Melting and Heat Transfer Characteristics of Urea Water Solution According to a Heating Module’s Operating Conditions in a Frozen Urea Tank

The urea-selective catalytic reduction (SCR) system, a nitrogen oxide reduction device for diesel vehicles, is a catalytic system that uses urea water solution (UWS) as a reducing agent. This system has a relatively wide range of operating temperatures. However, the freezing point of the reducing urea solution used in this system is −11 °C. When the ambient temperature dips below this freezing point in winter, the solution may freeze. Therefore, it is important to understand the melting characteristics of frozen UWS in relation to the operating conditions of the heating device to supply the minimum amount of aqueous solution required by the system in the initial stage of normal operation and startup of the urea–SCR system. In this study, we artificially froze a liquid solution by placing it along with a heating module in an acrylic chamber to simulate a urea solution tank. Two types of heating modules (P120 and P160) consisting of two heating elements and heat transfer bodies were used to melt the frozen solution. The melting characteristics of the frozen solution were observed, for example, changes in the temperature distribution around the heating module and the cross-sectional melting shape with the passage of time since the start of the power supply to the heating module. The shape of melting around the heating module differed depending on the level of UWS relative to the heater inside the urea tank. In case 1, it melted in a wide shape with an open top, and in case 2, it melted in a closed shape. This shape change was attributed to the formation of internal gaseous space due to volume reduction during melting and the heat transfer characteristics of the fluid and solid substances.

Influences of Sn on Properties of Ag-Based and Cu-Based Brazing Filler Metals

Ag-based and Cu-based brazing filler metals, which are the most widely used brazing materials in industrial manufacturing, have excellent gap-filling properties and can braze almost all the metallic materials and their alloys, except for the low-melting-point metals such as Al and Mg. Therefore, Ag-based and Cu-based brazing filler metals have attracted great attention. In this review, three series of typical Ag-based filler metals: the Ag-Cu, Ag-Cu-Zn, and Ag-Cu-Zn-Sn alloys; and three series of Cu-based filler metals: the crystalline and amorphous Cu-P filler metals, as well as the Cu-Zn filler metals, were chosen as the representatives. The latest research progress on Sn-containing Ag-based and Cu-based brazing filler metals is summarized, and the influences of Sn on the melting characteristics, wettability, microstructure, and mechanical properties of the selected filler metals are analyzed. Based on these, the problems and corresponding solutions in the investigation and application of the Sn-containing Ag-based and Cu-based filler metals are put forward, and the research and development trends of these filler metals are proposed.

Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper

Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have aluminum-doped zinc oxide (AZO) and zinc oxide (ZnO) ceramics. The direct soldering process was performed without the need for flux or pre-metallization of the two transparent conductive oxides. The microstructure, phase constitution, melting characteristics, and soldering properties of the Sn8Zn3Bi1Mg active solder were investigated. The liquidus temperature of the Sn8Zn3Bi1Mg active solder was 198.6°C, which was very close to the binary Sn-Zn eutectic temperature of 198.5°C. The effect of temperature on the bonding strength of the solder joints was evaluated. The shear strengths of AZO/Cu and ZnO/Cu joints soldered with Sn8Zn3Bi1Mg active solder were 10.3 and 7.5 MPa at room temperature, respectively. Increasing the temperature from room temperature to 180°C reduced the bonding shear strengths of AZO/Cu and ZnO/Cu joints to 3.3 and 3.7 MPa, respectively.