projection optics
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2021 ◽  
Author(s):  
Yanqiu Li ◽  
Enze Li ◽  
Ke Liu ◽  
Yiyu Sun ◽  
yang liu ◽  
...  

2020 ◽  
Vol 40 (15) ◽  
pp. 1522002
Author(s):  
孙生生 Sun Shengsheng ◽  
王丹 Wang Dan ◽  
齐月静 Qi Yuejing ◽  
宗明成 Zong Mingcheng
Keyword(s):  

2019 ◽  
Vol 18 (1) ◽  
pp. 373-379
Author(s):  
Qiongyan Yuan ◽  
Xiangzhao Wang ◽  
Zicheng Qiu

2018 ◽  
Vol 26 (25) ◽  
pp. 32743 ◽  
Author(s):  
Enze Li ◽  
Yanqiu Li ◽  
Naiyuan Sheng ◽  
Tie Li ◽  
Yiyu Sun ◽  
...  

2018 ◽  
Vol 2018 (1) ◽  
pp. 000488-000493 ◽  
Author(s):  
Yoshio GOTO ◽  
Kosuke URUSHIHARA ◽  
Bunsuke TAKESHITA ◽  
Ken-Ichiro MORI

Abstract In Fan-out Wafer Level Packaging (FOWLP) processes, redistribution layer (RDL) line width reduction is a key challenge to expand the FOWLP market to multi-chip interconnections, including interconnections between SoC and DRAM, split-die connection of FPGA, and interconnections between image sensors and SoC. Next generation FOWLP requires 1.0 μm RDL and future FOWLP is targeting 0.8 μm RDL. To meet these requirements, Canon has developed new projection optics with a high NA and wide-field that is best suited for sub-micron FOWLP. These projection optics are a new option for FPA-5520iV steppers, offering NA 0.24 imaging and a 52 × 34 mm exposure field. FPA-5520iV steppers with NA 0.24 provide excellent 0.8 μm resolution performance throughout all imaging fields thanks to Canon's wave-front aberration based projection optics manufacturing methods and on-axis optical tilt focus sensor.


Author(s):  
Mark A. van de Kerkhof ◽  
Uwe Zeitner ◽  
Torsten Feigl ◽  
Stefan Bäumer ◽  
Robbert Jan Voogd ◽  
...  
Keyword(s):  

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