PVDF Films with Superhydrophobic Surface Fabricated by Plasma-Enhanced Chemical Vapor Deposition

2009 ◽  
Vol 79-82 ◽  
pp. 1451-1454 ◽  
Author(s):  
Zhi Qiu Zhang ◽  
Wen Fang Yang ◽  
Zhen Ya Gu ◽  
Rui Ting Huo
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Film Surface ◽  
Chemical Vapor ◽  
Contact Angles ◽  
Water Repellent ◽  
Treatment Technology ◽  
Water Contact ◽  
Lotus Effect ◽  
Pvdf Membrane

Lotus effect is well-known to be governed by chemical properties and nanotextures of the surfaces. In this paper, a method with two-steps treatment technology was applied to develop the superhydrophobic polyvinylidene fruoride(PVDF) membrane with the property of anti-contamination and self-cleaning. First, the PVDF membrane was treated by oxygen plasma so as to get the reactive groups. Second, this film was deposited by perfluoroalkylethyl acrylate precursor/Ar gas via plasma-enhanced chemical vapor deposition (PECVD). The modified film surface exhibited ultra water-repellent ability, showing that the water contact angles was larger than 150 °and the dynamic contact angles was usually lower than 5°.

Low Temperature Deposition of Transparent Ultra Water-Repellent Thin Films by Microwave Plasma Enhanced Chemical Vapor Deposition

2001 ◽  
Vol 711 ◽  
Author(s):  
Yunying Wu ◽  
Yasushi Inoue ◽  
Hiroyuki Sugimura ◽  
Osamu Takai
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Microwave Plasma ◽  
Chemical Vapor ◽  
Contact Angles ◽  
Water Repellent ◽  
Heating Process ◽  
Water Contact ◽  
Preparation Conditions

ABSTRACTOne of the most common methods for obtaining water repellent surfaces is spreading fluoropolymer or fluoroalkylsilane onto substrates. However, this method is not applicable to low heat-resistant substrates such as plastics, since after spreading, the method requires a heating process which is generally conducted at a temperature of about 600K. The objective of this study is the preparation of ultra water-repellent and optically transparent thin films at low temperatures below 373K. The films were deposited by means of microwave plasma enhanced plasma chemical vapor deposition (MPECVD) using organosilane, that is, trimethylmethoxysilane (TMMOS) as a source with adding Ar, CO2, N2, O2 or air as an excitation gas. Under optimized preparation conditions, films with water contact angles more than 150 degrees and optical transparencies more than 90% were successfully fabricated.

scholarly journals AACVD Synthesis and Characterization of Iron and Copper Oxides Modified ZnO Structured Films

Nanomaterials ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 471 ◽  
Author(s):  
Martha Claros ◽  
Milena Setka ◽  
Yecid P. Jimenez ◽  
Stella Vallejos
Keyword(s):  
Contact Angle ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Contact Angles ◽  
Copper Oxides ◽  
Water Contact ◽  
X Ray ◽  
Hydrophobic Behavior

Non-modified (ZnO) and modified (Fe2O3@ZnO and CuO@ZnO) structured films are deposited via aerosol assisted chemical vapor deposition. The surface modification of ZnO with iron or copper oxides is achieved in a second aerosol assisted chemical vapor deposition step and the characterization of morphology, structure, and surface of these new structured films is discussed. X-ray photoelectron spectrometry and X-ray diffraction corroborate the formation of ZnO, Fe2O3, and CuO and the electron microscopy images show the morphological and crystalline characteristics of these structured films. Static water contact angle measurements for these structured films indicate hydrophobic behavior with the modified structures showing higher contact angles compared to the non-modified films. Overall, results show that the modification of ZnO with iron or copper oxides enhances the hydrophobic behavior of the surface, increasing the contact angle of the water drops at the non-modified ZnO structures from 122° to 135° and 145° for Fe2O3@ZnO and CuO@ZnO, respectively. This is attributed to the different surface properties of the films including the morphology and chemical composition.

scholarly journals Chemical Vapor Deposition of Metallic Films Using Plasma Electrons as Reducing Agents

2019 ◽  
Author(s):  
Hama Nadhom ◽  
Daniel Lundin ◽  
Polla Rouf ◽  
Henrik Pedersen
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Argon Plasma ◽  
Film Surface ◽  
Chemical Vapor ◽  
Reducing Agents ◽  
Metallic Films ◽  
Metal Centers ◽  
Positive Valence ◽  
Precursor Molecules

Metallic thin films are key components in electronic devices and catalytic applications. Deposition of a conformal metallic thin film require using volatile precursor molecules in a chemical vapor deposition (CVD) process. The metal centers in such molecules typically have a positive valence, meaning that reduction of the metal centers is required on the film surface. Powerful molecular reducing agents for electropositive metals are scarce and hampers the exploration of CVD of electropositive metals. We present a new CVD method for depositing metallic films where free electrons in a plasma discharge are utilized to reduce the metal centers of chemisorbed precursor molecules. We demonstrate this method by depositing Fe, Co and Ni from their corresponding metallocenes using electrons from an argon plasma as a reducing agent.

scholarly journals Suppression of Hydrophobic Recovery in Photo-Initiated Chemical Vapor Deposition

Catalysts ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 534
Author(s):  
Alessio Aufoujal ◽  
Ulrich Legrand ◽  
Jean-Luc Meunier ◽  
Jason Robert Tavares
Keyword(s):  
Contact Angle ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Water Contact ◽  
Initiated Chemical Vapor Deposition ◽  
Hydrophobic Recovery ◽  
Topmost Layer ◽  
Nanometric Film ◽  
Polar Functional Groups

Photo-initiated chemical vapor deposition (PICVD) functionalizes carbon nanotube (CNT)-enhanced porous substrates with a highly polar polymeric nanometric film, rendering them super-hydrophilic. Despite its ability to generate fully wettable surfaces at low temperatures and atmospheric pressure, PICVD coatings normally undergo hydrophobic recovery. This is a process by which a percentage of oxygenated functional group diffuse/re-arrange from the top layer of the deposited film towards the bulk of the substrate, taking the induced hydrophilic property of the material with them. Thus, hydrophilicity decreases over time. To address this, a vertical chemical gradient (VCG) can be deposited onto the CNT-substrate. The VCG consists of a first, thicker highly cross-linked layer followed by a second, thinner highly functionalized layer. In this article, we show, through water contact angle and XPS measurements, that the increased cross-linking density of the first layer can reduce the mobility of polar functional groups, forcing them to remain at the topmost layer of the PICVD coating and to suppress hydrophobic recovery. We show that employing a bi-layer VCG suppresses hydrophobic recovery for five days and reduces its effect afterwards (contact angle stabilizes to 42 ± 1° instead of 125 ± 3°).

Synthesis by plasma-enhanced chemical-vapor deposition and characterization of siliconlike films with hydrophobic functionalities for improved long-term geometric stability of fiber-reinforced polymers

2008 ◽  
Vol 23 (4) ◽  
pp. 1042-1050 ◽  
Author(s):  
A. Cremona ◽  
E. Vassallo ◽  
A. Merlo ◽  
A. Srikantha Phani ◽  
L. Laguardia
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
High Strength ◽  
Scratch Resistance ◽  
Fiber Reinforced Polymers ◽  
Fiber Reinforced ◽  
Water Contact ◽  
Fiber Failure

Amorphous siliconlike films with hydrophobic functionalities have been deposited by plasma-enhanced chemical-vapor deposition on carbon-fiber-reinforced polymer (CFRP) unidirectional laminates used for micromechanical applications where high strength-to-weight and high stiffness-to-weight ratios are required. To improve long-term geometrical stability in ultrahigh-precision machine structures, hydrophobic CFRP materials are desirable. Three layers have been grown with different plasma-process parameters from a mixture of hexamethyldisiloxane, O2, and Ar. Chemical composition, water contact angle, surface energy, morphology, and tribological properties have been evaluated to choose the one that best fulfills hydrophobicity, wear, and scratch resistance. Wear tests have also been carried out on CFRP laminates coated with a polyurethane layer to compare the wear performance of the above specimens with that of a conventional hydrophobic coating. Scanning electron microscope images show a very good adhesion of the films to the composite substrate because the failure of the film and of the substrate (such as fiber failure) take place simultaneously.

Water Desorption from Magnesium Oxide Films Fabricated by Chemical Vapor Deposition

2006 ◽  
Vol 11-12 ◽  
pp. 693-696 ◽  
Author(s):  
S. Kawaguchi ◽  
K.C. Namiki ◽  
S. Ohshio ◽  
Junichi Nishino ◽  
H. Saitoh
Keyword(s):  
Chemical Vapor Deposition ◽  
Magnesium Oxide ◽  
Vapor Deposition ◽  
High Vacuum ◽  
Secondary Electron Emission ◽  
Film Surface ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Water Desorption ◽  
Plasma Sputtering

Magnesium oxide (MgO) films are utilized for the anti-plasma sputtering coating with excellent ability of secondary electron emission in plasma display panels (PDP). These properties are degraded by the impurities adsorbed on the film surface. Therefore, we should obtain impurity-free surface during the PDP manufacturing process. We have synthesized whisker and continuous film types of metal oxide using a chemical vapor deposition (CVD) method operated under atmosphere. In this study, a temperature programmed desorption method has been applied to detect residual species adsorbed on the surface of the present films in the ultra-high vacuum atmosphere. The amount of water adsorption was determined by this method.

Comparisons of Gallium Nitride and Indium Nitride Properties after CF4 / Argon Reactive Ion Etching

2002 ◽  
Vol 743 ◽  
Author(s):  
Marie Wintrebert-Fouquet ◽  
K. Scott ◽  
A. Butcher ◽  
Simon K H Lam
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Indium Nitride ◽  
Reactive Ion Etching ◽  
Film Surface ◽  
Chemical Vapor ◽  
Electrical Characteristics ◽  
Ion Etching ◽  
Before And After

ABSTRACTWe present a comparative study of the effects of low power reactive ion etching (RIE) on GaN and InN. This new, highly chemical, dry etching, using CF4 and Ar, has been developed for thin nitride films grown at low temperature in our laboratories. GaN films were grown by remote plasma enhanced-laser induced chemical vapor deposition and InN films were grown by radio-frequency RF reactive sputtering. Commercial GaN samples were also examined. Optical and electrical characteristics of the films are reported before and after removing 100 to 200 nm of the film surface by RIE. We have previously shown that the GaN films, although polycrystalline after growth, may be re-crystallized below the growth temperature. Removal of the surface oxide has been found to be imperative since a polycrystalline residue remains on the surface after re-crystallization.

scholarly journals Transparent superhydrophobic PTFE films via one-step aerosol assisted chemical vapor deposition

RSC Advances ◽  
2017 ◽  
Vol 7 (47) ◽  
pp. 29275-29283 ◽  
Author(s):  
Aoyun Zhuang ◽  
Ruijin Liao ◽  
Sebastian C. Dixon ◽  
Yao Lu ◽  
Sanjayan Sathasivam ◽  
...  
Keyword(s):  
Contact Angle ◽  
Chemical Vapor Deposition ◽  
Water Contact Angle ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Sliding Angle ◽  
Water Contact ◽  
Visible Transmittance ◽  
One Step

Hierarchical micro/nano-structured transparent superhydrophobic polytetrafluoroethylene films with water contact angle 168°, water sliding angle <1° and visible transmittance >90% were prepared on glass via aerosol-assisted chemical vapor deposition.

Surface physical property of the CrO2 thin films prepared using a closed chemical vapor deposition method

2012 ◽  
Vol 1406 ◽  
Author(s):  
Y. Muraoka ◽  
S. Yoshida ◽  
T. Wakita ◽  
M. Hirai ◽  
T. Yokoya
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Film Surface ◽  
Chemical Vapor ◽  
Physical Property ◽  
Physical Nature ◽  
Photoemission Spectroscopy ◽  
Chemical Vapor Deposition Method ◽  
Deposition Method

ABSTRACTWe have examined the intrinsic surface physical property of a CrO2 thin film by means of surface sensitive photoemission spectroscopy. Epitaxial thin film of CrO2(100) has been grown on TiO2(100) by a closed chemical vapor deposition method using a Cr8O21 precursor. Low-energy electron diffraction (LEED) observations find that epitaxial growth of rutile-phase CrO2 occurs to the top monolayer of the film. Surface sensitive x-ray photoemission spectroscopy (XPS) measurements show a finite intensity in the region of the Fermi energy. The result evidences that the physical nature of near topmost layer of CrO2 thin film is metallic. Progress of understanding of the surface physical property of CrO2 thin film helps not only perform a reliable photoemission study to understand the physics of ferromagnetic metal in CrO2, but also develop the CrO2-based devices using a half-metallic nature for spintronics applications.

The Application of Wear Resistant Thin Layers for Cold Forming Tools

2014 ◽  
Vol 782 ◽  
pp. 619-622 ◽  
Author(s):  
Pavol Beraxa ◽  
Lucia Domovcová ◽  
Ľudovít Parilák
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Operating Conditions ◽  
Thin Layers ◽  
Treatment Technology ◽  
Cold Forming ◽  
Forming Tools

Along with technologies development rise demands on the technical level of new machinery and equipment and also the reliability and efficiency of tools used in the production processes. One of the options for increasing tool life and wear resistance is the use of tools surface treatment technology called as CVD (chemical vapor deposition) and PVD (Physical Vapor Deposition) process. Chemical vapor deposition is a widely used materials-processing. CVD is an atomistic surface modification process, where a thin solid coating is deposited on an underlying heated substrate via a chemical reaction from the vapor or gas phase, PVD process is atomistic deposition process in which material is vaporized from a solid or liquid source in the form of atoms or molecules, transported in the form of a vapor through a vacuum or low pressure gaseous (or plasma) environment to the substrate where it condenses. The paper introduces the possibilities of application of these processes for cold forming tools used at operating conditions of Železiarne Podbrezová, a.s. Tools (formers and straightening rolls) are evaluated in terms of CVD and PVD coating thickness, microstructure and microhardness of tool material and coating.

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