Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
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Recent progress in compact thermal models

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194376 ◽

2003 ◽

Cited By ~ 18

Author(s):

C.J.M. Lasance

Keyword(s):

Recent Progress ◽

Thermal Models

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Through the substrate, backside thermal measurements on active semiconductor devices using near IR thermoreflectance

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194373 ◽

2003 ◽

Cited By ~ 5

Author(s):

J. Christofferson ◽

A. Shakouri

Keyword(s):

Semiconductor Devices ◽

Near Ir ◽

Thermal Measurements

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Steady state model of a loop heat pipe (LHP) with coherent porous silicon (CPS) wick in the evaporator

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194344 ◽

2003 ◽

Cited By ~ 2

Author(s):

M. Hamdan ◽

F.M. Gerner ◽

H.T. Henderson

Keyword(s):

Steady State ◽

Porous Silicon ◽

Heat Pipe ◽

State Model ◽

Loop Heat Pipe ◽

Steady State Model

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Numerical prediction of electronic component heat transfer: an industry perspective

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194334 ◽

2003 ◽

Cited By ~ 11

Author(s):

V. Eveloy ◽

P. Rodgers ◽

M.S.J. Hashmi

Keyword(s):

Heat Transfer ◽

Numerical Prediction ◽

Electronic Component

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Air-cooling extension - performance limits for processor cooling applications

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194342 ◽

2003 ◽

Cited By ~ 12

Author(s):

L. Sauciuc ◽

G. Chrysler ◽

R. Mahajan ◽

M. Szleper

Keyword(s):

Air Cooling ◽

Performance Limits

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Conjugate heat transfer measurements for air-cooled electronics - a new experimental method

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194362 ◽

2003 ◽

Author(s):

R. Teertstra ◽

J.R. Urbanski ◽

J.R. Culham

Keyword(s):

Heat Transfer ◽

Experimental Method ◽

Conjugate Heat Transfer

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Electro-thermal simulation for the prediction of chip operation within the package

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194357 ◽

2003 ◽

Cited By ~ 13

Author(s):

M. Rencz ◽

V. Szekely ◽

A. Poppe ◽

K. Torki ◽

B. Courtois

Keyword(s):

Thermal Simulation

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Modelling the effect of temperature on product reliability

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194380 ◽

2003 ◽

Cited By ~ 8

Author(s):

C. Bailey

Keyword(s):

Effect Of Temperature ◽

Product Reliability

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Measurement of vapor chamber performance [heatsink applications]

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194361 ◽

2003 ◽

Cited By ~ 8

Author(s):

J. Wei ◽

A. Chan ◽

D. Copeland

Keyword(s):

Vapor Chamber

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Multi-objective design of liquid cooled power electronic modules for transient operation

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. ◽

10.1109/stherm.2003.1194365 ◽

2003 ◽

Cited By ~ 4

Author(s):

P.R. Kaczorowski ◽

Y. Joshi ◽

S. Azarm

Keyword(s):

Power Electronic ◽

Transient Operation ◽

Multi Objective

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Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Recent progress in compact thermal models

Through the substrate, backside thermal measurements on active semiconductor devices using near IR thermoreflectance

Steady state model of a loop heat pipe (LHP) with coherent porous silicon (CPS) wick in the evaporator

Numerical prediction of electronic component heat transfer: an industry perspective

Air-cooling extension - performance limits for processor cooling applications

Conjugate heat transfer measurements for air-cooled electronics - a new experimental method

Electro-thermal simulation for the prediction of chip operation within the package

Modelling the effect of temperature on product reliability

Measurement of vapor chamber performance [heatsink applications]

Multi-objective design of liquid cooled power electronic modules for transient operation

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
Latest Publications