Moisture Sensitivity of Plastic Packages of IC Devices
Latest Publications

TOTAL DOCUMENTS

21

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By Springer US

9781441957184, 9781441957191

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_12 ◽

2010 ◽

pp. 301-331

Author(s):

H.B. Chew ◽

T.F. Guo ◽

L. Cheng

Download Full-text

Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_4 ◽

2010 ◽

pp. 91-112 ◽

Author(s):

X. J. Fan ◽

T.Y. Tee ◽

X.Q. Shi ◽

B. Xie

Keyword(s):

Vapor Pressure ◽

Moisture Diffusion ◽

Plastic Packages

Download Full-text

Moisture-Driven Electromigrative Degradation in Microelectronic Packages

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_20 ◽

2010 ◽

pp. 503-522 ◽

Author(s):

L.F. Siah

Keyword(s):

Microelectronic Packages

Download Full-text

Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_2 ◽

2010 ◽

pp. 29-69 ◽

Author(s):

M. H. Shirangi ◽

B. Michel

Keyword(s):

Moisture Diffusion ◽

Molding Compounds ◽

Hygroscopic Swelling

Download Full-text

Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_14 ◽

2010 ◽

pp. 359-388

Author(s):

J.K. Fauty

Keyword(s):

Moisture Sensitivity ◽

Sensitivity Level

Download Full-text

Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_15 ◽

2010 ◽

pp. 389-409 ◽

Author(s):

M.S. Zhang ◽

S.W.R. Lee ◽

X.J. Fan

Download Full-text

Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_11 ◽

2010 ◽

pp. 279-299 ◽

Author(s):

X.J. Fan ◽

J. Zhou ◽

G.Q. Zhang ◽

A. Chandra

Keyword(s):

Continuum Theory

Download Full-text

Underfill Selection Against Moisture in Flip Chip BGA Packages

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_17 ◽

2010 ◽

pp. 435-460 ◽

Author(s):

X.J. Fan ◽

T.Y. Tee ◽

C.Q. Cui ◽

G.Q. Zhang

Keyword(s):

Flip Chip ◽

Download Full-text

Real-Time Characterization of Moisture Absorption and Desorption

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_3 ◽

2010 ◽

pp. 71-89 ◽

Author(s):

Y. He ◽

X.J. Fan

Keyword(s):

Real Time ◽

Moisture Absorption

Download Full-text

Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation

Moisture Sensitivity of Plastic Packages of IC Devices ◽

10.1007/978-1-4419-5719-1_21 ◽

2010 ◽

pp. 523-549 ◽

Author(s):

H. Fan ◽

E.K.L. Chan ◽

M.M.F. Yuen

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Experimental Evaluation ◽

Moisture Diffusion ◽

Dynamics Simulation

Download Full-text