Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE Comput. Soc. Press

0818627255

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Delay macromodels for point-to-point MCM interconnections

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201452 ◽

2003 ◽

Cited By ~ 1

Author(s):

A.I. Kayssi ◽

K.A. Sakallah

Keyword(s):

Point To Point

Download Full-text

IBM ES/9000 buried engineering change modeling for verification (MCM)

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201476 ◽

2003 ◽

Cited By ~ 1

Author(s):

C.R. Selinger ◽

C.K. Vakirtzis

Keyword(s):

Engineering Change

Download Full-text

Analysis of MCMs using asymptotic waveform evaluation (AWE)

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201444 ◽

2003 ◽

Cited By ~ 2

Author(s):

M.M. Alaybeyi ◽

J.E. Bracken ◽

J.Y. Lee ◽

V. Raghavan ◽

R.J. Trihy ◽

...

Keyword(s):

Waveform Evaluation ◽

Asymptotic Waveform Evaluation

Download Full-text

An integrated approach for electrical performance analysis of multichip modules

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201455 ◽

2003 ◽

Cited By ~ 2

Author(s):

J.C. Liao ◽

G.N. Choksi

Keyword(s):

Performance Analysis ◽

Integrated Approach ◽

Electrical Performance ◽

Multichip Modules

Download Full-text

Trends in processor and system design and the interaction with advanced packaging

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201431 ◽

2003 ◽

Cited By ~ 1

Author(s):

J.L. Hennessy

Keyword(s):

System Design ◽

Advanced Packaging

Download Full-text

Fully integrated silicon based optical motherboards

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201470 ◽

2003 ◽

Author(s):

D. Godfrey ◽

S. Bailey ◽

K. Cooper ◽

M. Nield ◽

J. Hill ◽

...

Keyword(s):

Fully Integrated ◽

Silicon Based

Download Full-text

Pade approximation applied to transient simulation of lossy coupled transmission lines

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201445 ◽

2003 ◽

Cited By ~ 12

Author(s):

S. Lin ◽

E.S. Kuh

Keyword(s):

Transmission Lines ◽

Padé Approximation ◽

Transient Simulation ◽

Pade Approximation ◽

Coupled Transmission Lines

Download Full-text

Applications of multichip modules for high speed communications interfaces

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201435 ◽

2003 ◽

Cited By ~ 3

Author(s):

A. Kozak

Keyword(s):

High Speed ◽

Multichip Modules

Download Full-text

Yield modeling of MCM assembly with flip-chip thermocompression bondings

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201449 ◽

2003 ◽

Cited By ~ 1

Author(s):

S.-Y. Kang ◽

Y.C. Lee

Keyword(s):

Flip Chip ◽

Yield Modeling

Download Full-text

Characteristics of thin-film devices for a stack-type MCM

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201474 ◽

2003 ◽

Cited By ~ 5

Author(s):

S. Takahashi ◽

Y. Hayashi ◽

T. Kunio ◽

N. Endo

Keyword(s):

Thin Film ◽

Thin Film Devices

Download Full-text

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE Comput. Soc. Press

Delay macromodels for point-to-point MCM interconnections

IBM ES/9000 buried engineering change modeling for verification (MCM)

Analysis of MCMs using asymptotic waveform evaluation (AWE)

An integrated approach for electrical performance analysis of multichip modules

Trends in processor and system design and the interaction with advanced packaging

Fully integrated silicon based optical motherboards

Pade approximation applied to transient simulation of lossy coupled transmission lines

Applications of multichip modules for high speed communications interfaces

Yield modeling of MCM assembly with flip-chip thermocompression bondings

Characteristics of thin-film devices for a stack-type MCM

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
Latest Publications