In this paper, we focus on the electroplating technology used for RF micro inductor coil. The technological parameters in DC electroplating are determined by SEM, linear sweep voltammetry and so on. It turns out that a high quality of plating layer is obtained when the PH value of electrochemical solution is 9, temperature is 45°C,current density is 1 A/dm2, additive is added and stirred slowly. Then the research on pulse electroplating is conducted on the basis of DC electroplating, and the result indicates that the pulse plating layer is of better quality compared with DC plating layer. Afterwards, surface structure and resistance of the copper layer are analyzed, demonstrating the obtained coating layer is good enough to be the main structure of micro inductor coil. In the end, this electroplating technology is applied to micro inductor coil. The simulation, fabrication, package and test of micro inductor coil are introduced briefly.