Microstructural Analysis of an Experimentally Deformed Chalcopyrite Grain by Orientation Imaging Microscopy

1994 ◽  
Vol 157-162 ◽  
pp. 739-744
Author(s):  
E.M. Jansen ◽  
Karsten Kunze
Keyword(s):  
Microstructural Analysis ◽  
Orientation Imaging Microscopy ◽  
Orientation Imaging

Texture and microtexture of copper films prepared by the self-ion assisted deposition technique on barrier layers with different structure

2002 ◽  
Vol 721 ◽  
Author(s):  
Oleg V. Kononenko ◽  
Victor N. Matveev ◽  
Andrei G. Vasiliev ◽  
Ivan Khorin ◽  
Tejodher Muppidi ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Layer Structure ◽  
Microstructural Analysis ◽  
Orientation Imaging Microscopy ◽  
Silicon Substrates ◽  
Copper Films ◽  
Deposition Technique ◽  
Cu Films ◽  
Barrier Layers ◽  
Orientation Imaging

AbstractCu may diffuse into the active areas of semiconductors resulting in degradation of the devices. Therefore Cu is isolated from silicon wafers by barrier layers. In this study, copper films were deposited onto silicon substrates coated using polycrystalline Ta3N5 and amorphous α-C:H barrier by the partially ionized beam deposition technique at 6 kV bias, to investigate an influence of barrier layer structure on texture and microstructure of Cu films. After deposition, films were annealed under vacuum. Texture of the films was studied by X-ray diffraction and further microstructural analysis of the copper films was performed by orientation imaging microscopy. Results of the structural analysis reveal large (100) grains in films deposited on α-C:H barrier layer and a bi-modal texture in films on Ta3N5.

Influence of Dynamic Recrystallisation on Texture Formation in ECAP deformed Nickel

2007 ◽  
Vol 558-559 ◽  
pp. 575-580 ◽  
Author(s):  
Werner Skrotzki ◽  
Burghardt Klöden ◽  
I. Hünsche ◽  
Robert Chulist ◽  
Satyam Suwas ◽  
...  
Keyword(s):  
Orientation Imaging Microscopy ◽  
High Energy ◽  
Texture Gradient ◽  
Texture Formation ◽  
Microstructure Formation ◽  
Fcc Metals ◽  
Orientation Imaging ◽  
Angular Pressing ◽  
Dynamic Recrystallisation ◽  
Number Of Passes

3N nickel has been deformed by equal channel angular pressing (ECAP) at 400°C up to 3 passes using route A. The texture with respect to position in the deformed billet, i.e. from top to bottom, has been measured with high-energy synchrotron radiation. It is characterized by texture components typical for simple shear in the intersection plane of the square-shaped 90° bent channel. Besides, an oblique cube component is observed. Orientation imaging microscopy clearly shows that this component is due to partial recrystallization. Intensities of the texture components as well as deviations from their ideal shear positions vary from the top to the bottom of the billet and with the number of passes. The change of the intensity of texture components and the texture gradient investigated is discussed. Special emphasis is put on the influence of dynamic recrystallization on texture and microstructure formation during ECAP of fcc metals.

Ultra Grain Refinement of Low C Steels by Accumulative Roll Bonding

2006 ◽  
Vol 503-504 ◽  
pp. 311-316 ◽  
Author(s):  
I. Salvatori
Keyword(s):  
Accumulative Roll Bonding ◽  
Orientation Imaging Microscopy ◽  
Low Carbon Steel ◽  
Small Samples ◽  
Low Carbon ◽  
High Angle ◽  
Misorientation Distribution ◽  
Roll Bonding ◽  
Orientation Imaging ◽  
Annealing Conditions

Refinement of grain size is one of the biggest challenges to produce steels with improved combination of strength and toughness. Ultrafine structures are being produced world-wide on various materials, including low carbon steel, using different types of processes. However, the majority of these processes also exhibit severe limitations because they are generally restricted to small samples and are difficult to be implemented on an industrial scale. A promising technique for industrial implementation is the Accumulative Roll Bonding (ARB), a process able to supply large samples, even in the laboratory scale. In this paper, warm intense straining (ε = 4) by ARB was applied to a plain low-C steel in order to develop ultrafine grains, aiming at sizes around 1-2 μm, suitable to maintain an adequate combination of strength and ductility. The effect of annealing conditions on the evolution of the work-hardened microstructure and the bonding behaviour after each pass were investigated. Orientation Imaging Microscopy was used to investigate the microstructure and give a quantitative assessment of high angle and low angle boundaries. It is showed that the frequency of high angle grain boundaries increases with the strain but the misorientation distribution remained far from that typical of a recrystallised material.

Structure Development during ECAP and Subsequent Creep of Aluminium

2007 ◽  
Vol 539-543 ◽  
pp. 493-498 ◽  
Author(s):  
Ivan Saxl ◽  
Vàclav Sklenička ◽  
L. Ilucová ◽  
Milan Svoboda ◽  
Petr Král
Keyword(s):  
High Purity ◽  
Grain Orientation ◽  
Orientation Imaging Microscopy ◽  
Structural Inhomogeneity ◽  
Structure Development ◽  
Creep Fracture ◽  
Orientation Imaging ◽  
Purity Aluminium ◽  
High Purity Aluminium ◽  
Creep Loading

Considerable structural inhomogeneity and anisotropy were found even after eight ECAP passes in high purity aluminium and the creep loading of ECAP material at 473K, 15MPa resulted in scattered fracture times ~ 20-60 hours. The structure revealed by orientation imaging microscopy with different disclination bounds was analysed by stereological methods. The effect of inhomogeneity and grain orientation on the creep fracture time was assessed.

scholarly journals Defect and Damage Evolution Quantification in Dynamically-Deformed Metals Using Orientation-Imaging Microscopy

2010 ◽  
Vol 654-656 ◽  
pp. 2297-2302 ◽  
Author(s):  
George T. Gray III ◽  
Veronica Livescu ◽  
Ellen K. Cerreta
Keyword(s):  
Detonation Wave ◽  
Damage Evolution ◽  
Shock Loading ◽  
Volume Fraction ◽  
Orientation Imaging Microscopy ◽  
Electron Back Scatter Diffraction ◽  
Orientation Imaging ◽  
Deformation Twins

Orientation-imaging microscopy offers unique capabilities to quantify the defects and damage evolution occurring in metals following dynamic and shock loading. Examples of the quantification of the types of deformation twins activated, volume fraction of twinning, and damage evolution as a function of shock loading in Ta are presented. Electron back-scatter diffraction (EBSD) examination of the damage evolution in sweeping-detonation-wave shock loading to study spallation in Cu is also presented.

Modeling Evolution of Microstructures Beneath Topographically Textured Surfaces Produced Using Shear Based Material Removal

2016 ◽  
Author(s):  
Saurabh Basu ◽  
Zhiyu Wang ◽  
Christopher Saldana
Keyword(s):  
Microstructure Evolution ◽  
Material Removal ◽  
A Priori ◽  
Orientation Imaging Microscopy ◽  
Machining Process ◽  
Textured Surfaces ◽  
Orientation Imaging ◽  
Using Data ◽  
Electron Back Scattered Diffraction ◽  
Tool Chatter

Tool chatter is envisaged as a technique to create undulations on fabricated biomedical components. Herein, a-priori designed topographies were fabricated using modulate assisted machining of oxygen free high conductivity copper. Subsequently, underpinnings of microstructure evolution in this machining process were characterized using electron back scattered diffraction based orientation imaging microscopy. These underpinnings were related to the unsteady mechanical states present during modulated assisted machining, this numerically modeled using data obtained from simpler machining configurations. In this manner, relationships between final microstructural states and the underlying mechanics were found. Finally, these results were discussed in the context of unsteady mechanics present during tool chatter, it was shown that statistically predictable microstructural outcomes result during tool chatter.

Application of Crystal Orientation Mapping to Intra-Grain Misorientations

1997 ◽  
Vol 3 (S2) ◽  
pp. 563-564
Author(s):  
Robert Davies ◽  
Valerie Randlè
Keyword(s):  
Crystal Orientation ◽  
Orientation Imaging Microscopy ◽  
Electron Back Scatter Diffraction ◽  
Pure Aluminium ◽  
Orientation Imaging ◽  
Orientation Mapping ◽  
Black Pixel ◽  
Ebsd Pattern ◽  
Crystal Orientation Mapping ◽  
Scanning Electron

Crystal orientation mapping (COM), which is also referred to as orientation imaging microscopy (OIM), is a powerful tool which opens up enormous possibilities for investigation of materials. The principle of COM is that the microstructure is displayed or mapped according to the orientation of sampled volumes of crystal. These data are obtained in the scanning electron microscope by moving either the electron beam or the specimen stage through predetermined steps and collecting an electron back-scatter diffraction (EBSD) pattern. Typically, a null orientation is represented by a black pixel and colours are used to depict orientations, thus allowing discrete orientation changes such as grain boundaries to be plotted directly in a map format. This is exemplified in figure 1 which shows an orientation map generated from pure aluminium which has undergone 5% cold rolling. The diffiiseness of EBSD patterns further permits strain changes to be mapped.

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