Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering

A simplified three-dimensional mathematical model for electronic packaging cabinets was derived from physical laws. Tridimensionality resulted from the domain division in volume elements (VEs) with uniform properties, each with one temperature, and empirical and theoretical correlations allowed for modeling their energetic interaction, thus producing ordinary differential equations (ODEs) temperatures versus time system. The cabinet (2048 mm × 1974 mm × 850 mm) thermal response with one heat source was measured. Data set 1 with a 1.6-kW power source was used for model adjustment by solving an inverse problem of parameter estimation (IPPE) having the cabinet internal average air velocities as adjustment parameters. Data set 2 obtained with a 3-kW power source validated model results. The converged mesh had a total of 7500 VE. The steady-state solution took between 16 and 19 s of CPU time to reach convergence and less than 3 min to obtain the 6500-s cabinet dynamic response under variable loading conditions, in an Intel CORE i7 computer. After validation, the model was used to study the impact of heat source height on system thermal response. Fundamentally, a sharp minimum junction temperature Tjct,min = 98.5 °C was obtained in the system hot spot at an optimal heat source height, which was 25.7 °C less than the highest calculated value within the investigated range (0.1 m < zjct < 1.66 m) for the 1.6-kW power setting, which characterizes the novelty of the research, and is worth to be pursued, no matter how complex the actual cabinet design may be.

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

PurposeAs the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.Design/methodology/approachThe present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.FindingsTypical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.Originality/valueIn addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.