2016 China Semiconductor Technology International Conference (CSTIC)
Latest Publications

TOTAL DOCUMENTS

198

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467388047

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Photolithography study for high-density integration technologies

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7464058 ◽

2016 ◽

Cited By ~ 1

Author(s):

Hiromi Suda ◽

Masaki Mizutani ◽

Shin-Ichiro Hirai ◽

Ken-Ichiro Mori ◽

Seiya Miura

Keyword(s):

High Density

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OPC convergence improvement by matrix OPC solver on high MEEF contact layer

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7463987 ◽

2016 ◽

Author(s):

Wanjuan Zhang

Keyword(s):

Contact Layer

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No clean material for advance packaging assembly

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7464050 ◽

2016 ◽

Cited By ~ 1

Author(s):

SzePei Lim ◽

Maria Durham ◽

Andy Mackie

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Miniaturization of system in package for wearable devices using copper pillar solder flip chip interconnects

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7464061 ◽

2016 ◽

Author(s):

Kelvin Pun ◽

Amandeep Singh ◽

M. N. Islam

Keyword(s):

Flip Chip ◽

Wearable Devices

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Metal contamination control and reduction in plasma etching

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7464006 ◽

2016 ◽

Author(s):

Xingjian Chen ◽

Xiao-Ming He ◽

Bryan Pu

Keyword(s):

Plasma Etching ◽

Metal Contamination ◽

Contamination Control

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AFORS-HET simulation study of HIT solar cells: Significance of inversion layer

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7463931 ◽

2016 ◽

Author(s):

Lifei Yang ◽

Fengqin He ◽

Lu Zheng ◽

Zhi Zhang ◽

Pengbo Ma ◽

...

Keyword(s):

Solar Cells ◽

Simulation Study ◽

Inversion Layer

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Image-based overlay mark shrinkage study for advanced technology node

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7464064 ◽

2016 ◽

Author(s):

Nan-Nan Zhang ◽

Man-Hua Shen ◽

Yi-Shih Lin

Keyword(s):

Advanced Technology ◽

Technology Node

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Etch process optimization of top electrode of 1T1R RRAM

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7463998 ◽

2016 ◽

Author(s):

Pan-pan Liu ◽

Yi-ying Zhang ◽

Hai-yang Zhang

Keyword(s):

Process Optimization

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Void-free underfill encapsulation for flip chip high voltage LED packaging

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7463954 ◽

2016 ◽

Cited By ~ 1

Author(s):

Andrew W. Shang ◽

Xing Qiu ◽

Jeffery C. C. Lo ◽

S. W. Ricky Lee ◽

Fred F. Le

Keyword(s):

High Voltage ◽

Flip Chip

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Challenges and solutions in 2X nand contact structure

2016 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2016.7463994 ◽

2016 ◽

Author(s):

Rong-Yao Chang ◽

Yi-Ying Zhang ◽

Hai-Yang Zhang

Keyword(s):

Contact Structure

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2016 China Semiconductor Technology International Conference (CSTIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Photolithography study for high-density integration technologies

OPC convergence improvement by matrix OPC solver on high MEEF contact layer

No clean material for advance packaging assembly

Miniaturization of system in package for wearable devices using copper pillar solder flip chip interconnects

Metal contamination control and reduction in plasma etching

AFORS-HET simulation study of HIT solar cells: Significance of inversion layer

Image-based overlay mark shrinkage study for advanced technology node

Etch process optimization of top electrode of 1T1R RRAM

Void-free underfill encapsulation for flip chip high voltage LED packaging

Challenges and solutions in 2X nand contact structure

2016 China Semiconductor Technology International Conference (CSTIC)
Latest Publications