Preparation and Characterization of Epoxy Resin Composite Modified by Flexible Polyurethane Resin

2014 ◽  
Vol 904 ◽  
pp. 170-172 ◽  
Author(s):  
Rong Cheng ◽  
Cheng Zhang ◽  
Jing Wang
Keyword(s):  
Composite Materials ◽  
Epoxy Resin ◽  
Performance Test ◽  
Mechanical Performance ◽  
Resin Composite ◽  
Mass Ratio ◽  
Scanning Calorimetry ◽  
Epoxy Resin Composite ◽  
Amine Curing ◽  
Modified Epoxy

In this paper, under the effect of MD1041 cashew oil modified phenolic amine curing agent for epoxy resin, it successfully prepared polyurethane flexible resin modified epoxy resin composite materials by using polyurethane modified epoxy resin reinforced flexible resin. Modified composite material of the new preparation is characteristed by the method of the mechanical performance test, Fourier transform infrared spectroscopy (FTIR), differential scanning calorimetry (DSC). The results show that the flexible resin has a strong effect on the toughness of modified epoxy resin composite materials. When the mass ratio of the flexible resin account for 5.9%,comprehensive mechanical properties of the modified composites is at the premium; when the mass ratio of flexible resin account for 3.1%, the thermal stability of the epoxy resin modified with flexible resin is at the best.

Treeing Deterioration Characteristics in Cross-linked Polyethylene and Epoxy Resin Composite Materials

1997 ◽  
Vol 36 (Part 1, No. 7A) ◽  
pp. 4392-4396
Author(s):  
Changmin Yuan ◽  
Noboru Yoshimura ◽  
Jangseob Lim ◽  
Hiroyuki Miyata ◽  
Toshio Niwa
Keyword(s):  
Composite Materials ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Epoxy Resin Composite ◽  
Deterioration Characteristics

Effect of Backing Materials on the Performance of Cement-Based Piezoelectric Ultrasonic Sensors

2013 ◽  
Vol 351-352 ◽  
pp. 1273-1277
Author(s):  
Xin Chun Xie ◽  
Mi Mi Li ◽  
Dong Yu Xu ◽  
Peng Kun Hou ◽  
Shi Feng Huang
Keyword(s):  
Composite Materials ◽  
Epoxy Resin ◽  
Metal Powder ◽  
Resin Composite ◽  
Wave Number ◽  
Frequency Bandwidth ◽  
Epoxy Resin Composite ◽  
Longitudinal Resolution ◽  
Echo Pulse ◽  
Peak Value

In order to increase the sensitivity, frequency bandwidth and longitudinal resolution of the 1-3 cement-based piezoelectric ultrasonic sensor, different metal powder/epoxy resin composite materials were used to make backing layer, and the performances of sensors were evaluated and compared. The results indicated that the increase of the sensitivity and the frequency bandwidth, as well as a decrease of the pulse wave number can be observed when the backing materials of metal powder/epoxy resin composite materials were added to the sensor. A 42%-increase of the maximum peak-to-peak value of the echo pulse response, a 52%-reduction of the ring down time and a 200%-increase of the bandwidth can be achieved by using the backing material.

scholarly journals Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module

2021 ◽  
Vol 18 (3) ◽  
pp. 123-136
Author(s):  
Tzu-Hsuan Cheng ◽  
Kenji Nishiguchi ◽  
Yoshi Fukawa ◽  
B. Jayant Baliga ◽  
Subhashish Bhattacharya ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
High Power ◽  
High Performance ◽  
Mechanical Performance ◽  
Resin Composite ◽  
Wide Band ◽  
Cost Effective ◽  
Power Module ◽  
Wide Band Gap ◽  
Epoxy Resin Composite

Abstract Wide-Band Gap (WBG) power devices have become a promising option for high-power applications due to the superior material properties over traditional Silicon. To not limit WBG devices’ mother nature, a rugged and high-performance power device packaging solution is necessary. This study proposes a Double-Side Cooled (DSC) 1.2 kV half-bridge power module having dual epoxy resin insulated metal substrate (eIMS) for solving convectional power module challenges and providing a cost-effective solution. The thermal performance outperforms traditional Alumina (Al2O3) Direct Bonded Copper (DBC) DSC power module due to moderate thermal conductivity (10 W/mK) and thin (120 mm) epoxy resin composite dielectric working as the IMS insulation layer. This novel organic dielectric can withstand high voltage (5 kVAC @ 120 μm) and has a Glass Transition Temperature (Tg) of 300°C, which is suitable for high-power applications. In the thermal-mechanical modeling, the organic DSC power module can pass the thermal cycling test over 1,000 cycles by optimizing the mechanical properties of the encapsulant material. In conclusion, this article not only proposes a competitive organic-based power module but also a methodology of evaluation for thermal and mechanical performance.

Studies on the Thermal Conductivity of Al2O3/Epoxy Resin Composite Materials

2012 ◽  
Vol 535-537 ◽  
pp. 235-238 ◽  
Author(s):  
Xiao Hu Wan ◽  
Li Ge Wang ◽  
Bin Zuo ◽  
En Ze Wang ◽  
Guang Zhi Zhu
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Composite Materials ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Pure Epoxy ◽  
Mean Particle Size ◽  
Epoxy Resin Composite

Al2O3/epoxy resin composite materials were prepared with alumina as filler in this paper, and the effects of particle size and added quantity of Al2O3 powers on the thermal conductivity of the composites have been investigated. The results show that, thermal conductivity of the composites increases with the increase of the added quantity of Al2O3 powders, and suitable particle size of alumina filler could help to form heat conductive chain which can improve the thermal conductivity of the composites effectively. The thermal conductivity could reach 0.48 W/(m•K), which is five times than that of pure epoxy resin, when the amount of alumina powders is 60% and its mean particle size is 100µm.

Study on epoxy resin with high elongation-at-break using polyamide and polyether amine as a two-component curing agent

e-Polymers ◽  
2018 ◽  
Vol 18 (5) ◽  
pp. 433-439
Author(s):  
Shunsheng Su ◽  
Haiqing Wang ◽  
Chuanjian Zhou ◽  
Yanxiang Wang ◽  
Jianjun Liu
Keyword(s):  
Epoxy Resin ◽  
Tensile Tests ◽  
Curing Agent ◽  
Scanning Calorimetry ◽  
Elongation At Break ◽  
Epoxy Curing ◽  
Two Component ◽  
High Elongation ◽  
Amine Curing ◽  
Modified Epoxy

AbstractThis study aimed to improve the flexibility of E-51 epoxy resin by using polyamide/polyether amine as a two-component curing agent. Through solid state nuclear magnetic resonance (SSNMR), it was found that the cross-linking density of epoxy resin could be effectively reduced by adding the polyamide and polyether amine curing agent. The tensile tests showed that the elongation-at-break was remarkably improved. It was found by differential scanning calorimetry (DSC) that the curing behavior of the polyamide epoxy curing system varied with the addition of different polyether amine. Phase contrast microscope showed that phase separation occurred during the reaction of epoxy resin with the polyamide/polyether amine composite curing agent. In this paper, the modified epoxy resin was endowed with high elongation-at-break (>100%) and appropriate tensile strength (10~20 MPa).

Study on the Compatibilizing Effect of Janus Particles on Liquid Isoprene Rubber/Epoxy Resin Composite Materials

2017 ◽  
Vol 56 (47) ◽  
pp. 14060-14068 ◽  
Author(s):  
Wenqin Xu ◽  
Jiawen Chen ◽  
Shuning Chen ◽  
Qinhui Chen ◽  
Jinhuo Lin ◽  
...  
Keyword(s):  
Composite Materials ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Janus Particles ◽  
Epoxy Resin Composite ◽  
Compatibilizing Effect ◽  
Isoprene Rubber
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