2012 IEEE 62nd Electronic Components and Technology Conference
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9781467319652, 9781467319669, 9781467319645
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Interlayer dielectric cracking in back end of line (BEOL) stack

2012 ◽  
Author(s):  
Sathyanarayanan Raghavan ◽  
Ilko Schmadlak ◽  
Suresh K. Sitaraman
Keyword(s):  
Interlayer Dielectric

Characterization of Al wire wedge bonding in power electronics package

2012 ◽  
Author(s):  
Yumin Liu ◽  
Yong Liu ◽  
Daren Keller ◽  
Suresh Belani ◽  
Michael Dube
Keyword(s):  
Power Electronics ◽  
Wedge Bonding

Metrology and inspection rquirements for 3D stacking of ICs

2012 ◽  
Author(s):  
Sandip Halder ◽  
Andy Miller ◽  
Mireille Maenhoudt ◽  
Gerald Beyer ◽  
Bart Swinnen ◽  
...  
Keyword(s):  
3D Stacking

Design and process development of a stacked SRAM memory chip module with TSV interconnection

2012 ◽  
Author(s):  
Shenglin Ma ◽  
Xin Sun ◽  
Yunhui Zhu ◽  
Zhiyuan Zhu ◽  
Qinghu Cui ◽  
...  
Keyword(s):  
Process Development ◽  
Memory Chip ◽  
Sram Memory
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