Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97

Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656468 ◽

2002 ◽

Author(s):

F. Ansorge ◽

K.-F. Becker ◽

R. Ehrlich ◽

G. Azdasht ◽

V. Bader ◽

...

Keyword(s):

Recent Progress ◽

Bga Packages

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Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656480 ◽

2002 ◽

Cited By ~ 2

Author(s):

X. Wang ◽

Y. Wang ◽

G. Chen ◽

J. Liu ◽

Z. Lai

Keyword(s):

Quantitative Estimate ◽

Conductive Particles

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Conductive adhesive materials for lead solder replacement

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656476 ◽

2002 ◽

Cited By ~ 1

Author(s):

K. Suzuki ◽

O. Suzuki ◽

M. Komagata

Keyword(s):

Conductive Adhesive ◽

Adhesive Materials

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High frequency measurements and simulations on wire-bonded modules on the sequential build-up boards (SBU)

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656483 ◽

2002 ◽

Author(s):

R. Sihlbom ◽

M. Dernevik ◽

M. Lindgren ◽

P. Starski ◽

Z. Lai ◽

...

Keyword(s):

High Frequency ◽

Frequency Measurements

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Equipment for placement and bonding

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656498 ◽

2002 ◽

Author(s):

F. Rusander

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A low temperature interconnection method for electronics assembly

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656475 ◽

2002 ◽

Cited By ~ 2

Author(s):

K. Kulojarvi ◽

J.K. Kivilahti

Keyword(s):

Low Temperature ◽

Electronics Assembly

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A fully additive, polymeric process for the fabrication and assembly of substrate and component level packaging

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656473 ◽

2002 ◽

Cited By ~ 3

Author(s):

C. Gallagher ◽

P. Gandhi ◽

G. Matijasevic

Keyword(s):

Component Level

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Finite element modeling of printed circuit board for structural analysis

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656471 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Lee

Keyword(s):

Finite Element ◽

Structural Analysis ◽

Finite Element Modeling ◽

Printed Circuit Board ◽

Circuit Board ◽

Element Modeling ◽

Printed Circuit

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FE-simulation for polymeric packaging materials

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656484 ◽

2002 ◽

Cited By ~ 7

Author(s):

R. Dudek ◽

M. Scherzer ◽

A. Schubert ◽

B. Michel

Keyword(s):

Fe Simulation ◽

Packaging Materials

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Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97 ◽

10.1109/pep.1997.656499 ◽

2002 ◽

Cited By ~ 2

Author(s):

J. Lau ◽

C. Chang ◽

R. Chen

Keyword(s):

Flip Chip ◽

Electrical Performance ◽

Underfill Encapsulant

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Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97
Latest Publications

TOTAL DOCUMENTS

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Published By IEEE

Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter

Conductive adhesive materials for lead solder replacement

High frequency measurements and simulations on wire-bonded modules on the sequential build-up boards (SBU)

Equipment for placement and bonding

A low temperature interconnection method for electronics assembly

A fully additive, polymeric process for the fabrication and assembly of substrate and component level packaging

Finite element modeling of printed circuit board for structural analysis

FE-simulation for polymeric packaging materials

Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

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Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Recent progress in flexible moulding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter

Conductive adhesive materials for lead solder replacement

High frequency measurements and simulations on wire-bonded modules on the sequential build-up boards (SBU)

Equipment for placement and bonding

A low temperature interconnection method for electronics assembly

A fully additive, polymeric process for the fabrication and assembly of substrate and component level packaging

Finite element modeling of printed circuit board for structural analysis

FE-simulation for polymeric packaging materials

Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging PEP 97 (Cat No 97TH8268) PEP-97
Latest Publications