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Electrical Performance of Electronic Packaging EPEP-04
Latest Publications
TOTAL DOCUMENTS
118
(FIVE YEARS 0)
H-INDEX
8
(FIVE YEARS 0)
Published By IEEE
0780386671
Latest Documents
Most Cited Documents
Contributed Authors
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Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Electrical validation of source synchronous chip-chip server links at 6.25 Gb/s
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407579
◽
2005
◽
Author(s):
K.S. Canagasaby
◽
S. Chaudhuri
◽
S. Dabral
Keyword(s):
Chip Chip
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Increased feedback due to package mounting
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407543
◽
2005
◽
Cited By ~ 3
Author(s):
P.H. Aaen
◽
J.A. Pla
◽
C.A. Balanis
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A comparison of performance potentials of single ended vs. differential signaling
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407580
◽
2005
◽
Cited By ~ 1
Author(s):
Zhaoqing Chen
◽
G. Katopis
Keyword(s):
Performance Potentials
◽
Differential Signaling
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Can we ever send 25-100 Gb/sec signals over 24" line length of printed circuit board and still have mVolt signal at the receiver?
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407531
◽
2005
◽
Cited By ~ 3
Author(s):
B.K. Bhattacharyya
◽
M. Runstein
Keyword(s):
Printed Circuit Board
◽
Line Length
◽
Circuit Board
◽
Printed Circuit
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Application of the enlarged cell method (ECM) to EMI/EMC problems
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407626
◽
2005
◽
Author(s):
Tian Xiao
◽
Qing Huo Liu
◽
Jiangqi He
Keyword(s):
Cell Method
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Modeling and mitigating AC common mode conversion in multi-Gb/s differential printed circuit boards
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407536
◽
2005
◽
Cited By ~ 10
Author(s):
H. Heck
◽
S. Hall
◽
B. Horine
◽
T. Liang
Keyword(s):
Printed Circuit Boards
◽
Mode Conversion
◽
Circuit Boards
◽
Common Mode
◽
Printed Circuit
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Power distribution analysis for IBM eServer system integration optimization
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407581
◽
2005
◽
Cited By ~ 2
Author(s):
A. Huber
◽
Tingdong Zhou
◽
W.D. Becker
◽
R. Weekly
◽
E. Klink
Keyword(s):
Power Distribution
◽
System Integration
◽
Distribution Analysis
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Simulation of coupled interconnects using waveform relaxation and transverse partitioning
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407535
◽
2005
◽
Cited By ~ 5
Author(s):
N. Nakhla
◽
A. Ruehli
◽
M. Nakhla
◽
R. Achar
Keyword(s):
Waveform Relaxation
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Broadband characterization of miniaturized on-chip differential circuits using G-S-G probe
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407567
◽
2005
◽
Author(s):
Hung-Tat Tso
◽
Chien-Nan Kuo
Keyword(s):
Differential Circuits
◽
On Chip
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Power delivery modeling and design methodology for a programmable logic device package
Electrical Performance of Electronic Packaging EPEP-04
◽
10.1109/epep.2004.1407561
◽
2005
◽
Cited By ~ 4
Author(s):
A. Pannikkat
◽
J. Long
◽
Jin Zhao
Keyword(s):
Design Methodology
◽
Power Delivery
◽
Programmable Logic
◽
Logic Device
◽
Programmable Logic Device
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