Design and analysis of a novel large-range 3-DOF compliant parallel micromanipulator

Compared with the traditional rigid mechanism, the flexible mechanism has more advantages, which play an important role in critical situations such as microsurgery, IC (integrated circuit) fabrication/detection, and some precision operating environment. Especially, there is an increasing need for 3-DOF (degrees-of-freedom) compliant translational micro-platform (CTMP) providing good performance characteristics with large motion range, low cross coupling, and high spatial density. Decoupled topology design of the CTMP can easily realize these merits without increasing the difficulty of controlling. This paper proposes a new three DOF compliant hybrid micromanipulator which have large range of motion up to 100 μm × 100 μm × 100 μm in the direction in the dimension of 90 mm × 90 mm × 50 mm, smaller cross-axis coupling (the max coupling only 2.5%) than the initial XY compliant platform in XY axial.

An Electronically Adjustable Waveform Generator

A novel electronically adjustable square/triangular waveform generator has been introduced in this paper. The proposed circuit employs one active element, the multi-output current-controlled current conveyor transconductance amplifier, and one passive component grounded capacitor only. The resistorless realization of the presented generator provides a good advantage in terms of integrated circuit fabrication. In the offered circuit, the frequency and amplitude of the output square wave are electronically tunable by means of relevant bias currents. Additionally, the upper and lower threshold levels are electronically controllable by the respective bias current. On the contrary, electronically adjusting of the duty cycle of output waveform is possible via the external DC current. The generator circuit is simulated with TSMC 0.18[Formula: see text][Formula: see text]m technology parameters and SPICE. Moreover, the introduced circuit is implemented by using commercially available active devices and thus it is also verified experimentally.

Aluminum Cleaning on Single Wafer Tool: A Case Study with Diluted HF

For integrated circuit fabrication on 300 mm wafers, copper interconnections cleaning is generally done with single wafer tools. In this study, we focused on the cleaning of aluminum interconnections, on single wafer tool, with a cheap and easy to use chemistry. Aluminum compatibility with diluted HF solutions was first evaluated, then short and efficient cleaning processes were developped for two kind of applications : cleaning after aluminum line etching and cleaning after final dielectric etching over the aluminum pad. It was demonstrated that cleaning efficiency was poor for the shorter process time (20 s), but improved with process time increase, highlighting a lift-off mechanism for polymers removal. Best process was achieved with 40 s of HF 0.2%, that offers a good compromise between polymer removal and lateral recess of the aluminum.

CCII-Based Nth-Order Mixed Mode Elliptic Filter with Grounded R and C

This paper presents a new nth-order elliptic filter structure with second generation current conveyor (CCII). Synthesis methodology for mixed mode odd and even order filter is proposed. The designed structure is emphasized on the basis of implementation of integrated circuit fabrication by using grounded passive components (resistors and capacitors). The proposed structure is designed for different point of interests: (i) no component constraint, (ii) the structure is compatible with equal capacitance design, which is suitable for integrated circuit fabrication, (iii) low sensitivity like LC ladder filter and (iv) nearly null group sensitivity. To validate the theory, HSPICE simulation with 0.13-μm process and BSIM level 53 model is carried with ±1.5 V power supply.