beam shaping
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2022 ◽  
Vol 148 ◽  
pp. 107718
Author(s):  
Yongcui Mi ◽  
Satyapal Mahade ◽  
Fredrik Sikström ◽  
Isabelle Choquet ◽  
Shrikant Joshi ◽  
...  

2021 ◽  
Author(s):  
Malte Kumkar ◽  
Myriam Kaiser ◽  
Jonas Kleiner ◽  
Daniel Flamm ◽  
Daniel Günther Grossmann ◽  
...  

With availability of high power ultra short pulsed lasers, one prerequisite towards throughput scaling demanded for industrial ultrafast laser processing was recently achieved. We will present different scaling approaches for ultrafast machining, including raster and vector based concepts. The main attention is on beam shaping for enlarged, tailored processed volume per pulse. Some aspects on vector based machining using beam shaping are discussed. With engraving of steel and full thickness modification of transparent materials, two different approaches for throughput scaling by confined interaction volume, avoiding detrimental heat accumulation, are exemplified. In Contrast, welding of transparent materials based on nonlinear absorption benefits from ultra short pulse processing in heat accumulation regime. Results on in-situ stress birefringence microscopy demonstrate the complex interplay of processing parameters on heat accumulation. With respect to process development, the potential of in-in-situ diagnostics, extended to high power ultrafast lasers and diagnostics allowing for multi-scale resolution in space and time is addressed.


Electronics ◽  
2021 ◽  
Vol 10 (23) ◽  
pp. 3029
Author(s):  
Chiara Ramella ◽  
Motahhareh Estebsari ◽  
Abbas Nasri ◽  
Marco Pirola

Microwave core-chips are highly integrated MMICs that are in charge of all the beam-shaping functions of a transmit-receive module within a phased array system. Such chips include switches, amplifiers and attenuators, phase shifters, and possibly other elements, each to be controlled by external digital signals. Given the large number of control lines to be integrated in a core-chip, the embedding of a serial to parallel interface is indispensable. Digital design in compound semiconductor technology is still rather challenging due to the absence of complementary devices and the availability of a limited number of metallization layers. Moreover, in large arrays, high chip yield and repeatability are required. This paper discusses and compares challenges and solutions for the key sub-circuits of GaAs serial to parallel converters for core-chip applications, reviewing the pros and cons of the different implementations proposed in the literature.


Author(s):  
D. Cesar ◽  
A. Anakru ◽  
S. Carbajo ◽  
J. Duris ◽  
P. Franz ◽  
...  

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Muhammad Ali Babar Abbasi ◽  
Rafay I. Ansari ◽  
Gabriel G. Machado ◽  
Vincent F. Fusco

AbstractAntenna arrays and multi-antenna systems are essential in beyond 5G wireless networks for providing wireless connectivity, especially in the context of Internet-of-Everything. To facilitate this requirement, beamforming technology is emerging as a key enabling solution for adaptive on-demand wireless coverage. Despite digital beamforming being the primary choice for adaptive wireless coverage, a set of applications rely on pure analogue beamforming approaches, e.g., in point-to-multi point and physical-layer secure communication links. In this work, we present a novel scalable analogue beamforming hardware architecture that is capable of adaptive 2.5-dimensional beam steering and beam shaping to fulfil the coverage requirements. Beamformer hardware comprises of a finite size Maxwell fisheye lens used as a scalable feed network solution for a semi-circular array of monopole antennas. This unique hardware architecture enables a flexibility of using 2 to 8 antenna elements. Beamformer development stages are presented while experimental beam steering and beam shaping results show good agreement with the estimated performance.


2021 ◽  
Vol 33 (4) ◽  
pp. 042046
Author(s):  
Alexander Laskin ◽  
Joerg Volpp ◽  
Vadim Laskin ◽  
Takuji Nara ◽  
Seong Ryol Jung
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