result showed that fluorine-containing silicone had been successfully introduced into the epoxy system. The mechanical and thermal properties of the modified epoxy resin were analyzed. The results showed that with the increase of PTFPMS the impact strength of epoxy resin increased, hardness and bending strength correspondingly reduced, slight decrease in the glass transition temperature.

Synthesis and Characterization of Liquefied Corn Barn-Based Epoxy Resins

2011 ◽  
Vol 236-238 ◽  
pp. 116-119
Author(s):  
Wen Ming Zhang ◽  
Yu Cang Zhang ◽  
De Feng Zhao
Keyword(s):  
Epoxy Resin ◽  
Epoxy Resins ◽  
Raw Materials ◽  
Thermal And Mechanical Properties ◽  
Reaction Conditions ◽  
Good Thermal Stability ◽  
Molecular Weights ◽  
Biomass Materials ◽  
Adhesive Shear Strength

The liquefied corn barn-based epoxy resin (LCBER) was synthesised through the glycidyl etherification reaction from liquefied corn barn (LCB) had having groups of bound phenol and epichlorohydrine under alkali conditions. The average molecular weights of LCBER in various reaction conditions were examined. The extreme high molecular weight portion of LCBER-30 was obtained using LCB at 30 min as raw materials. The epoxy functionality of LCBER was controlled by the amount of bound phenol in LCB. LCBER was cured with polyamide-650 (PA-650) and the thermal and mechanical properties were evaluated. Comparing to the petroleum-based bisphenol-A type epoxy resin (DGEBA), LCBER presented higher adhesive shear strength and good thermal stability. These suggested that LCBER would be more suitable to glue biomass materials.

Synthesise of (4-Ethynyl-Phenyl)-(4-trifluoromethyl-phenyl)-Diazene, a Novel Intermediate of Azobenzene Liquid Crystal with High Birefrigence

2014 ◽  
Vol 584-586 ◽  
pp. 1705-1708
Author(s):  
Xiao Ping Huo ◽  
Qi Pei Xu ◽  
Zong Cheng Miao
Keyword(s):  
Liquid Crystal ◽  
Raw Materials ◽  
Coupling Reaction ◽  
Sonogashira Coupling ◽  
Target Compound ◽  
Reaction Conditions ◽  
Silyl Group ◽  
Sonogashira Coupling Reaction ◽  
Optimum Reaction ◽  
Ft Ir

In order to obtain an important azobenzene liquid crystal intermediate with phenylacetylene group, Sonogashira coupling reaction was used to preparation the compound. In this paper, the intermediate was synthesized by (4-Iodo-phenyl)-(4-trifluoromethyl-phenyl)-diazene and trimethyl silyl acetylene (TMSA) as raw materials, and then the trimethyl silyl group was removaled under the action of K2CO3. During the synthesis, the optimum reaction conditions were obtained, that the mol ratio of (4-Iodo-phenyl)-(4-trifluoromethyl-phenyl)-diazene and trimethyl silyl acetylene was 1:2, the reaction temperature was 80 oC. Fourier transform infrared spectroscopy (FT-IR) was used to measure the molecular structure of the target compound.

Cationic Catalyst as Latent Curing Agent for Epoxy Resin

2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Stability ◽  
Elevated Temperature ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Chemical Conversion ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Good Thermal Stability ◽  
Ft Ir ◽  
Cure Temperature

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

2013 ◽  
Vol 690-693 ◽  
pp. 1649-1652
Author(s):  
Ai Jie Ma ◽  
Qiu Yu Zhang ◽  
You Qiang Shi
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Curing Agent ◽  
Thermal Analyzer ◽  
Epoxy Resin System ◽  
Curing Kinetic ◽  
Resin Curing ◽  
Micro Morphology

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

Synthesis of Anti-Cancer Targeted Therapies Drug Tivozanib

2011 ◽  
Vol 396-398 ◽  
pp. 1490-1492
Author(s):  
Ming Xing Liu ◽  
Li Xiu Hu ◽  
Xian Wen Wang ◽  
Hong Da Zhu
Keyword(s):  
1H Nmr ◽  
Targeted Therapies ◽  
Industrial Production ◽  
Raw Materials ◽  
Condensation Reaction ◽  
High Yield ◽  
Reaction Conditions ◽  
Synthetic Compounds ◽  
Anti Cancer ◽  
Ft Ir

Tivozanib was synthesized through the cyclization, chlorinated, condensation reaction with 2-amino-4,5-dimethoxy acetophenone as the starting material. All synthetic compounds were analyzed by FT-IR, 1H-NMR, MS and HPLC. The purity of tivozanib was more than 98.5%. Synthetic routs and methods of tivozanib are feasible to industrial production owing to the cheap raw materials, mild reaction conditions, stable technology and high yield.

Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

2014 ◽  
Vol 936 ◽  
pp. 63-66 ◽  
Author(s):  
Chun Hua Han ◽  
Lin Wang ◽  
Dong Yu Zhao
Keyword(s):  
Epoxy Resin ◽  
Room Temperature ◽  
Curing Agent ◽  
Curing Process ◽  
Curing Conditions ◽  
Temperature Spectra ◽  
Infrared Spectral ◽  
Ft Ir ◽  
Ir Analysis ◽  
Epoxy Groups

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

Synthesis of Latent Curing Agent for Epoxy Resin

2010 ◽  
Vol 150-151 ◽  
pp. 988-991
Author(s):  
Xue Jun Zhang ◽  
Su Mei Kang ◽  
Zhan Qing Liu
Keyword(s):  
Carbon Fiber ◽  
Epoxy Resin ◽  
Chemical Structure ◽  
Epoxy Composites ◽  
Curing Agent ◽  
High Modulus ◽  
Molar Ratios ◽  
Interlaminar Shear ◽  
Modified Epoxy ◽  
Carbon Fiber Epoxy

A new kind of latent curing agent (LCA) for epoxy resin was synthesized by the reaction of Ethylenediamine with Butylacrylate in equal molar ratios, and the chemical structure and thermal property of the LCA were studied with FTIR and TGA, respectively. Moreover, LCA was also used to modify the epoxy sizing agent for high modulus carbon fiber. The results show that the wettability of sized carbon fiber tends to increase due to the increase of the polymer film on the surface of the carbon fiber, and interlaminar shear strength (ILSS) of the sized high modulus carbon fiber/epoxy composites is improved to 78MPa, which is increased by 8.6% compared with the composites reinforced by high modulus carbon fiber with unmodified sizing agent, indicating that using LCA modified epoxy resin as polymer coating for carbon fiber is a feasible method to improve the interfacial performance of high modulus carbon fiber/epoxy composites.

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