scholarly journals Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced Wafers

2020 ◽  
Vol 17 (4) ◽  
pp. 111-120
Author(s):  
John H. Lau ◽  
Cheng-Ta Ko ◽  
Tzvy-Jang Tseng ◽  
Chia-Yu Peng ◽  
Kai-Ming Yang ◽  
...  
Keyword(s):  
Solder Ball ◽  
Low Cost ◽  
Time Dependent ◽  
Process Equipment ◽  
Pcb Assembly ◽  
Element Simulation ◽  
Chip Scale Package ◽  
Nonlinear Temperature ◽  
Very High ◽  
Original Device

Abstract In this study, the design, materials, process, assembly, and reliability of a six-side molded panel-level chip-scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the redistribution layers (RDLs) of the PLCSP on a large temporary panel with multiple device wafers. Because all the printed circuited board (PCB) panels are in rectangular shape, some of the device wafers are diced into two or more pieces so the panel is fully utilized. Thus, it is very high throughput. Because all the processes/equipment are PCB processes/equipment (not semiconductor process/equipment), it is a very low-cost process. After the fabrication of RDLs, the wafers from the PCB panel were debonded. It is followed by solder ball mounting and fabricating the six-side molded PLCSP from the original device wafers with RDLs. The drop test and the results including failure analysis of the PLCSP are presented. Thermal cycling of the six-side molded PLCSP PCB assembly is performed by a nonlinear temperature- and time-dependent finite-element simulation.

Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers

2020 ◽  
Vol 2020 (1) ◽  
pp. 000057-000066
Author(s):  
John H Lau ◽  
Cheng-Ta Ko ◽  
Tzvy-Jang Tseng ◽  
Chia-Yu Peng ◽  
Kai-Ming Yang ◽  
...  
Keyword(s):  
Solder Ball ◽  
Low Cost ◽  
Time Dependent ◽  
Process Equipment ◽  
Pcb Assembly ◽  
Element Simulation ◽  
Chip Scale Package ◽  
Nonlinear Temperature ◽  
Very High ◽  
Original Device

Abstract In this study, the design, materials, process, assembly, and reliability of a 6-side molded panel-level chip scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the RDLs (redistribution layers) of the PLCSP on a large temporary panel with multiple device wafers. Since all the printed circuited board (PCB) panels are in rectangular shape, some of the device wafers are diced into two or more pieces so the panel is fully utilized. Thus, it is very high throughput. Since all the processes/equipment are PCB process/equipment (not semiconductor process/equipment), it is a very low cost process. After the fabrication of RDLs, the wafers from the PCB panel are debonded. It is followed by solder ball mounting and fabricating the 6-side molded PLCSP from the original device wafers with RDLs. The drop test and the results including failure analysis of the PLCSP are presented. Thermal cycling of the 6-side molded PLCSP PCB assembly is performed by a nonlinear temperature- and time-dependent finite-element simulation.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2000 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Plastic Creep ◽  
Time Dependent Analysis

Abstract An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the micro VIP CSP PCB assembly is subjected to thermal cycling tests.

Decomposition of the metastable beta titanium alloy Ti-15-3

1983 ◽  
Vol 41 ◽  
pp. 264-265
Author(s):  
Y. L. Chen ◽  
S. Fujlshiro
Keyword(s):  
Low Cost ◽  
High Strength ◽  
Alpha Phase ◽  
Thick Sheet ◽  
Omega Phase ◽  
Beta Titanium Alloy ◽  
Beta Titanium ◽  
Beta Matrix ◽  
Metastable Beta ◽  
Very High

Metastable beta titanium alloys have been known to have numerous advantages such as cold formability, high strength, good fracture resistance, deep hardenability, and cost effectiveness. Very high strength is obtainable by precipitation of the hexagonal alpha phase in a bcc beta matrix in these alloys. Precipitation hardening in the metastable beta alloys may also result from the formation of transition phases such as omega phase. Ti-15-3 (Ti-15V- 3Cr-3Al-3Sn) has been developed recently by TIMET and USAF for low cost sheet metal applications. The purpose of the present study was to examine the aging characteristics in this alloy.The composition of the as-received material is: 14.7 V, 3.14 Cr, 3.05 Al, 2.26 Sn, and 0.145 Fe. The beta transus temperature as determined by optical metallographic method was about 770°C. Specimen coupons were prepared from a mill-annealed 1.2 mm thick sheet, and solution treated at 827°C for 2 hr in argon, then water quenched. Aging was also done in argon at temperatures ranging from 316 to 616°C for various times.

Review on Switches for Power Applications: Macro to Micro

2019 ◽  
Vol 12 (3) ◽  
pp. 200-209
Author(s):  
Femi Robert
Keyword(s):  
Leakage Current ◽  
Power Loss ◽  
Low Cost ◽  
Electrical System ◽  
High Isolation ◽  
Fast Switching ◽  
Environmental Friendly ◽  
State Resistance ◽  
Very High ◽  
Bulk Production

Background: Switches are important component in electrical system. The switches needs to have the advantages of low ON-state resistance, very high OFF-state resistance, high isolation, no leakage current, less power loss, fast switching, high linearity, small size, arcless and low cost in bulk production. Also these switches have to be reliable and environmental friendly. Methods: In this paper, macro and microswitches for power applications are extensively reviewed and summarized. Various types of switches such as mechanical, solid-state, hybrid and micromechanical switches have been used for power applications are reviewed. The importance and challenge in achieving arcless switching is presented. Results: The use of micromechanical switches for power applications, actuation techniques, switching modes, reliability and lifetime are also reviewed. The modeling and design challenges are also reviewed. Conclusion: The applications of micromechanical switches shows that the switches can reduce the leakage current in battery operated systems and reduce the size of the system considerably.

scholarly journals High spatial resolution photo mosaicking for the monitoring of coralligenous reefs

Coral Reefs ◽  
2021 ◽  
Author(s):  
E. Casoli ◽  
D. Ventura ◽  
G. Mancini ◽  
D. S. Pace ◽  
A. Belluscio ◽  
...  
Keyword(s):  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Low Cost ◽  
Pixel Resolution ◽  
Recording Apparatus ◽  
Assemblage Composition ◽  
Very High Spatial Resolution ◽  
Vertical Walls ◽  
Non Destructive ◽  
Very High

AbstractCoralligenous reefs are characterized by large bathymetric and spatial distribution, as well as heterogeneity; in shallow environments, they develop mainly on vertical and sub-vertical rocky walls. Mainly diver-based techniques are carried out to gain detailed information on such habitats. Here, we propose a non-destructive and multi-purpose photo mosaicking method to study and monitor coralligenous reefs developing on vertical walls. High-pixel resolution images using three different commercial cameras were acquired on a 10 m2 reef, to compare the effectiveness of photomosaic method to the traditional photoquadrats technique in quantifying the coralligenous assemblage. Results showed very high spatial resolution and accuracy among the photomosaic acquired with different cameras and no significant differences with photoquadrats in assessing the assemblage composition. Despite the large difference in costs of each recording apparatus, little differences emerged from the assemblage characterization: through the analysis of the three photomosaics twelve taxa/morphological categories covered 97–99% of the sampled surface. Photo mosaicking represents a low-cost method that minimizes the time spent underwater by divers and capable of providing new opportunities for further studies on shallow coralligenous reefs.

Beyond Smart Grid: Alternatives for Transmission and Low-Cost Firming Storage of Stranded Renewables as Hydrogen and Ammonia Fuels via Underground Pipelines

2011 ◽  
Author(s):  
William C. Leighty ◽  
John H. Holbrook
Keyword(s):  
Smart Grid ◽  
Low Cost ◽  
Large Solution ◽  
Electricity Grid ◽  
Underground Pipelines ◽  
The World ◽  
Integration Problem ◽  
Salt Caverns ◽  
Annual Scale ◽  
Very High

We must soon “run the world on renewables” but cannot, and should not try to, accomplish this entirely with electricity transmission. We need to supply all energy, not just electricity, from diverse renewable energy (RE) resources, both distributed and centralized, where the world’s richest RE resources — of large geographic extent and high intensity — are stranded: far from end-users with inadequate or nonexistent gathering and transmission systems to deliver the energy. Electricity energy storage cannot affordably firm large, intermittent renewables at annual scale, while carbon-free gaseous hydrogen (GH2) and liquid anhydrous ammonia (NH3) fuels can: GH2 in large solution-mined salt caverns, NH3 in surface tanks, both pressurized and refrigerated. “Smart Grid” is emerging as primarily a DSM (demand side management) strategy to encourage energy conservation. Making the electricity grid “smarter” does not: 1. Increase physical transmission capacity; 2. Provide affordable annual-scale firming storage for RE; 3. Solve grid integration problem for large, time-varying RE; 4. Alleviate NIMBY objections to new transmission siting; 5. Reduce the high O&M costs of overhead electric lines. The “smarter” grid may be more vulnerable to cyberattack. Adding storage, control, and quality adjunct devices to the electricity grid, to accommodate very high renewables content, may be technically and economically inferior to GH2 and NH3 RE systems. Thus, we need to look beyond “smart grid”, expanding our concept of “transmission”, to synergistically and simultaneously solve the transmission, firming storage, and RE integration “balancing” problems now severely constraining our progress toward “running the world on renewables”.

Breeding for improved blanchability in peanut: phenotyping, genotype × environment interaction and selection

2018 ◽  
Vol 69 (12) ◽  
pp. 1237 ◽  
Author(s):  
G. C. Wright ◽  
M. G. Borgognone ◽  
D. J. O Connor ◽  
R. C. N. Rachaputi ◽  
R. J. Henry ◽  
...  
Keyword(s):  
Low Cost ◽  
Peanut Butter ◽  
Environment Interaction ◽  
Breeding Lines ◽  
Seed Supply ◽  
Genotype Environment Interaction ◽  
Effective Selection ◽  
The Usa ◽  
Speed Up ◽  
Very High

Breeding for improved blanchability—the propensity of the testa (skin) to be removed from the kernel following rapid heat treatment—is a priority for improvement in the Australian Peanut Breeding Program (APBP). Easy removal of the testa by blanching is required for processing of peanuts into peanut butter and various other confectionary products. Thus, blanchability is an economically important trait in any newly released cultivar in Australia. A better understanding of the range of genetic variation, nature of inheritance and genotype×environment (G×E) interactions, and the development of a low-cost method to phenotype in early generations, could speed up breeding for this trait. Studies were conducted to develop a low-cost, rapid method utilising minimal amounts of seed to phenotype in early generations, along with an assessment of G×E interactions over a range of years and environments to derive optimal selection protocols. Use of a smaller kernel sample size than standard (50 vs 200g) was effective for accurately assessing blanchability in breeding lines and could allow selection in early generations (e.g. in seed produced from a single F2 plant where seed supply is adequate). G×E interaction for blanchability was shown to be very low. Genotypic variance explained 62–100% of the total variance for blanchability, assessed in two diverse germplasm pools including 107 accessions in the USA mini-core over three environments and multiple APBP breeding lines grown over nine different years–environments. Genotypic correlations between all environments were very high (~0.60–0.96), with heritability for the blanchability trait estimated to be very high (0.74–0.97) across the 13 trials. The results clearly demonstrate that effective selection for improved blanchability can be conducted in early generations and in a limited number of contrasting environments to ensure consistency of results.

scholarly journals Analysis of Drying of Brewers’ Spent Grain

Proceedings ◽  
2018 ◽  
Vol 2 (23) ◽  
pp. 1467 ◽  
Author(s):  
José Ignacio Arranz ◽  
María Teresa Miranda ◽  
Francisco José Sepúlveda ◽  
Irene Montero ◽  
Carmen Victoria Rojas
Keyword(s):  
Energy Use ◽  
Low Cost ◽  
Matter Content ◽  
Raw Material ◽  
Dry Matter Content ◽  
Brewing Industry ◽  
Livestock Feed ◽  
Spent Grain ◽  
Very High ◽  
Animal Consumption

Brewing industry generates a main residue, brewers’ spent grain (BSG), which has good properties both for use in animal consumption and for thermal use, but contains a very high content of moisture (20–25% dry matter content), so that its elimination or treatment should be immediate, since it can cause degeneration problems of the product. Currently, brewers often supply this material at low cost for use as livestock feed. This solution is not efficiently carried out without reporting too much benefit to the brewers more than to eliminate waste from their facilities. However, BSG is a raw material of interest for application in different areas due to its low price, availability throughout the year and a valuable chemical composition, so it seems necessary to look for an alternative use to give value to these characteristics. In this paper a drying study is carried out in order to establish the foundations for its energy use by thermal of BSG. BSG has been used from a craft brewery located at Badajoz, Spain. Drying analysis was carried out for various temperatures and inlet air flow by means a convective dryer. The properties studied show that BSG can be used for thermal utilization in large installations, being necessary heat drying processes as a pretreatment in order to obtain a biofuel with acceptable efficiency.

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